Multilayer electronic component containing coating layers having an island region

Patent metadata

Field	Value
Publication number	US-12334270-B2
Application number	US-202217969176-A
Country	US
Kind code	B2
Filing date	Oct 19, 2022
Priority date	Dec 29, 2021
Publication date	Jun 17, 2025
Grant date	Jun 17, 2025

Abstract

A multilayer electronic component includes a body including a plurality of internal electrodes and a dielectric layer interposed between the plurality of internal electrodes; external electrodes disposed on the body, connected to the plurality of internal electrodes, and including electrode layers and plating layers respectively covering the electrode layers; and coating layers respectively covering the plating layer and including an island region exposing a portion of a surface of the plating layer.

First claim

What is claimed is:

1. A multilayer electronic component comprising:
a body including a plurality of internal electrodes and a dielectric layer interposed between the plurality of internal electrodes;
external electrodes disposed on the body, connected to the plurality of internal electrodes, and including electrode layers and plating layers respectively covering the electrode layers; and
coating layers respectively covering each of the plating layers and including an island region exposing a portion of a surface of the plating layer,
wherein 0.5 μm to 5 μm is a range of an average diameter of the island region.

2. The multilayer electronic component of claim 1 , wherein 0.1 to 10% is a range of a ratio of an area of the coating layer, which is a ratio of a region where the coating layer is disposed on the surface of the plating layer.

3. The multilayer electronic component of claim 1 , wherein 90 to 99.9% is a range of a ratio of an area of the exposed surface of the plating layer.

4. The multilayer electronic component of claim 1 , wherein the coating layer includes at least one material selected from the group consisting of aluminum oxide, hafnium oxide, silicon oxide, titanium oxide, zirconium oxide and tin oxide.

5. The multilayer electronic component of claim 1 , wherein the coating layer has a multi-layer structure.

6. The multilayer electronic component of claim 1 , wherein the coating layer includes a layer in which only a portion of the layer covering the plating layer is removed.

7. The multilayer electronic component of claim 1 , wherein 30 nm to 0.2 μm is a range of a thickness of the coating layer.

8. The multilayer electronic component of claim 1 , wherein the island region includes a plurality of island regions, and 5 to 10 μm is a range of a shortest distance between the plurality of island regions.

9. The multilayer electronic component of claim 1 , wherein the plating layer is a tin (Sn) plating layer.

10. The multilayer electronic component of claim 1 , wherein the electrode layer includes a conductive metal and glass.

11. The multilayer electronic component of claim 1 , further comprising an additional coating layer disposed on a region of the body, in which the external electrode is not disposed.

12. The multilayer electronic component of claim 11 , wherein the additional coating layer covers an entire surface of the region of the body, in which the external electrode is not disposed.

13. A multilayer electronic component comprising:
a body including a plurality of internal electrodes and a dielectric layer interposed between the plurality of internal electrodes;
external electrodes disposed on the body, connected to the plurality of internal electrodes, and including electrode layers and plating layers respectively covering the electrode layers; and

coating layers respectively covering each of the plating layers and including an island region exposing a portion of a surface of the plating layer,
wherein the island region includes a plurality of island regions, and 5 to 10 μm is a range of a shortest distance between the plurality of island regions.

14. The multilayer electronic component of claim 13 , wherein the coating layers include an inorganic material.

15. The multilayer electronic component of claim 13 , wherein the coating layers include at least one material selected from the group consisting of aluminum oxide, hafnium oxide, silicon oxide, titanium oxide, zirconium oxide, and tin oxide.

16. The multilayer electronic component of claim 15 , wherein the at least one material includes aluminum oxide.

Assignees

• Samsung Electro Mech

Inventors

• Cho Sung Min
• Lee Jang Yeol
• Jung Ho Phil

Classifications

• H01G4/224

  Housing; Encapsulation · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/232 Primary

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• Y02E60/13

  Energy storage using capacitors · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title