Light emitting device pakage

Patent metadata

Field	Value
Publication number	US-12328977-B2
Application number	US-202217746877-A
Country	US
Kind code	B2
Filing date	May 17, 2022
Priority date	Jun 2, 2021
Publication date	Jun 10, 2025
Grant date	Jun 10, 2025

Abstract

A light-emitting device package includes a frame including one side on which a first electrode is formed and the other side on which a second electrode is formed, an LED chip including a first conductive connection pad electrically connected to the first electrode and a second conductive connection pad electrically connected to the second electrode, a reflective member disposed on the frame, forming a cavity for accommodating the LED chip therein, and reflecting light emitted from the LED chip, and a wavelength conversion member filled in the cavity to cover the LED chip, wherein the reflective member includes a first side and a second side different from the first side, and a first height of the first side and a second height of the second side are formed to be different from each other.

First claim

What is claimed is:

1. A light-emitting device package comprising:
a frame comprising one side on which a first electrode is formed and the other side on which a second electrode is formed;
an LED chip comprising a first conductive connection pad electrically connected to the first electrode and a second conductive connection pad electrically connected to the second electrode;
a reflective member disposed on the frame, forming a cavity for accommodating the LED chip therein, and reflecting light emitted from the LED chip; and
a wavelength conversion member filled in the cavity to cover the LED chip,
wherein the reflective member comprises a first side having a first height and a second side having a second height, and the second height is less than the first height,
wherein the second side comprises an open area exposing the wavelength conversion member, and
wherein an inner surface of the open area has a stepped structure of two or more steps.

2. The light-emitting device package of claim 1 , wherein a portion of the inner surface of the open area is formed of a curved surface.

3. The light-emitting device package of claim 2 , wherein an imaginary extension surface extending from an upper surface of the LED chip passes through a first area of the open area including the curved surface.

4. The light-emitting device package of claim 1 , wherein the second height is equal to or less than half of the first height.

5. The light-emitting device package of claim 1 , wherein a length of the first side of the reflective member is greater than a length of the second side thereof.

6. The light-emitting device package of claim 1 , wherein an inner surface of the first side comprises an inclined surface having a constant inclination.

7. The light-emitting device package of claim 1 , wherein a height of an uppermost end of the wavelength conversion member is greater than a height of an uppermost end of the reflective member.

8. The light-emitting device package of claim 1 , wherein an upper surface of the wavelength conversion member is formed as a curved surface.

Assignees

• Lumens Co Ltd

Inventors

• Jo Sung Sik
• Kim Pyeong Guk

Classifications

• H10W90/00

  Package configurations · CPC title

• H10H20/8142

  forming resonant cavity structures · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/851

  Wavelength conversion means · CPC title

• H10H20/853

  characterised by their shape · CPC title