Circuit board, lens driving device, and camera module including the same

Patent metadata

Field	Value
Publication number	US-12336092-B2
Application number	US-202217932879-A
Country	US
Kind code	B2
Filing date	Sep 16, 2022
Priority date	Mar 9, 2016
Publication date	Jun 17, 2025
Grant date	Jun 17, 2025

Abstract

A circuit board according to an embodiment includes: an insulating part; and a pattern part disposed on the insulating part, wherein the insulating part includes first and second insulating regions spaced apart from each other with an open region interposed therebetween, the pattern part includes: a first terminal portion disposed in a plurality of first side regions of the first insulating region adjacent to the open region; a second terminal portion disposed on a plurality of second side regions of the second insulating region facing the plurality of first side regions with the open region interposed therebetween; and a connecting portion disposed in the open region and connecting between the first and second terminal portions, wherein the connecting portion includes a plurality of bent portions connecting between the first terminal portion and the second terminal portion disposed in the first side region and the second side region which do not face each other and formed at a plurality of corners of the open region, the plurality of bent portions are bent to rotate in the same direction as each other, each of the first terminal portion, the second terminal portion, and the connecting portion includes a metal layer and a surface treatment layer disposed on the metal layer, and the metal layer includes a first metal layer and a second metal layer that is disposed on the first metal layer and has an electrical conductivity different from that of the first metal layer.

First claim

What is claimed is:

1. A circuit board comprising:
an insulating part; and a pattern part disposed on the insulating part,
wherein the insulating part includes first and second insulating regions spaced apart from each other with an open region interposed therebetween,
the pattern part includes: a first terminal portion disposed in a plurality of first side regions of the first insulating region adjacent to the open region; a second terminal portion disposed on a plurality of second side regions of the second insulating region facing the plurality of first side regions with the open region interposed therebetween; and a connecting portion disposed in the open region and connecting between the first and second terminal portions,
wherein the connecting portion includes a plurality of bent portions connecting between the first terminal portion and the second terminal portion disposed in the first side region and the second side region which do not face each other and formed at a plurality of corners of the open region,
the plurality of bent portions are bent to rotate in the same direction as each other,
each of the first terminal portion, the second terminal portion, and the connecting portion includes
a metal layer and a surface treatment layer disposed on the metal layer, and
the metal layer includes a first metal layer and a second metal layer disposed on the first metal layer and having an electrical conductivity different from that of the first metal layer.

2. The circuit board of claim 1 , comprising a third metal layer disposed between the insulating part and the first metal layer.

3. The circuit board of claim 1 , wherein an electrical conductivity of the second metal layer is greater than that of the first metal layer.

4. The circuit board of claim 2 , wherein a surface roughness of an upper surface of the second metal layer is lower than that of a lower surface of the third metal layer.

5. The circuit board of claim 1 , wherein the second metal layer includes
a first region that vertically overlaps an upper surface of the first metal layer and
a second region that does not vertically overlap the upper surface of the first metal layer and vertically overlaps a side surface of the first metal layer.

6. The circuit board of claim 5 , wherein a vertical cross-sectional shape of the first metal layer is different from that of the second metal layer.

7. The circuit board of claim 5 , wherein the second metal layer is disposed on the upper surface of the first metal layer,
a lower surface of the first metal layer is not in contact with the second metal layer, and
the surface treatment layer includes a portion in contact with the first metal layer and a portion in contact with the second metal layer.

8. The circuit board of claim 5 , wherein the second metal layer includes
a 2-1 metal layer disposed on the upper surface of the first metal layer and
a 2-2 metal layer disposed on the lower surface of the first metal layer, and
the surface treatment layer includes the portion in contact with the first metal layer, a portion in contact with the 2-1 metal layer, and a portion in contact with the 2-2 metal layer.

9. The circuit board of claim 8 , wherein a vertical cross-sectional shape of the 2-1 metal layer is different from that of the 2-2 metal layer.

10. The circuit board of claim 5 , wherein the second metal layer has a thickness in a range of 1 μm to 15 μm.

11. The circuit board of claim 8 , wherein a thickness of the 2-2 metal layer is smaller than that of the 2-1 metal layer.

12. The circuit board of claim 11 , wherein at least a part of the 2-1 metal layer vertically overlaps a side surface of the 2-2 metal layer.

13. The circuit board of claim 1 , wherein the second metal layer is respectively disposed on the upper surface, the lower surface, and the side surface of the first metal layer.

14. The circuit board of claim 13 , wherein the surface treatment layer is disposed to surround the second metal layer and is not in contact with the first metal layer.

15. The circuit board of claim 13 , wherein a thickness of the second metal layer satisfies a range of 0.5 μm to 4.0 μm.

16. The circuit board of claim 13 , wherein the first metal layer has a slope in which a width increases from the upper surface toward the lower surface thereof, and
the second metal layer has a slope corresponding to the slope of the first metal layer and is disposed on the side surface of the first metal layer.

17. The circuit board of claim 1 , wherein the surface treatment layer includes at least one of an organic material, an inorganic material, and an organic-inorganic composite.

18. A lens driving device comprising:
a fixed part;
a first moving part disposed to be movable relative to the fixed part; and
the circuit board including a region connected to the fixed part and a region connected to the first moving part and included in claim 1 .

19. A camera module comprising:
the lens driving device included in claim 18 ,
wherein the lens driving device includes a second moving part that is disposed inside the first moving part and is relatively movable in an optical axis direction with respect to the fixed part and the first moving part.

Assignees

• Lg Innotek Co Ltd

Inventors

• Kwon Na Kyung
• Kim Hae Sik

Classifications

• H05K1/0306

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title

• H05K1/0353

  consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K1/0298 Primary

  Multilayer circuits · CPC title