Server device and cooling apparatus

Patent metadata

Field	Value
Publication number	US-12336139-B2
Application number	US-202318209834-A
Country	US
Kind code	B2
Filing date	Jun 14, 2023
Priority date	Jun 5, 2023
Publication date	Jun 17, 2025
Grant date	Jun 17, 2025

Abstract

A server device includes a casing, a flow equalizing plate and a server. The casing has an accommodating space, a liquid inlet and a liquid outlet. The accommodating space accommodates a cooling liquid. The accommodating space is in fluid communication with the liquid inlet and the liquid outlet. The flow equalizing plate is detachably located in the accommodating space. The flow equalizing plate divides the accommodating space into an upper subspace and a lower subspace. The flow equalizing plate has through holes. The through holes are in fluid communication with the upper subspace and the lower subspace. The liquid inlet is in fluid communication with the lower subspace. The liquid outlet is in fluid communication with the upper subspace. The server is located in the upper subspace. The liquid inlet and the liquid outlet are in fluid communication with the server. Sizes of the through holes are different.

First claim

What is claimed is:

1. A server device, comprising:
a casing, having an accommodating space, at least one liquid inlet and at least one liquid outlet, wherein the accommodating space is configured to accommodate a cooling liquid, and the accommodating space is in fluid communication with the at least one liquid inlet and the at least one liquid outlet;
at least one flow equalizing plate, detachably located in the accommodating space, wherein the at least one flow equalizing plate divides the accommodating space into an upper subspace and a lower subspace, the at least one flow equalizing plate has a plurality of through holes, the plurality of through holes are in fluid communication with the upper subspace and the lower subspace, the at least one liquid inlet is in fluid communication with the lower subspace, and the at least one liquid outlet is in fluid communication with the upper subspace; and
at least one server, located in the upper subspace, wherein the at least one liquid inlet and the at least one liquid outlet are in fluid communication with the at least one server;
wherein sizes of the plurality of through holes of the at least one flow equalizing plate are different.

2. The server device according to claim 1 , further comprising at least one liquid inlet pipe and at least one liquid outlet pipe, wherein the at least one liquid inlet pipe is in fluid communication with the lower subspace via the at least one liquid inlet, and the at least one liquid outlet pipe is in fluid communication with the upper subspace via the at least one liquid outlet.

3. The server device according to claim 2 , further comprising a fluid driving apparatus, wherein the at least one liquid inlet pipe and the at least one liquid outlet pipe are in fluid communication with the fluid driving apparatus, respectively, and the fluid driving apparatus drives the cooling liquid to circulate in the casing, the at least one liquid inlet pipe and the at least one liquid outlet pipe.

4. The server device according to claim 2 , wherein the casing has two liquid inlets and two liquid outlets, the server device comprises two liquid inlet pipes and two liquid outlet pipes, and the two liquid inlets, the two liquid outlets, the two liquid inlet pipes and the two liquid outlet pipes are arranged symmetrically, respectively.

5. The server device according to claim 1 , wherein the sizes of the plurality of through holes decrease from opposite ends of the at least one flow equalizing plate towards a center of the at least one flow equalizing plate.

6. The server device according to claim 1 , wherein the at least one flow equalizing plate comprises a first flow equalizing sub-plate and a second flow equalizing sub-plate, the plurality of through holes are disposed through the first flow equalizing sub-plate and the second flow equalizing sub-plate, sizes of the plurality of through holes of the first flow equalizing sub-plate and sizes of the plurality of through holes of the second flow equalizing sub-plate are different, and the first flow equalizing sub-plate and the second flow equalizing sub-plate are detachably arranged side by side.

7. A cooling apparatus, comprising:
a casing, having an accommodating space, at least one liquid inlet and at least one liquid outlet, wherein the accommodating space is configured to accommodate a cooling liquid, the at least one liquid inlet and the at least one liquid outlet are configured to be in fluid communication with a fluid driving apparatus and at least one server, and the accommodating space is in fluid communication with the at least one liquid inlet and the at least one liquid outlet; and
at least one flow equalizing plate, detachably located in the accommodating space, wherein the at least one flow equalizing plate divides the accommodating space into an upper subspace and a lower subspace, the at least one flow equalizing plate has a plurality of through holes, the plurality of through holes are in fluid communication with the upper subspace and the lower subspace, the at least one liquid inlet is in fluid communication with the lower subspace, and the at least one liquid outlet is in fluid communication with the upper subspace;
wherein sizes of the plurality of through holes of the at least one flow equalizing plate are different.

8. The cooling apparatus according to claim 7 , further comprising at least one liquid inlet pipe and at least one liquid outlet pipe, wherein the at least one liquid inlet pipe is in fluid communication with the lower subspace via the at least one liquid inlet, and the at least one liquid outlet pipe is in fluid communication with the upper subspace via the at least one liquid outlet.

9. The cooling apparatus according to claim 8 , wherein the casing has two liquid inlets and two liquid outlets, the cooling apparatus comprises two liquid inlet pipes and two liquid outlet pipes, and the two liquid inlets, the two liquid outlets, the two liquid inlet pipes and the two liquid outlet pipes are arranged symmetrically, respectively.

10. The cooling apparatus according to claim 7 , wherein the at least one flow equalizing plate comprises a first flow equalizing sub-plate and a second flow equalizing sub-plate, the plurality of through holes are disposed through the first flow equalizing sub-plate and the second flow equalizing sub-plate, sizes of the plurality of through holes of the first flow equalizing sub-plate and sizes of the plurality of through holes of the second flow equalizing sub-plate are different, and the first flow equalizing sub-plate and the second flow equalizing sub-plate are detachably arranged side by side.

Assignees

• Inventec Pudong Tech Corp
• Inventec Corp
• Inventec Tech Corporation

Inventors

• Ji Jiaqing
• Wu Jiang-Jun
• Sun Ke

Classifications

• H05K7/20772

  within server blades for removing heat from heat source · CPC title

• H05K7/20272 Primary

  Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

• Y02D10/00

  Energy efficient computing, e.g. low power processors, power management or thermal management · CPC title

• G06F1/20

  Cooling means · CPC title

• H05K7/20781 Primary

  within cabinets for removing heat from server blades · CPC title