Acoustic devices with improved sensitivity

Patent metadata

Field	Value
Publication number	US-12328559-B2
Application number	US-202217664022-A
Country	US
Kind code	B2
Filing date	May 18, 2022
Priority date	Jun 17, 2021
Publication date	Jun 10, 2025
Grant date	Jun 10, 2025

Abstract

An acoustic sensor (e.g., for use in a piezoelectric MEMS microphone) includes a substrate and a cantilever beam attached to the substrate. The cantilever beam has a proximal portion attached to the substrate and extending to a distal tip at a free end of the beam. The cantilevered beam has a width in plan view that is greater at a location distal of the proximal portion than at the proximal portion attached to the substrate. One or more electrodes are disposed on or in the proximal portion of the beam.

First claim

What is claimed is:

1. A piezoelectric sensor for a piezoelectric microelectromechanical systems microphone, comprising:
a substrate;
a cantilever beam having a proximal portion attached to the substrate and extending to a distal tip at a free end of the cantilever beam, the cantilever beam having a width in plan view that is greater at a location distal of the proximal portion than at the proximal portion attached to the substrate, at least one edge of the cantilever beam extending nonlinearly between the proximal portion and the distal tip; and
one or more electrodes disposed on or in the proximal portion of the cantilever beam.

2. The sensor of claim 1 wherein the width of the cantilever beam is greater at the distal tip than at the proximal portion.

3. The sensor of claim 1 wherein at least one side edge of the cantilever beam extends linearly between the proximal portion and the distal tip.

4. The sensor of claim 3 wherein both side edges of the cantilever beam extend linearly between the proximal portion and the distal tip.

5. The sensor of claim 1 wherein the cantilever beam is symmetrical about a centerline of the cantilever beam.

6. The sensor of claim 1 wherein the distal tip is linear.

7. A piezoelectric microelectromechanical systems microphone, comprising:
a substrate; and
a plurality of piezoelectric sensors movably coupled to the substrate, each of the piezoelectric sensors spaced apart from an adjacent piezoelectric sensor by a gap and including: a cantilever beam having a proximal portion attached to the substrate and extending to a distal tip at a free end of the cantilever beam, cantilever beam having a width in plan view that is greater at a location distal of the proximal portion than at the proximal portion attached to the substrate, at least one edge of the cantilever beam extending nonlinearly between the proximal portion and the distal tip, and one or more electrodes disposed on or in the proximal portion of the cantilever beam,
wherein the plurality of piezoelectric sensors are configured to deflect when subjected to sound pressure.

8. The microphone of claim 7 wherein the width of the cantilever beam is greater at the distal tip than at the proximal portion.

9. The microphone of claim 7 wherein at least one side edge of the cantilever beam extends linearly between the proximal portion and the distal tip.

10. The microphone of claim 9 wherein both side edges of the cantilever beam extend linearly between the proximal portion and the distal tip.

11. The microphone of claim 7 wherein the cantilever beam is symmetrical about a centerline of the cantilever beam.

12. The microphone of claim 7 wherein the distal tip is linear.

13. An audio subsystem, comprising:
an audio codec; and
one or more piezoelectric microelectromechanical systems microphones in communication with the audio codec, each microphone including: a substrate and a plurality of piezoelectric sensors movably coupled to the substrate, each of the piezoelectric sensors spaced apart from an adjacent piezoelectric sensor by a gap and including a cantilever beam having a proximal portion attached to the substrate and extending to a distal tip at a free end of the cantilever beam, cantilever beam having a width in plan view that is greater at a location distal of the proximal portion than at the proximal portion attached to the substrate, at least one edge of the cantilever beam extending nonlinearly between the proximal portion and the distal tip, and one or more electrodes disposed on or in the proximal portion of the cantilever beam.

14. The audio subsystem of claim 13 wherein the width of the cantilever beam is greater at the distal tip than at the proximal portion.

15. The audio subsystem of claim 13 wherein at least one side edge of the cantilever beam extends linearly between the proximal portion and the distal tip.

16. The audio subsystem of claim 15 wherein both side edges of the cantilever beam extend linearly between the proximal portion and the distal tip.

17. The audio subsystem of claim 13 wherein the cantilever beam is symmetrical about a centerline of the cantilever beam.

18. The audio subsystem of claim 13 wherein the distal tip is linear.

Assignees

• Skyworks Solutions Inc

Inventors

• Chen Guofeng
• Wurtz Michael Jon
• Kumar Rakesh
• Qian You
• Campanella-Pineda Humberto

Classifications

• H10N30/872

  Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices · CPC title

• H10N30/306

  Cantilevers · CPC title

• H10N30/302

  Sensors · CPC title

• H10N30/50

  having a stacked or multilayer structure · CPC title

• H10N30/05

  Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes · CPC title