Magnetic sensor package and magnetic sensing system

Patent metadata

Field	Value
Publication number	US-12332089-B2
Application number	US-202318452263-A
Country	US
Kind code	B2
Filing date	Aug 18, 2023
Priority date	May 26, 2020
Publication date	Jun 17, 2025
Grant date	Jun 17, 2025

Abstract

A magnetic sensor package comprising a magnetic multi-turn sensor die and a magnetic single turn sensor die, in which both sensor dies are packaged on the same lead frame. A method of manufacturing the magnetic sensor package is also provided. A magnetic sensor system comprising a rotating magnet and the magnetic sensor package, where the sensor package is arranged so that both sensor dies sit within a homogenous magnetic field, thereby ensuring that the output signal of each sensor is not corrupted by any stray fields.

First claim

What is claimed is:

1. A magnetic sensing system, comprising:
a rotating magnet configured to generate a rotating magnetic field; and
magnetic sensor package, comprising:
at least one integrated device die comprising:
a single turn sensor having a sensing element configured to detect an orientation of the magnetic field, a rotational axis of the rotating magnet offset from the magnetic sensor package; and
a multi-turn sensor having a sensing element configured to detect a number of turns of the rotating magnet, the multi-turn sensor comprising a different type of sensor from the single turn sensor and positioned such that the single turn sensor is adjacent to the multi-turn sensor;

a package substrate, wherein the at least one integrated device die is mounted onto the package substrate; and
a housing, wherein the housing encases the package substrate at the at least one integrated device die,
wherein the at least one integrated device die comprises a first integrated device die comprising the single turn sensor, and a second integrated device die comprising the multi-turn sensor, a top surface of the first integrated device die is aligned at a same level with a top surface of the second integrated device die.

2. The magnetic sensor package of claim 1 , wherein one or both of the first integrated device die and the second integrated device die are mounted to the package substrate using a die attach film.

3. The magnetic sensor package of claim 1 , wherein the package substrate comprises a non-magnetic material.

4. A magnetic sensing system, comprising:
a rotating magnet configured to generate a rotating magnetic field; and
a magnetic sensor package, comprising:
at least one integrated device die comprising:
a single turn sensor having a sensing element configured to detect an orientation of the magnetic field generated by the rotating magnet; and
a multi-turn sensor having a sensing element configured to detect a number of turns of the rotating magnet, the multi-turn sensor comprising a different type of sensor from the single turn sensor and positioned such that the single turn sensor is adjacent to the multi-turn sensor;

a package substrate, wherein the at least one integrated device die is mounted onto the package substrate; and
a housing, wherein the housing encases the package substrate at the at least one integrated device die;
wherein the magnetic sensor package is offset from a rotational axis of rotating magnet, and
wherein the single turn sensor and the multi-turn sensor are both positioned within a magnetic corridor in which a magnetic field strength of the rotating magnetic field is substantially constant as the orientation of the magnetic field changes.

5. The magnetic sensing system of claim 4 , wherein the single turn sensor and the multi-turn sensor are substantially the same distance from the rotational axis of the rotatable magnet.

6. The magnetic sensing system of claim 4 , wherein the magnetic sensor package is at a first position within a plane perpendicular to the rotational axis of the magnet.

7. The magnetic sensing system of claim 4 , wherein the at least one integrated device die comprises a first integrated device die comprising the single turn sensor, and a second integrated device die comprising the multi-turn sensor.

8. The magnetic sensing system of claim 7 , wherein a top surface of the first integrated device die is parallel with a top surface of the second integrated device die.

9. A method of manufacturing a magnetic sensing system, the method comprising:
providing a rotating magnet configured to generate a rotating magnetic field;
providing a package substrate;
forming at least one integrated device die on the package substrate, the at least one integrated device die comprising a single turn sensor having a sensing element configured to detect an orientation of the magnetic field, a rotational axis of the rotating magnet offset from the magnetic sensor package, and a multi-turn sensor having a sensing element configured to detect a number of turns of the rotating magnet, the multi-turn sensor comprising a different type of sensor from the single turn sensor and positioned such that the single turn sensor is adjacent to the multi-turn sensor, the single turn sensor and the multi-turn sensor being both positioned within a magnetic corridor in which a magnetic field strength of the rotating magnetic field is substantially constant as the orientation of the magnetic field changes; and
forming a housing around the package substrate.

10. The method of manufacture of claim 9 , wherein forming the at least one integrated device die comprises forming a first integrated device die comprising the single turn sensor and forming a second integrated device die comprising the multi-turn sensor.

11. The method of manufacture of claim 10 , further comprising attaching one or both of the first integrated device die and the second integrated device die to the package substrate using a die attach film.

12. The method of manufacture of claim 9 , wherein the package substrate comprises a non-magnetic material.

13. The method of manufacture of claim 9 , wherein forming the housing comprises:
providing a first molded component on a first side of the package substrate;
providing a second molded component on a second side of the package substrate; and
joining the first and second molded components to enclose the package substrate.

Assignees

• Analog Devices International Unlimited Co

Inventors

• Richard Aude
• Mueller-Aulmann Michael
• Tonge Peter James
• Dutt Monsoon
• Kubik Jan
• O'Dowd John
• Nicholl Enda Joseph
• O'Brien Stephen
• Schmitt Jochen
• GUYOL Robert
• Nau Christian
• Giles Colin P
• O'Mara Brian
• Wang Wenmei

Classifications

• G01D2205/26

  Details of encoders or position sensors specially adapted to detect rotation beyond a full turn of 360°, e.g. multi-rotation · CPC title

• G01D5/145

  influenced by the relative movement between the Hall device and magnetic fields (see G01R33/06) · CPC title

• G01R33/0005

  Geometrical arrangement of magnetic sensor elements; Apparatus combining different magnetic sensor types (G01R33/0206 takes precedence) · CPC title

• G01R33/072

  Constructional adaptation of the sensor to specific applications · CPC title

• G01R33/091

  Constructional adaptation of the sensor to specific applications · CPC title