Liquid ejection nozzle and liquid ejection device

US12337337B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12337337-B2
Application numberUS-202217657102-A
CountryUS
Kind codeB2
Filing dateMar 29, 2022
Priority dateMar 31, 2021
Publication dateJun 24, 2025
Grant dateJun 24, 2025

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A liquid ejection nozzle that has a nozzle hole and ejects a liquid from the nozzle hole in a ejection direction toward a target subject includes a nozzle plate having the nozzle hole, and a pressing member having a through hole having a diameter larger than a diameter of the nozzle hole at a position corresponding to the nozzle hole in the ejection direction and configured to press the nozzle plate from a downstream side in the ejection direction.

First claim

Opening claim text (preview).

What is claimed is: 1. A liquid ejection nozzle that has a nozzle hole and ejects a liquid from the nozzle hole in an ejection direction toward a target subject, the liquid ejection nozzle comprising: a nozzle plate having the nozzle hole; and a pressing member having a through hole having a diameter larger than a diameter of the nozzle hole at a position corresponding to the nozzle hole in the ejection direction, wherein the pressing member is configured to press the nozzle plate from a downstream side in the ejection direction, a surface of the nozzle plate on the ejection direction is in contact with a surface of the pressing member on a side opposite to the ejection direction, a length of the through hole corresponds to a thickness of the pressing member in the ejection direction, and the diameter of the through hole is equal to or less than the thickness of the pressing member. 2. The liquid ejection nozzle according to claim 1 , wherein the nozzle plate has a plurality of nozzle holes including the plurality of nozzle hole. 3. The liquid ejection nozzle according to claim 2 , wherein the through hole is provided corresponding to each of the plurality of nozzle holes. 4. A liquid ejection device, comprising: the liquid ejection nozzle according to claim 3 ; and a liquid supply device configured to supply the liquid to the liquid ejection nozzle. 5. The liquid ejection nozzle according to claim 2 , wherein the through hole is provided corresponding to the plurality of nozzle holes. 6. A liquid ejection device, comprising: the liquid ejection nozzle according to claim 4 ; and a liquid supply device configured to supply the liquid to the liquid ejection nozzle. 7. A liquid ejection device, comprising: the liquid ejection nozzle according to claim 2 ; and a liquid supply device configured to supply the liquid to the liquid ejection nozzle. 8. The liquid ejection nozzle according to claim 1 , wherein the pressing member is configured to be attached to and detached from the nozzle plate. 9. A liquid ejection device, comprising: the liquid ejection nozzle according to claim 5 ; and a liquid supply device configured to supply the liquid to the liquid ejection nozzle. 10. The liquid ejection nozzle according to claim 1 , wherein the pressing member includes a resin. 11. A liquid ejection device, comprising: the liquid ejection nozzle according to claim 6 ; and a liquid supply device configured to supply the liquid to the liquid ejection nozzle. 12. The liquid ejection nozzle according to claim 1 , wherein the through hole of the pressing member is subjected to a liquid repellent treatment against the liquid. 13. A liquid ejection device, comprising: the liquid ejection nozzle according to claim 7 ; and a liquid supply device configured to supply the liquid to the liquid ejection nozzle. 14. A liquid ejection device, comprising: the liquid ejection nozzle according to claim 1 ; and a liquid supply device configured to supply the liquid to the liquid ejection nozzle. 15. The liquid ejection device according to claim 14 , wherein the liquid supply device is configured to feed the liquid to the liquid ejection nozzle using a gas pressure. 16. The liquid ejection nozzle according to claim 1 , wherein a relation in which the liquid does not come into contact with the through hole of the pressing member is expressed by Equation 1: θ<tan−1((( L 2 −L 1)/2)/ T 2)  Equation 1, where θ is an inclination angle representing a maximum deviation of the ejection direction from a specific ejection direction in the liquid ejection nozzle, L 1 is the diameter of the nozzle hole, L 2 is the diameter of the through hole, and T 2 is the thickness of the pressing member in the ejection direction. 17. The liquid ejection nozzle according to claim 16 , wherein a tip end portion of the through hole is chamfered.

Assignees

Inventors

Classifications

  • with arrangements for mixing one gas and one liquid · CPC title

  • characterised by details or accessories associated with outlets · CPC title

  • B05B1/14Primary

    with multiple outlet openings (B05B1/02, B05B1/26 take precedence); with strainers in or outside the outlet opening · CPC title

  • Fluid jet cutting instruments · CPC title

  • with pressurised or compressible container (aerosol containers B65D83/14); with pump · CPC title

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Frequently asked questions

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What does patent US12337337B2 cover?
A liquid ejection nozzle that has a nozzle hole and ejects a liquid from the nozzle hole in a ejection direction toward a target subject includes a nozzle plate having the nozzle hole, and a pressing member having a through hole having a diameter larger than a diameter of the nozzle hole at a position corresponding to the nozzle hole in the ejection direction and configured to press the nozzle …
Who is the assignee on this patent?
Seiko Epson Corp
What technology area does this patent fall under?
Primary CPC classification B05B1/14. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 24 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).