Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board

Patent metadata

Field	Value
Publication number	US-12325770-B2
Application number	US-202218685865-A
Country	US
Kind code	B2
Filing date	Aug 5, 2022
Priority date	Aug 25, 2021
Publication date	Jun 10, 2025
Grant date	Jun 10, 2025

Abstract

Provided are a resin composition having low dielectric constants and low dielectric loss tangents before moisture absorption (initial state) and after moisture absorption with high metal foil peel strength; and a cured product, a prepreg, a metal foil-clad laminate, a resin sheet, and a printed wiring board in which the resin composition is used. The resin composition contains a compound (A) represented by Formula (M1) and a polymer (B) having a structural unit represented by Formula (V).

First claim

The invention claimed is:

1. A resin composition comprising a compound (A) represented by Formula (M1), a polymer (B) having a structural unit represented by Formula (V), and a cyanate ester compound;

where in Formula (M1), R M1 , R M2 , R M3 , and R M4 each independently represent a hydrogen atom or an organic group; R M5 and R M6 each independently represent a hydrogen atom or an alkyl group; Ar M represents a divalent aromatic group; A is a four-to six-membered alicyclic group; R M7 and R M8 are each independently an alkyl group; mx is 1 or 2; 1x is 0 or 1; R M9 and R M10 each independently represent a hydrogen atom or an alkyl group; R M11 , R M12 , R M13 , and R M14 each independently represent a hydrogen atom or an organic group;
R M15 each independently represents an alkyl group having from 1 to 10 carbon atom(s), an alkyloxy group having from 1 to 10 carbon atom(s), an alkylthio group having from 1 to 10 carbon atom(s), an aryl group having from 6 to 10 carbon atoms, an aryloxy group having from 1 to 10 carbon atom(s), an arylthiol group having from 1 to 10 carbon atom(s), a halogen atom, a hydroxyl group, or a mercapto group; px represents an integer of from 0 to 3; and nx represents an integer of from 1 to 20,

wherein Formula (V), Ar represents an aromatic hydrocarbon linking group; and * represents a bond position, where a vinyl group equivalent of the unit represented by the Formula (V) is 200 g/eq or more and 1200 g/eq or less.

2. The resin composition according to claim 1 , wherein, when a resin solid content in the resin composition is defined as 100 parts by mass, a content of the compound (A) represented by Formula (M1) is from 1 to 90 parts by mass.

3. The resin composition according to claim 1 , wherein, when a resin solid content in the resin composition is defined as 100 parts by mass, a content of the polymer (B) having the structural unit represented by Formula (V) is from 1 to 90 parts by mass.

4. The resin composition according to claim 1 , further comprising at least one additional resin component (C) selected from the group consisting of; a maleimide compound other than the compound (A) represented by Formula (M1); an epoxy compound; a phenolic compound; an oxetane resin, a benzoxazine compound; a polyphenylene ether compound containing two or more unsaturated carbon-carbon double bonds; and a cyanate ester compound.

5. The resin composition according to claim 1 , further comprising a filler (D).

6. The resin composition according to claim 5 , wherein a content of the filler (D) in the resin composition is from 50 to 1600 parts by mass relative to 100 parts by mass of a resin solid content.

7. The resin composition according to claim 1 , wherein a weight average molecular weight of the polymer (B) having the structural unit represented by Formula (V) is from 3000 to 130000.

8. The resin composition according to claim 1 , further comprising an elastomer.

9. The resin composition according to claim 1 , which does not comprise a radical polymerization initiator.

10. The resin composition according to claim 1 , wherein, when a resin solid content in the resin composition is defined as 100 parts by mass, a content of the compound (A) represented by Formula (M1) is from 1 to 90 parts by mass, and
when a resin solid content in the resin composition is defined as 100 parts by mass, a content of the polymer (B) having the structural unit represented by Formula (V) is from 1 to 90 parts by mass.

11. The resin composition according to claim 10 , further comprising an elastomer.

12. The resin composition according to claim 10 , which does not comprise a radical polymerization initiator.

13. The resin composition according to claim 1 , wherein the polymer (B) having the structural unit represented by Formula (V) has (Mw/Mn), a monodispersity represented by a ratio of a weight average molecular weight Mw to a number average molecular weight Mn, of 10 or more and 20 or less.

14. A compound as in claim 1 , where polymer (B) further comprises a structural unit (b) derived from an aromatic compound having one vinyl group, and polymer (B) having a copolymerization ratio of structural unit (b) is 10 mol % or greater and 85 mol % or less.

15. A cured product of a resin composition described in claim 1 .

16. A metal foil-clad laminate comprising at least one prepreg described in claim 15 and a metal foil disposed on one side or both sides of the prepreg.

17. A resin sheet comprising a layer comprising a support and a resin composition described in claim 1 disposed on a surface of the support.

18. A printed wiring board comprising an insulating layer and a conductor layer disposed on a surface of the insulating layer,
wherein the insulating layer comprises a layer comprising a resin composition described in claim 1 .

19. A prepreg comprising a substrate and a resin composition described in claim 1 .

Assignees

• Mitsubishi Gas Chemical Co

Inventors

• Nakashima Yuji
• Kobayashi Takashi
• Hirano Shunsuke
• Hasebe Keiichi

Classifications

• H05K1/0366

  reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence) · CPC title

• C08L51/003

  grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds (C08L51/04, C08L51/06 take precedence) · CPC title

• C08K5/315

  Compounds containing carbon-to-nitrogen triple bonds · CPC title

• C08J2453/02

  of vinyl aromatic monomers and conjugated dienes · CPC title

• C08J2451/08

  grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds · CPC title