Additive manufacturing of active devices using dielectric, conductive and magnetic materials
US-10254499-B1 · Apr 9, 2019 · US
US12337525B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12337525-B2 |
| Application number | US-201716349773-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 13, 2017 |
| Priority date | Nov 22, 2016 |
| Publication date | Jun 24, 2025 |
| Grant date | Jun 24, 2025 |
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The invention provides a method for 3D printing a 3D item, the method comprising providing 3D printable material ( 201 ) and printing during a printing stage said 3D printable material ( 201 ), wherein the 3D printable material ( 201 ) comprises a thermoplastic material, to provide said 3D item, wherein the 3D item comprises an item surface, wherein the method further comprises providing a powder coating with a powder coating device ( 595 ) on at least part of said item surface during a coating stage. The invention also relates to the item manufactured by such method and to the manufacturing apparatus ( 500 ) used.
Opening claim text (preview).
The invention claimed is: 1. A method for 3D printing a 3D item onto a substrate by means of fused deposition modeling using a 3D printable material that comprises a thermoplastic material, wherein the method comprises: a preliminary coating process during which a treated substrate is obtained by applying powder to at least part of the substrate; a printing stage during which the 3D printable material is printed using a fused deposition modeling printer to provide the 3D item onto the treated substrate, wherein the 3D item comprises an item surface, and wherein the method further comprises a coating stage during which a powder coating is provided with a powder coating process on at least part of the item surface; and wherein the printing stage comprises providing said 3D item with said item surface comprising a non-planar substructure, having a maximum substructure height (tsub), with superimposed on the non-planar substructure a fused deposition modeling related step structure having tops and bottoms, wherein the coating stage comprises providing said powder coating on said non-planar substructure with a powder coating thickness variation relative to the bottoms being equal to or smaller than the maximum substructure height (tsub) to enable the substructure to remain visible. 2. The method according to claim 1 , wherein the powder coating process comprises providing a coating material to said item surface, and wherein said coating material comprises a thermosetting polymer. 3. The method according to claim 2 , wherein the coating material comprises radiation curable material, and wherein the coating stage comprises providing said coating material to said surface and curing said coating material by providing curing radiation. 4. The method according to claim 2 , wherein the coating material comprises a thermally curable material having a curing temperature lower than one or more of a melting temperature and a glass temperature of said thermoplastic material. 5. The method according to claim 1 , wherein said 3D printable material has electrically conductive properties, and wherein the printing stage comprises printing said 3D printable material such that it provides at least part of said item surface of the 3D item. 6. The method according to claim 5 , wherein the printable material comprises an additive for providing a surface resistivity of equal to or less than 10 9 ohm/square. 7. The method according to claim 1 , wherein the coating stage also includes providing an electrically conductive layer to said item surface before providing said powder coating. 8. The method according to claim 1 , wherein a first 3D printable material has electrically conductive properties and wherein a second 3D printable material has electrically isolating properties, and wherein the printing stage comprises printing said first 3D printable material such that it provides at least part of said item surface of the 3D item, and printing said second 3D printable material for those part(s) of the 3D item that are not based on said first 3D printable material. 9. The method according to claim 1 , wherein the printing stage comprises providing said 3D item with said item surface comprising a non-planar substructure with superimposed on the non-planar substructure a fused deposition modeling related step structure having tops and bottoms, the tops having rib heights (t rib ) relative to the bottoms, wherein the coating stage comprises providing said powder coating on said non-planar substructure with a maximum coating thickness (t high ) relative to a lowest bottom of the non-planar substructure, with a ratio of the maximum coating thickness (t high ) to the rib heights (t rib ) selected from the range of 1<t high /t rib ≤1.2. 10. The method of claim 1 wherein the preliminary coating process produces an electrically conductive layer on the treated substrate. 11. The method of claim 1 wherein said applying powder step comprises using a corona gun. 12. The method of claim 1 wherein said non-planar substructure includes one or more curved sections on the surface and the step structure having three or more steps with height differences; and wherein the non-planar substructure has a height difference larger that a height difference between two respective steps. 13. The method according to claim 1 , wherein the printing stage comprises providing said 3D item with said item surface comprising a non-planar substructure with superimposed on the non-planar substructure a fused deposition modeling related step structure having tops and bottoms, the tops having rib heights (trib) relative to the bottoms, wherein the coating stage comprises providing said powder coating on said non-planar substructure with a maximum coating thickness (thigh) relative to a lowest bottom of the non-planar substructure, and a minimum coating thickness (tlow) relative to a highest top of the non-planar substructure, with a ratio of the maximum coating thickness (thigh) to the minimum coating thickness (tlow) selected such thigh/tlow is higher than 5 to allow the substructure to remain visible. 14. A method for 3D printing a 3D item onto a substrate by means of fused deposition modeling using a 3D printable material that comprises a thermoplastic material, wherein the method comprises: a printing stage during which the 3D printable material is printed using a fused deposition modeling printer to provide the 3D item onto the treated substrate, wherein the 3D item comprises an item surface, and wherein the method further comprises a coating stage during which a powder coating is provided with a powder coating process on at least part of the item surface; and wherein the printing stage comprises providing said 3D item with said item surface comprising a plurality of curved sections, wherein the plurality of curved sections, having a maximum curved section height (tsub), with superimposed on the non-planar substructure a fused deposition modeling a step structure having tops and bottoms, wherein the coating stage comprises providing said powder coating on said curved sections with an average thickness (t) of the powder coating relative to the bottoms being equal to or smaller than the maximum curved section height (tsub) to enable the substructure to remain visible.
Products made by additive manufacturing · CPC title
partly or totally electrically conductive, e.g. for EMI shielding (conductive floors or floor coverings H05F3/025; EMI shielding in general H05K9/00) · CPC title
Optical elements, e.g. lenses, prisms · CPC title
the filler influencing the surface characteristics of the material, e.g. by concentrating near the surface or by incorporating in the surface by force · CPC title
Thermoplastic materials · CPC title
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