Thermal print head, thermal printer, and method of manufacturing heat sink

US12330430B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12330430-B2
Application numberUS-202318165691-A
CountryUS
Kind codeB2
Filing dateFeb 7, 2023
Priority dateAug 25, 2020
Publication dateJun 17, 2025
Grant dateJun 17, 2025

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A thermal print head includes: a head substrate on which a plurality of heating resistance units are formed; a heat sink thermally connected to the head substrate, a recess being formed in a back surface of the heat sink which faces a surface to which the head substrate is connected; a metal member arranged in the recess; and an adhesive arranged between a bottom surface of the recess and the metal member. The recess viewed from a direction perpendicular to the back surface includes: an area where the metal member is arranged, and a groove area where the metal member is not arranged. A portion of the adhesive is arranged in the groove area.

First claim

Opening claim text (preview).

What is claimed is: 1. A thermal print head comprising: a head substrate on which a plurality of heating resistance units are formed; a heat sink thermally connected to the head substrate, a recess being formed in a back surface of the heat sink which faces a surface to which the head substrate is connected; a metal member arranged in the recess; and an adhesive arranged between a bottom surface of the recess and the metal member, wherein the recess viewed from a direction perpendicular to the back surface includes: an area where the metal member is arranged; and a groove area where the metal member is not arranged, a portion of the adhesive is arranged in the groove area, and the groove area is surrounded by the metal member. 2. The thermal print head according to claim 1 , wherein an inner circumference of the recess viewed from the direction perpendicular to the back surface includes a plurality of positioning sections in contact with an outer circumference of the metal member. 3. The thermal print head according to claim 2 , wherein the inner circumference of the recess viewed from the direction perpendicular to the back surface further includes a separation section separated from an outer circumference of the metal member. 4. The thermal print head according to claim 1 , wherein the recess includes the groove area arranged in at least two positions in such a way as to sandwich the metal member. 5. The thermal print head according to claim 1 , wherein a hollow is formed in a portion of the bottom surface of the recess. 6. The thermal print head according to claim 5 , wherein the hollow is superimposed on the groove area when viewed from the direction perpendicular to the back surface. 7. The thermal print head according to claim 1 , wherein the metal member is a ferromagnetic body. 8. The thermal print head according to claim 1 , wherein the metal member is made of a cold-rolled steel sheet. 9. The thermal print head according to claim 1 , wherein a surface of the metal member is galvanized. 10. The thermal print head according to claim 1 , wherein the recess extends along a main scanning direction between both ends of the heat sink in the main scanning direction in which the plurality of heating resistance units are arranged. 11. The thermal print head according to claim 10 , wherein the metal member is arranged in plurality in such a way as that metal members are spaced apart from each other in the recess. 12. A method of manufacturing the thermal print head according to claim 10 , comprising forming the recess in the heatsink by extrusion in the main scanning direction. 13. The thermal print head according to claim 1 , wherein the recess is provided with a pair of side surfaces parallel to the main scanning direction in which the plurality of heating resistance units are arranged, and the pair of side surfaces is formed from a first end in the main scanning direction to a second end in the main scanning direction of the heat sink. 14. A thermal printer comprising the thermal print head according to claim 1 . 15. The thermal printer according to claim 14 further comprising a printer body to which the thermal print head is fixed by using a magnetic force of a magnet.

Assignees

Inventors

Classifications

  • Cooling arrangements · CPC title

  • Electrode layers · CPC title

  • Structure of thermal heads · CPC title

  • B41J2/375Primary

    Protection arrangements against overheating · CPC title

  • B41J2/32Primary

    using thermal heads · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US12330430B2 cover?
A thermal print head includes: a head substrate on which a plurality of heating resistance units are formed; a heat sink thermally connected to the head substrate, a recess being formed in a back surface of the heat sink which faces a surface to which the head substrate is connected; a metal member arranged in the recess; and an adhesive arranged between a bottom surface of the recess and the m…
Who is the assignee on this patent?
Rohm Co Ltd
What technology area does this patent fall under?
Primary CPC classification B41J2/375. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 17 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).