Thermal module

Patent metadata

Field	Value
Publication number	US-12331999-B2
Application number	US-202318196410-A
Country	US
Kind code	B2
Filing date	May 11, 2023
Priority date	Sep 16, 2022
Publication date	Jun 17, 2025
Grant date	Jun 17, 2025

Abstract

A thermal module includes a radiating fin unit having a plurality of superposed radiating fin assemblies, and a plurality of groups of heat pipes. The heat pipes respectively have a heat absorbing section and a heat dissipating section formed at two opposite ends thereof. The heat absorbing sections in each heat pipe group is in contact with a heat source, and the heat dissipating sections in the same heat pipe group is sandwiched between two adjacent ones of the radiating fin assemblies. The thermal module is characterized in that the heat dissipating sections are horizontally extended through the radiating fin assemblies from one of two opposite shorter sides to another shorter side along two parallel longer sides thereof, such that the heat dissipating sections not only have a maximum contact area with the radiating fin assemblies, but also give the radiating fin unit an enhanced structural strength.

First claim

What is claimed is:

1. A thermal module, comprising:
a radiating fin unit including radiating fin assemblies disposed in a stack, the radiating fin assemblies including a bottom radiating fin assembly, a top radiating fin assembly, and a middle radiating fin assembly, the middle radiating fin assembly being disposed between the bottom radiating fin assembly and the top radiating fin assembly, and each of the radiating fin assemblies being formed of a plurality of radiating fins sequentially fastened to one another in a horizontal direction to provide at least one contact surface thereon; and
a plurality of groups of heat pipes including a first group of heat pipes and a second group of heat pipes, each of the heat pipes including a heat absorbing section and a heat dissipating section formed at two ends thereof, the heat dissipating section of the first group of heat pipes being disposed between the bottom radiating fin assembly and the middle radiating fin assembly, and the heat dissipating section of the second group of heat pipes being disposed between the middle radiating fin assembly and the top radiating fin assembly, the heat absorbing sections of the heat pipes in each of the heat pipe groups being in contact with a heat source; and
the thermal module being characterized in that the heat dissipating sections of the heat pipes in each group are respectively horizontally extended from an outer side of one of two opposite shorter sides of one radiating fin assembly in the same direction as two opposite longer sides of the radiating fin assembly to another shorter side thereof, such that the heat dissipating sections are in full contact with the contact surfaces of corresponding radiating fin assemblies.

2. The thermal module as claimed in claim 1 , wherein the heat pipes in each of the heat pipe groups further respectively include a bent heat transferring section, which is located between and connected to the heat absorbing section and the heat dissipating section of the same heat pipe; and the bent heat transferring sections of the heat pipes in different heat pipe groups being located outside the radiating fin assemblies corresponding to different shorter sides thereof.

3. The thermal module as claimed in claim 1 , wherein any two adjacent radiating fins on each of the radiating fin assemblies define a heat dissipation passage between them, and the heat dissipation passages of the radiating fin assemblies being located perpendicularly to the heat dissipating sections of the heat pipe groups.

4. The thermal module as claimed in claim 1 , wherein every radiating fin on the radiating fin assemblies includes an upper flange and a lower flange; and the radiating fins in each of the radiating fin assemblies being sequentially horizontally connected at the upper and the lower flanges to provide a top contact surface and a bottom contact surface, respectively.

5. The thermal module as claimed in claim 1 , further comprising a base located between the heat absorbing sections of each heat pipe group and a heat source; wherein each of the bases includes a plurality of connecting sections, which are connected to the heat absorbing section of one corresponding heat pipe group and in direct contact with one corresponding heat source.

Assignees

• Asia Vital Components Co Ltd

Inventors

• Lin Sheng-Huang

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• F28F1/325

  Fins with openings · CPC title

• F28F2225/06

  for fins · CPC title

• F28F2215/08

  with openings, e.g. louvers · CPC title