Immersed liquid cooling apparatus and liquid cooling system

US12328842B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12328842-B2
Application numberUS-202418750358-A
CountryUS
Kind codeB2
Filing dateJun 21, 2024
Priority dateDec 22, 2021
Publication dateJun 10, 2025
Grant dateJun 10, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Examples of the disclosure relate to an immersed liquid cooling apparatus and a liquid cooling system. The immersed liquid cooling apparatus includes a cabinet, wherein the cabinet includes a cooling groove and a mounting groove integrated on an outer wall of the cooling groove, the cooling groove is used for accommodating an electronic device to be cooled and a first cooling liquid, the mounting groove is used for accommodating the first cooling liquid, and the cooling groove is in fluid communication with the mounting groove by means of a through hole; and a heat exchange module suitable for being inserted into the mounting groove, wherein the heat exchange module includes a cooling liquid circulation pipeline, a heat exchanger and a cooling liquid driving apparatus, the cooling liquid circulation pipeline is in fluid communication with the heat exchanger for providing a second cooling liquid for the heat exchanger, the heat exchanger is used for using the second cooling liquid inside the heat exchanger to cool the first cooling liquid outside the heat exchanger, and the cooling liquid driving apparatus is configured to circulate the first cooling liquid between the mounting groove and the cooling groove.

First claim

Opening claim text (preview).

