Method for mechanically mounting and protecting extended length optical fiber

US12318859B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12318859-B2
Application numberUS-202217724354-A
CountryUS
Kind codeB2
Filing dateApr 19, 2022
Priority dateApr 19, 2022
Publication dateJun 3, 2025
Grant dateJun 3, 2025

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

An apparatus and method of embedding an optical fiber within a substrate. The apparatus includes a bonding device and a conveyance device. The bonding device bonds a foil layer to the substrate to seal the optical fiber within a groove of the substrate. The conveyance device moves the substrate and the bonding device relative to each other. Relative motion between the substrate and the bonding device draws the optical fiber into the groove and the foil layer over the optical fiber at a collection point.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus for embedding an optical fiber in a groove formed within a substrate, comprising: a housing configured to move with respect to the substrate along a direction of the groove; a fiber spool in the housing, the fiber spool having an optical fiber wound thereon; a foil spool in the housing, the foil spool having metal foil wound thereon; and an ultrasonic bonding device in the housing that generates ultrasonic waves for bonding metal, wherein movement of the housing with respect to the substrate draws the optical fiber into the groove and the metal foil over the optical fiber at a collection point to form a chamber that houses the optical fiber and subsequently moves the ultrasonic bonding device over the metal foil to bond the metal foil to the substrate. 2. The apparatus of claim 1 , wherein the substrate is one of: (i) a metal strip; (ii) a tubular; (iii) a pipe; (iv) a containment vessel; (v) a member used in fluid sequestration; (vi) a member used in CO 2 sequestration; and (vii) a member used in hydrogen sequestration. 3. The apparatus of claim 1 , wherein the substrate is stationary and the ultrasonic bonding device is in motion relative to the substrate.

Assignees

Inventors

Classifications

  • Bobbins; Reels · CPC title

  • Ducts; Conduits; Hollow tubes for air blown fibres · CPC title

  • Installation methods in fluid conducts, e.g. pipelines · CPC title

  • using light waves, e.g. infrared or ultraviolet waves · CPC title

  • Arrangements for fixing cables or wirelines to the outside of downhole devices · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US12318859B2 cover?
An apparatus and method of embedding an optical fiber within a substrate. The apparatus includes a bonding device and a conveyance device. The bonding device bonds a foil layer to the substrate to seal the optical fiber within a groove of the substrate. The conveyance device moves the substrate and the bonding device relative to each other. Relative motion between the substrate and the bonding …
Who is the assignee on this patent?
Baker Hughes Oilfield Operations Llc
What technology area does this patent fall under?
Primary CPC classification G02B6/3636. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jun 03 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).