Circuit board and display device including the same

Patent metadata

Field	Value
Publication number	US-12328815-B2
Application number	US-202318121004-A
Country	US
Kind code	B2
Filing date	Mar 14, 2023
Priority date	Mar 22, 2022
Publication date	Jun 10, 2025
Grant date	Jun 10, 2025

Abstract

A circuit board includes a first pad, a second pad, and a soldering element. The first pad comprises a first body and a first mesh structure directly connected to the first body. The second pad comprises a second body and a second mesh structure. The second mesh structure is directly connected to the second body, is spaced from the first mesh structure in a direction, and is disposed between the first mesh structure and the second body in the first direction. The soldering element is disposed on the first pad and the second pad, is partially disposed between the first mesh structure and the second mesh structure, and electrically connects the first pad to the second pad.

First claim

What is claimed is:

1. A circuit board, comprising:
a first pad comprising a first body and a first mesh structure directly connected to the first body;
a second pad comprising a second body and a second mesh structure, the second mesh structure being directly connected to the second body, spaced from the first mesh structure in a first direction, and disposed between the first mesh structure and the second body in the first direction; and
a soldering element disposed on the first pad and the second pad, partially disposed between the first mesh structure and the second mesh structure, and electrically connecting the first pad to the second pad,
wherein a width of the first body in the first direction is greater than a width of the first mesh structure in the first direction, and a width of the second body in the first direction is greater than a width of the second mesh structure in the first direction.

2. The circuit board of claim 1 , wherein the first mesh structure is a mirror image of the second mesh structure in a plan view of the circuit board.

3. The circuit board of claim 1 , further comprising:
a first wire electrically connected through the first body to the first mesh structure; and
a second wire electrically connected through the second body to the mesh structure.

4. A circuit board, comprising:
a first pad comprising a first body and a first mesh structure directly connected to the first body;
a second pad comprising a second body and a second mesh structure, the second mesh structure being directly connected to the second body, spaced from the first mesh structure in a first direction, and disposed between the first mesh structure and the second body in the first direction; and
a soldering element disposed on the first pad and the second pad, partially disposed between the first mesh structure and the second mesh structure, and electrically connecting the first pad to the second pad,
wherein a second direction is perpendicular to the first direction,
wherein the first mesh structure comprises:
first conductive lines each extending in a third direction oblique relative to the first direction;
second conductive lines each extending in a fourth direction oblique relative to the first direction and different from the third direction; and
first junctions where the first conductive lines and the second conductive lines meet, and
wherein the second mesh structure comprises:
third conductive lines each extending oblique relative to the first direction;
fourth conductive lines each extending oblique relative to the first direction and not parallel to the third conductive lines; and
second junctions where the third conductive lines and the fourth conductive lines meet.

5. The circuit board of claim 4 ,
wherein the first junctions include first edge junctions located at an edge of the first pad,
wherein the second junctions include second edge junctions located at an edge of the second pad, and
wherein the first edge junctions face the second edge junctions.

6. The circuit board of claim 5 , wherein the soldering element comprises:
a first portion overlapping the first pad;
a second portion overlapping the second pad; and
a third portion disposed between the first portion and the second portion and directly contacting the first edge junctions and the second edge junctions.

7. The circuit board of claim 6 ,
wherein the first portion is disposed on both the first body and the first mesh structure, and
wherein the second portion is disposed on both the second body and the second mesh structure.

8. The circuit board of claim 6 , wherein the third portion of the soldering element includes an opening that extends in the second direction.

9. The circuit board of claim 6 , wherein the first portion of the soldering element includes an opening that extends in the second direction.

10. The circuit board of claim 6 , wherein the second portion of the soldering element includes an opening that extends in the second direction.

11. A display device, comprising:
a display panel comprising a display area and a non-display area, wherein the display area comprises pixels, and wherein the non-display area abuts the display area; and
a circuit board attached to the non-display area,
wherein the circuit board comprises:
a first pad comprising a first body and a first mesh structure directly connected to the first body;
a second pad comprising a second body and a second structure, the second mesh structure being directly connected to the second body, spaced from the first mesh structure in a first direction, and disposed between the first mesh structure and the second body in the first direction; and
a soldering element disposed on the first pad and the second pad, partially disposed between the first mesh structure and the second mesh structure, and electrically connecting the first pad to the second pad,
wherein a width of the first body in the first direction is greater than a width of the first mesh structure in the first direction, and a width of the second body in the first direction is greater than a width of the second mesh structure in the first direction.

12. The display device of claim 11 , wherein the first mesh structure is a mirror image of the second structure in a plan view of the circuit board.

13. The display device of claim 11 ,
wherein a second direction is perpendicular to the first direction,
wherein the first mesh structure comprises:
first conductive lines each extending in a third direction oblique relative to the first direction;
second conductive lines each extending in a fourth direction oblique relative to the first direction and different from the third direction; and
first junctions where the first conductive lines and the second conductive lines meet, and
wherein the second mesh structure comprises:
third conductive lines each extending oblique relative to the first direction;
fourth conductive lines each extending oblique relative to the first direction and not parallel to the third conductive lines; and
second junctions where the third conductive lines and the fourth conductive lines meet.

14. The display device of claim 13 ,
wherein the first junctions include first edge junctions located at an edge of the first pad,
wherein the second junctions include second edge junctions located at an edge of the second pad, and
wherein the first edge junctions respectively correspond to the second edge junctions.

15. The display device of claim 14 , wherein the soldering element comprises:
a first portion overlapping the first pad;
a second portion overlapping the second pad; and
a third portion disposed between the first portion and the second portion and directly contacting the first edge junctions and the second edge junctions.

16. The display device of claim 15 ,
wherein the first portion is disposed on both the first body and the first mesh structure, and
wherein the second portion is disposed on both the second body and the second mesh structure.

17. The display device of claim 15 , wherein the third portion of the soldering element includes an opening that extends in the second direction.

18. The display device of claim 15 , wherein the first portion of the soldering element includes an opening that extends in the second direction.

19. The display device of claim 15 , wherein the second portion of the soldering element includes an opening that extends in the second direction.

20. The display device of claim 11 , further com

Assignees

• Samsung Display Co Ltd

Inventors

• Park Youngjin

Classifications

• H05K2201/09381

  Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component · CPC title

• H10K77/10

  Substrates, e.g. flexible substrates · CPC title

• G02F1/133302

  Rigid substrates, e.g. inorganic substrates · CPC title

• H05K3/34

  by soldering · CPC title

• H05K3/341

  Surface mounted components · CPC title