Chiplet loader for microassembler

Patent metadata

Field	Value
Publication number	US-12334377-B2
Application number	US-202318097543-A
Country	US
Kind code	B2
Filing date	Jan 17, 2023
Priority date	Jan 17, 2023
Publication date	Jun 17, 2025
Grant date	Jun 17, 2025

Abstract

A micro-assembly system includes a reservoir that stores a supply of chiplets suspended in a suspension fluid. Each of the chiplets has a bottom major surface that defines a right side down orientation. The system includes a delivery surface or belt that delivers the chiplets from the reservoir to an assembly surface. The system includes a micro assembler that may arrange the first subset of the chiplets in a pattern on the assembly surface. The micro assembler moves the first subset of chiplets towards a subsequent assembly stage. The micro assembler has an array of field generators fixed relative to the assembly surface that move the first subset of the chiplets along the assembly surface in response to signals applied to each of the field generators.

First claim

The invention claimed is:

1. A system comprising:
a reservoir storing a supply of chiplets suspended in a suspension fluid, each of the chiplets comprising a bottom major surface that defines a right side down orientation;
a delivery surface forming a path to deliver the chiplets from the reservoir to an assembly surface;
a sensor that identifies a first subset of the chiplets having the respective bottom surfaces facing the assembly surface; and
a micro assembler that arranges the first subset of the chiplets in a pattern on the assembly surface and moves the first subset of chiplets towards a subsequent assembly stage, the micro assembler comprising an array of field generators fixed relative to the assembly surface that move the first subset of the chiplets along the assembly surface in response to signals applied to each of the field generators.

2. The system of claim 1 , wherein the delivery surface comprises an outer surface of a rotating cylinder, the chiplets being held on the outer surface with a layer of the suspension fluid.

3. The system of claim 2 , wherein the sensor identifies the first subset of the chiplets while the first subset is attached to the outer surface of the rotating cylinder proximate the assembly surface, the field generators activated to pull the first subset of the chiplets off the outer surface of the cylinder and onto the assembly surface.

4. The system of claim 1 , wherein the delivery surface comprises a fluid flow path that encompasses a forced flow of the suspension fluid, the fluid flow path being fixed relative to the assembly surface.

5. The system of claim 4 , wherein the fluid flow path comprises a Venturi jet.

6. The system of claim 4 , wherein the fluid flow path comprises a supply outlet on a first bottom side of the reservoir, the reservoir comprising:
a fluid inlet on a second bottom side of the reservoir that provides a pressurized flow into the reservoir causing the forced flow through the supply outlet; and
a fluid outlet on a top of the reservoir that allows pressurized fluid to leave the reservoir, a separation between a bottom and top of the reservoir sufficient to prevent the chiplets from flowing into the fluid outlet.

7. The system of claim 1 , wherein the sensor identifies a second subset of the chiplets having the respective bottom surfaces facing away from the assembly surface, the micro assembler moving the second subset of the chiplets away from the subsequent assembly stage.

8. The system of claim 7 , wherein the second subset of the chiplets are directed back to the reservoir.

9. A system comprising:
a reservoir storing a supply of chiplets suspended in a suspension fluid, each of the chiplets comprising a bottom major surface that defines a right side down orientation;
a moving belt that delivers the chiplets from the reservoir to an assembly surface, the moving belt comprising features that arranges the chiplets in a pattern; and
a micro assembler that moves a first subset of the chiplets that are in the right side down orientation to a subsequent assembly stage.

10. The system of claim 9 , wherein the features of the moving belt comprise an array of depressions arranged in the pattern, each of the depressions having a shape that corresponds to an outline of the chiplets.

11. The system of claim 10 , further comprising holes in the depressions through which the suspension fluid is pumped causing the chiplets to flow into the depressions.

12. The system of claim 11 , wherein the depressions comprise bevels that guide the chiplets to a seated position.

13. The system of claim 9 , wherein the moving belt comprises electrostatic or dielectrophoretic potential wells that attract and bind the chiplets into the pattern.

14. The system of claim 13 , wherein the chiplets comprise zeta potential differences between the bottom major surface and opposed top facing surfaces, the electrostatic or dielectrophoretic potential wells attracting only the first subset of the chiplets with the bottom major surfaces in the right side down orientation and repelling a second subset of the chiplets with the bottom major surfaces not in the right side down orientation.

15. The system of claim 9 , wherein the micro assembler comprises an array of field generators fixed relative to the assembly surface that move the chiplets along the assembly surface in response to signals applied to each of the field generators.

16. The system of claim 9 , wherein the reservoir agitates the chiplets in the suspension fluid causing the chiplets to be placed in the moving belt.

17. The system of claim 9 , wherein the reservoir comprises a fluid circulation path with a forced flow that causes the chiplets to pass across the moving belt.

18. The system of claim 9 , wherein the moving belt comprises a seamless belt.

19. The system of claim 9 , wherein the chiplets are moved from the moving belt to the assembly surface via pressure or electrostatic repulsion.

Assignees

• Palo Alto Res Ct Inc
• Xerox Corp

Inventors

• Lu Jengping
• Biegelsen David K
• Raychaudhuri Sourobh
• Rupp Bradley
• Chow Eugene M

Classifications

• H10P72/3222 Primary

  Loading to or unloading from a conveyor · CPC title

• H10P72/3212 Primary

  the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames · CPC title

• H01L21/67736

  Electricity · mapped topic

• H01L21/67721 Primary

  Electricity · mapped topic