Casing material for power storage device, production method therefor, and power storage device

US12334568B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12334568-B2
Application numberUS-202418637876-A
CountryUS
Kind codeB2
Filing dateApr 17, 2024
Priority dateOct 24, 2018
Publication dateJun 17, 2025
Grant dateJun 17, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A casing material for a power storage device, including a laminate that includes, in order, at least a base material layer, a barrier layer, and a heat-fusible resin layer. The heat-fusible resin layer includes a single layer or a plurality of layers. A first heat-fusible resin layer, among the heat-fusible resin layers, that constitutes the surface of the laminate has a logarithmic decrement ΔE of no more than 0.20 in a rigid body pendulum measurement at 140° C.

First claim

Opening claim text (preview).

The invention claimed is: 1. A power storage device outer packaging material which comprises a laminate including at least a base material layer, a barrier layer and a heat-sealable resin layer in this order, wherein the heat-sealable resin layer includes a single layer or multiple layers, a first heat-sealable resin layer of the heat-sealable resin layer, which forms a surface of the laminate, has a logarithmic decrement ΔE of 0.20 or less at 140° C. in a rigid pendulum measurement, and the thickness of the first heat-sealable resin layer is 20 μm or more and 60 μm or less. 2. The power storage device outer packaging material according to claim 1 , further comprising an adhesive layer between the barrier layer and the heat-sealable resin layer, wherein the thickness of the adhesive layer is 20 μm or more and 50 μm or less. 3. The power storage device outer packaging material according to claim 1 , further comprising an adhesive layer between the barrier layer and the heat-sealable resin layer, wherein the total thickness of the adhesive layer and the heat-sealable resin layer is 50 μm or more. 4. The power storage device outer packaging material according to claim 1 , further comprising an adhesive layer between the barrier layer and the heat-sealable resin layer, wherein a laminated configuration on a side opposite to the base material layer side from the barrier layer is a laminated configuration in which the adhesive layer having a thickness of about 20 to 60 μm and the first heat-sealable resin layer having a thickness of 20 to 50 μm are laminated in this order from the barrier layer side. 5. The power storage device outer packaging material according to claim 1 , wherein the resin forming the first heat-sealable resin layer contains a polyolefin backbone. 6. The power storage device outer packaging material according to claim 1 , further comprising an adhesive layer between the barrier layer and the heat-sealable resin layer, wherein the adhesive layer contains an acid-modified polyolefin. 7. The power storage device outer packaging material according to claim 1 , wherein the first heat-sealable resin layer contains two or more lubricants. 8. The power storage device outer packaging material according to claim 1 , further comprising an adhesive layer between the barrier layer and the heat-sealable resin layer, wherein the adhesive layer and the heat-sealable resin layer are laminated by extrusion. 9. The power storage device outer packaging material according to claim 1 , wherein the base material layer contains polyamide MXD6. 10. The power storage device outer packaging material according to claim 1 , wherein the thickness of the laminate forming the power storage device outer packaging material is 155 μm or less. 11. The power storage device outer packaging material according to claim 1 , wherein the thickness of the base material layer is 35 μm or less. 12. The power storage device outer packaging material according to claim 1 , wherein the thickness of the base material layer is more than 35 μm and 50 μm or less. 13. The power storage device outer packaging material according to claim 1 , wherein the thickness of the barrier layer is 50 μm or less. 14. The power storage device outer packaging material according to claim 1 , wherein the thickness of the base material layer is more than 50 μm and 200 μm or less. 15. A method for producing a power storage device outer packaging material, comprising the step of laminating at least a base material layer, a barrier layer and a heat-sealable resin layer in this order, wherein the heat-sealable resin layer includes a single layer or multiple layers, a first heat-sealable resin layer of the heat-sealable resin layer, which forms a surface of the laminate, has a logarithmic decrement AE of 0.20 or less at 140° C. in rigid pendulum measurement, and the thickness of the first heat-sealable resin layer is 20 μm or more and 60 μm or less. 16. A power storage device in which a power storage device element including at least a positive electrode, a negative electrode and an electrolyte is stored in a packaging formed of the power storage device outer packaging material according to claim 1 . 17. A power storage device outer packaging material which comprises a laminate including at least a base material layer, a barrier layer and a heat-sealable resin layer in this order, wherein the heat-sealable resin layer includes a single layer or multiple layers, a first heat-sealable resin layer of the heat-sealable resin layer, which forms a surface of the laminate, has a logarithmic decrement AE of 0.20 or less at 140° C. in a rigid pendulum measurement, the power storage device outer packaging material further comprises an adhesive layer between the barrier layer and the heat-sealable resin layer, and the thickness of the adhesive layer is 20 μm or more and 50 μm or less. 18. The power storage device outer packaging material according to claim 17 , wherein the total thickness of the adhesive layer and the heat-sealable resin layer is 50 μm or more. 19. The power storage device outer packaging material according to claim 17 , wherein the resin forming the first heat-sealable resin layer contains a polyolefin backbone. 20. The power storage device outer packaging material according to claim 17 , wherein the adhesive layer contains an acid-modified polyolefin. 21. The power storage device outer packaging material according to claim 17 , wherein the first heat-sealable resin layer contains two or more lubricants. 22. The power storage device outer packaging material according to claim 17 , wherein the adhesive layer and the heat-sealable resin layer are laminated by extrusion. 23. The power storage device outer packaging material according to claim 17 , wherein the base material layer contains polyamide MXD6. 24. The power storage device outer packaging material according to claim 17 , wherein the thickness of the laminate forming the power storage device outer packaging material is 155 μm or less. 25. The power storage device outer packaging material according to claim 17 , wherein the thickness of the base material layer is 35 μm or less. 26. The power storage device outer packaging material according to claim 17 , wherein the thickness of the base material layer is more than 35 μm and 50 μm or less. 27. The power storage device outer packaging material according to claim 17 , wherein the thickness of the barrier layer is 50 μm or less. 28. The power storage device outer packaging material according to claim 17 , wherein the thickness of the base material layer is more than 50 μm and 200 μm or less.

Assignees

Inventors

Classifications

  • Pouches or flexible bags · CPC title

  • with two or more layers of only organic material · CPC title

  • comprising three or more layers · CPC title

  • Fixing or assembling a capacitive element in a housing, e.g. mounting electrodes, current collectors or terminals in containers or encapsulations · CPC title

  • characterised by their material · CPC title

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What does patent US12334568B2 cover?
A casing material for a power storage device, including a laminate that includes, in order, at least a base material layer, a barrier layer, and a heat-fusible resin layer. The heat-fusible resin layer includes a single layer or a plurality of layers. A first heat-fusible resin layer, among the heat-fusible resin layers, that constitutes the surface of the laminate has a logarithmic decrement Δ…
Who is the assignee on this patent?
Dainippon Printing Co Ltd
What technology area does this patent fall under?
Primary CPC classification H01M50/1243. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 17 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).