We claim: 1. An immersion liquid cooling apparatus, comprising: a cabinet, wherein the cabinet comprises a cooling groove and a mounting groove integrated on an outer wall of the cooling groove, the cooling groove is used for accommodating an electronic device to be cooled and a first cooling liquid, the mounting groove is used for accommodating the first cooling liquid, and the cooling groove is in fluid communication with the mounting groove by means of a through hole; and a heat exchange module suitable for being inserted into the mounting groove, wherein the heat exchange module comprises a cooling liquid circulation pipeline, a heat exchanger and a cooling liquid driving apparatus, the cooling liquid circulation pipeline is in fluid communication with the heat exchanger to be used for providing a second cooling liquid for the heat exchanger, the heat exchanger is used for using the second cooling liquid inside the heat exchanger to cool the first cooling liquid outside the heat exchanger, and the cooling liquid driving apparatus is used for enabling the first cooling liquid to be circulated between the mounting groove and the cooling groove. 2. The immersion liquid cooling apparatus according to claim 1 , wherein the through hole comprises a first set of through holes and a second set of through holes, wherein in a case that the heat exchange module is inserted into the mounting groove, the cooling liquid driving apparatus is provided to be close to the first set of through holes to be used for driving the first cooling liquid in the mounting groove into the cooling groove and enabling the first cooling liquid in the cooling groove to flow into the mounting groove by means of the second set of through holes. 3. The immersion liquid cooling apparatus according to claim 2 , wherein the first set of through holes are provided to be close to a bottom side of the mounting groove, and the second set of through holes are provided to be close to a top side of the mounting groove. 4. The immersion liquid cooling apparatus according to claim 3 , wherein in the case that the heat exchange module is inserted into the mounting groove, the cooling liquid driving apparatus moves close to the bottom side of the mounting groove, and the heat exchanger is located above the cooling liquid driving apparatus and provided adjacent to the cooling liquid driving apparatus. 5. The immersion liquid cooling apparatus according to claim 2 , wherein the cooling liquid driving apparatus comprises a plurality of circulation pumps, wherein in the case that the heat exchange module is inserted into the mounting groove, each of the plurality of circulation pumps moves close to a respective through hole of the first set of through holes. 6. The immersion liquid cooling apparatus according to claim 1 , wherein the cabinet further comprises an outer frame and a top cover, the outer frame is provided to surround the cooling groove and the mounting groove, and the top cover is rotatably connected to the outer frame and is switchable between a closed state in which the cooling groove is closed and an opened state in which the cooling groove is opened. 7. The immersion liquid cooling apparatus according to claim 6 , wherein the top cover comprises a frame and a transparent portion surrounded by the frame. 8. The immersion liquid cooling apparatus according to claim 6 , wherein a first seal ring is provided on a side of the top cover facing the cooling groove, wherein in a case that the top cover is in the closed state, the top cover is sealed off from the cooling groove by the first seal ring. 9. The immersion liquid cooling apparatus according to claim 6 , wherein the cabinet further comprises a hydraulic driving apparatus, and the hydraulic driving apparatus is connected between the outer frame and the top cover for driving the top cover to be switched between the closed state and the opened state. 10. The immersion liquid cooling apparatus according to claim 9 , wherein the hydraulic driving apparatus comprises a pair of hydraulic rods, one of the pair of hydraulic rods is connected between a first side of the top cover and the outer frame, the other one of the pair of hydraulic rods is connected between a second side of the top cover and the outer frame, and the first side and the second side of the top cover are opposite sides. 11. The immersion liquid cooling apparatus according to claim 6 , wherein the immersion liquid cooling apparatus further comprises a height-adaptive support, and the height-adaptive support is provided under the cooling groove and supports the cooling groove. 12. The immersion liquid cooling apparatus according to claim 1 , wherein the heat exchange module further comprises a plurality of cooling liquid replacement blocks, wherein in a case that the heat exchange module is inserted into the mounting groove, the plurality of cooling liquid replacement blocks are able to be at least partially immersed into the first cooling liquid in the mounting groove. 13. The immersion liquid cooling apparatus according to claim 12 , wherein in the case that the heat exchange module is inserted into the mounting groove, the plurality of cooling liquid replacement blocks is provided to be close to a top side of the mounting groove. 14. The immersion liquid cooling apparatus according to claim 12 , wherein channels for the first cooling liquid to flow through are provided between adjacent cooling liquid replacement blocks of the plurality of cooling liquid replacement blocks. 15. The immersion liquid cooling apparatus according to claim 1 , wherein the heat exchange module further comprises a support portion, wherein in a case that the heat exchange module is inserted into the mounting groove, the support portion is located outside the mounting groove. 16. The immersion liquid cooling apparatus according to claim 15 , wherein a second seal ring is provided on a side of the support portion facing the mounting groove, wherein in the case that the heat exchange module is inserted into the mounting groove, the support portion is sealed off from the mounting groove by the second seal ring. 17. The immersion liquid cooling apparatus according to claim 1 , wherein the cabinet has a height ranging from 1000 mm to 1100 mm, a width ranging from 750 mm to 850 mm and a length ranging from 500 mm to 800 mm. 18. The immersion liquid cooling apparatus according to claim 1 , wherein the first cooling liquid comprises a fluorinated liquid or mineral oil, and/or the second cooling liquid comprises deionized water. 19. The immersion liquid cooling apparatus according to claim 1 , wherein the electronic device comprises a server or a switch. 20. An immersion liquid cooling system, comprising a plurality of immersion liquid cooling apparatuses provided side by side, wherein each immersion liquid cooling apparatus of the plurality of immersion liquid cooling apparatuses comprises: a cabinet, wherein the cabinet comprises a cooling groove and a mounting groove integrated on an outer wall of the cooling groove, the cooling groove is used for accommodating an electronic device to be cooled and a first cooling liquid, the mounting groove is used for accommodating the first cooling liquid, and the cooling groove is in fluid communication with the mounting groove by means of a through hole; and a heat exchange module suitable for being inserted into the mounting groove, wherein the heat exchange module comprises a cooling liquid circulation pipeline, a heat exchanger and a cooling liquid

Assignees

Inventors

Classifications

  • within cabinets for removing heat from server blades · CPC title

  • Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

  • Thermal management, e.g. liquid flow control · CPC title

  • for server racks or cabinets; for data centers, e.g. 19-inch computer racks · CPC title

  • by immersion · CPC title

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Frequently asked questions

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What does patent US12328842B2 cover?
Examples of the disclosure relate to an immersed liquid cooling apparatus and a liquid cooling system. The immersed liquid cooling apparatus includes a cabinet, wherein the cabinet includes a cooling groove and a mounting groove integrated on an outer wall of the cooling groove, the cooling groove is used for accommodating an electronic device to be cooled and a first cooling liquid, the mounti…
Who is the assignee on this patent?
Beijing Bytedance Network Tech Co Ltd
What technology area does this patent fall under?
Primary CPC classification H05K7/20236. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 10 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).