Force sensor with target on semiconductor package

Patent metadata

Field	Value
Publication number	US-12339159-B2
Application number	US-202217850566-A
Country	US
Kind code	B2
Filing date	Jun 27, 2022
Priority date	Jun 28, 2021
Publication date	Jun 24, 2025
Grant date	Jun 24, 2025

Abstract

A force sensor has a sensing system including a target piece and a sensing element, configured to provide changes of a magnetic field, being generated by motion of the target piece. The sensing element senses these changes and provides a signal representative of the position of the target piece. An integrated circuit with processing means can process signals from the sensing element. A semiconductor package includes at least the integrated circuit. A flexible piece includes the target, and it is attached to the semiconductor package. The attachment area between the flexible piece and the semiconductor package does not extend beyond the top projection, or outline, of the semiconductor package. The flexible piece receives a force stimulus, so that upon exerting a force on the flexible piece, the displacement of the target piece with respect to the surface of the semiconductor package can be sensed by the sensing element.

First claim

The invention claimed is:

1. A force sensor comprising:
a flexible piece provided with a target piece,
a sensing element configured to sense changes of a magnetic field from motion of the target piece with respect to the sensing element, the sensing element being configured to provide a signal representative of a position of the target piece,
an integrated circuit configured for processing signals from the sensing element,
a semiconductor package comprising a mold covering, partially or totally, the integrated circuit wherein a top projection of the semiconductor package forms an outline,
wherein the flexible piece is provided on and attached to the mold of the semiconductor package, an attachment area between the flexible piece and the semiconductor package being smaller than or equal to the outline of the semiconductor package, the flexible piece being arranged for receiving a force stimulus, so that upon exerting a force on the flexible piece, deformation of the flexible piece provides displacement of the target piece with respect to the sensing element that can be sensed by the sensing element.

2. The sensor of claim 1 wherein the semiconductor package comprises a surface facing away from the integrated circuit and wherein the flexible piece is deposited or adhered to the surface of the semiconductor package.

3. The sensor of claim 1 wherein the semiconductor package has a planar shape with a lateral projection with lower area than a top projection of the semiconductor package.

4. The sensor of claim 1 , wherein the flexible piece is attached to that semiconductor package without extending beyond the top projection.

5. The sensor of claim 1 wherein the sensing element is a Hall effect-based position sensing element and the target piece is a magnetic target piece.

6. The sensor of claim 1 wherein the sensing element is an inductive sensing element and the target piece is a conductive target piece.

7. The sensor of claim 1 wherein the target piece is a metallic sheet embedded in or provided on the flexible piece.

8. The sensor of claim 1 wherein the target piece is a rigid target piece with less flexibility than the flexible piece so that the force stimulus on the target piece deforms the flexible piece.

9. The sensor of claim 1 wherein the target piece has a predetermined shape with a largest dimension in the top projection, the semiconductor package has a largest dimension in the top projection, and wherein a ratio between said dimension of the semiconductor package and said dimension of the target piece is 1.5 or larger.

10. The sensor of claim 1 , wherein the sensing element is provided between the integrated circuit and the target piece.

11. The sensor of claim 1 wherein the sensing element is adjacent to the integrated circuit.

12. The sensor of claim 1 wherein the sensing element is integrated in the integrated circuit.

13. A sensor assembly comprising the force sensor of claim 1 wherein the integrated circuit is further adapted to provide readout signals based on the processed signals from the sensing element, further comprising a support structure, wherein the force sensor is provided on the support structure including connections for rerouting readout signals generated in the force sensor to an external output.

Assignees

• Melexis Tech Sa

Inventors

• Dupre Nicolas
• Close Gael
• Le Signor Theo
• Vangerven Tim

Classifications

• G01R33/072

  Constructional adaptation of the sensor to specific applications · CPC title

• G01R33/0047

  Housings or packaging of magnetic sensors (packaging of semiconductor devices H10W99/00); Holders · CPC title

• G01L1/122

  by using permanent magnets · CPC title

• G01L1/04

  by measuring elastic deformation of gauges, e.g. of springs · CPC title

• A47J42/44

  Automatic starting or stopping devices (bag clamps with means for actuating switches A47J42/40); Warning devices · CPC title