Seamless steel pipe and method of manufacture thereof

US12338942B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12338942-B2
Application numberUS-202118020458-A
CountryUS
Kind codeB2
Filing dateJul 21, 2021
Priority dateAug 19, 2020
Publication dateJun 24, 2025
Grant dateJun 24, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A seamless steel pipe has a t/D out of 0.05 to 0.40, where t is a wall thickness (mm) of the seamless steel pipe, and D out is an outside diameter (mm) of the seamless steel pipe. The seamless steel pipe has a maximum depth d max (mm)≤0.350 mm for defects in an inner surface of the steel pipe on a cross section perpendicular to a pipe axis. The seamless steel pipe has an average defect depth d ave (mm)≤0.200 mm for defects having a depth of 0.050 mm or more in the inner surface of the steel pipe. The seamless steel pipe, per millimeter of an inner circumferential length of the pipe, has at most 30 defects having a depth of 0.050 mm or more in the inner surface of the steel pipe.

First claim

Opening claim text (preview).

The invention claimed is: 1. A seamless steel pipe having: a t/D out of 0.05 to 0.40, where t is a wall thickness (mm) of the seamless steel pipe, and D out is an outside diameter (mm) of the seamless steel pipe, a maximum depth d max (mm)≤0.350 for defects in an inner surface of the seamless steel pipe in a cross section of the seamless steel pipe perpendicular to a pipe axis, an average defect depth d ave (mm)≤0.200 for defects having a depth of 0.050 mm or more in the inner surface of the seamless steel pipe, per millimeter of an inner circumferential length of the seamless steel pipe, at most 30 defects having a depth of 0.050 mm or more in the inner surface of the seamless steel pipe, a chemical composition comprising, in mass %: C: 0.05 to 0.45%, Si: 0.05 to 0.45%, Mn: 0.05 to 1.2%, and Cr: less than 4.5%, and a microstructure comprising ferrite grains having an average grain size of 15 μm or less. 2. The seamless steel pipe according to claim 1 , having a microstructure comprising: prior austenite grains having an average grain size of 15 μm or more. 3. The seamless steel pipe according to claim 1 , wherein the chemical composition further comprises, in mass %, one or more selected from the group consisting of: Ni: 0.5% or less, Mo: 1.5% or less, W: 2.5% or less, N: 0.10% or less, and B: 0.010% or less. 4. A method for manufacturing the seamless steel pipe of claim 1 , the method comprising: subjecting a steel billet to pierce rolling, wall-thickness reduction and stretch rolling to form a steel pipe; and sizing the steep pipe according to the following formula (1): ( D ini −D out ) 2 ×t 0 2 ×GD 2 ≤9980  (1), where: GD is an average grain size (mm) of austenite before sizing, D ini is a steel pipe outside diameter (mm) before sizing, D out is a steel pipe outside diameter (mm) after sizing, and t 0 is a wall thickness (mm) before sizing, thereby producing the seamless steel pipe of claim 1 . 5. A method for manufacturing the seamless steel pipe of claim 2 , the method comprising: subjecting a steel billet to pierce rolling, wall-thickness reduction and stretch rolling to form a steel pipe; and sizing the steep pipe according to the following formula (1): ( D ini −D out ) 2 ×t 0 2 ×GD 2 ≤9980  (1), where: GD is an average grain size (mm) of austenite before sizing, D ini is a steel pipe outside diameter (mm) before sizing, D out is a steel pipe outside diameter (mm) after sizing, and t 0 is a wall thickness (mm) before sizing, to produce the seamless steel pipe of claim 2 . 6. A method for manufacturing the seamless steel pipe of claim 3 , the method comprising: subjecting a steel billet to pierce rolling, wall-thickness reduction and stretch rolling to form a steel pipe; and sizing the steep pipe according to the following formula (1): ( D ini −D out ) 2 ×t 0 2 ×GD 2 ≤9980  (1), where: GD is an average grain size (mm) of austenite before sizing, D ini is a steel pipe outside diameter (mm) before sizing, D out is a steel pipe outside diameter (mm) after sizing, and t 0 is a wall thickness (mm) before sizing, to produce the seamless steel pipe of claim 3 . 7. The method according to claim 4 , further comprising: subjecting the sized steel pipe to a heat treatment at a heating temperature in a range of 850 to 1,150° C. with at least 10 minutes of soaking retention time. 8. The method according to claim 5 , further comprising: subjecting the sized steel pipe to a heat treatment at a heating temperature in a range of 850 to 1,150° C. with at least 10 minutes of soaking retention time. 9. The method according to claim 6 , further comprising: subjecting the sized steel pipe to a heat treatment at a heating temperature in a range of 850 to 1,150° C. with at least 10 minutes of soaking retention time.

Assignees

Inventors

Classifications

  • C21D8/10Primary

    during manufacturing of tubular bodies · CPC title

  • Rolling basic material of solid, i.e. non-hollow, structure; Piercing {, e.g. rotary piercing mills} · CPC title

  • with molybdenum or tungsten · CPC title

  • containing N · CPC title

  • with molybdenum or tungsten · CPC title

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What does patent US12338942B2 cover?
A seamless steel pipe has a t/D out of 0.05 to 0.40, where t is a wall thickness (mm) of the seamless steel pipe, and D out is an outside diameter (mm) of the seamless steel pipe. The seamless steel pipe has a maximum depth d max (mm)≤0.350 mm for defects in an inner surface of the steel pipe on a cross section perpendicular to a pipe axis. The seamless steel pipe has an average defect depth…
Who is the assignee on this patent?
Jfe Steel Corp
What technology area does this patent fall under?
Primary CPC classification C21D8/10. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jun 24 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).