Wire drawing die

US12318828B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12318828-B2
Application numberUS-202118019177-A
CountryUS
Kind codeB2
Filing dateAug 11, 2021
Priority dateAug 24, 2020
Publication dateJun 3, 2025
Grant dateJun 3, 2025

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A wire drawing die 1 includes a non-diamond material, is provided with a die hole 1 h , and has a reduction 1 c and a bearing 1 d that is positioned downstream of the reduction 1 c . A reduction angle γ which is an opening angle of the die hole 1 h at the reduction 1 c is less than or equal to 17°, and a surface roughness Ra of the die hole 1 h within ±20 μm from a specific position inside the bearing 1 d in a circumferential direction of the die hole 1 h that is perpendicular to a wire drawing direction is less than or equal to 0.025 μm.

First claim

Opening claim text (preview).

The invention claimed is: 1. A wire drawing die comprising a non-diamond material having a die hole, a reduction, and a bearing positioned downstream of the reduction, wherein the non-diamond material includes CBN, and a reduction angle which is an opening angle of the die hole at the reduction is less than or equal to 17°, a length L of the bearing is less than or equal to 200% D, where D is a diameter of the bearing, and a surface roughness Ra of the die hole within ±20 μm from a specific position inside the bearing in a circumferential direction of the die hole that is perpendicular to a wire drawing direction is less than or equal to 0.025 μm. 2. The wire drawing die according to claim 1 , wherein the die reduces an area of a wire by greater than or equal to 5%. 3. The wire drawing die according to claim 1 , wherein the die is in initial contact with a wire on the reduction, and the die is in contact with the wire at a length greater than or equal to 50% D including the bearing, where D is the diameter of the bearing. 4. The wire drawing die according to claim 1 , wherein the die has a thermal conductivity of 100 to 300 W/(m·K). 5. The wire drawing die according to claim 1 , wherein the length L of the bearing is less than or equal to 50% D, where D is the diameter of the bearing. 6. The wire drawing die according to claim 1 , wherein the wire drawing die contains 99 mass % or more CBN and less than 1 mass % of hBN. 7. The wire drawing die according to claim 1 , wherein the crystal grain size D50 of CBN is 200 to 300 μm.

Assignees

Inventors

Classifications

  • Drawing metal wire or like flexible metallic material by drawing machines or apparatus in which the drawing action is effected by drums · CPC title

  • B21C3/02Primary

    Dies; Selection of material therefor; Cleaning thereof · CPC title

  • B21C23/08Primary

    Making wire, rods or tubes · CPC title

  • B21C3/04Primary

    with non-adjustable section (B21C3/08 takes precedence) · CPC title

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What does patent US12318828B2 cover?
A wire drawing die 1 includes a non-diamond material, is provided with a die hole 1 h , and has a reduction 1 c and a bearing 1 d that is positioned downstream of the reduction 1 c . A reduction angle γ which is an opening angle of the die hole 1 h at the reduction 1 c is less than or equal to 17°, and a surface roughness Ra of the die hole 1 h within ±20 μm from a s…
Who is the assignee on this patent?
Almt Corp, Sumitomo Electric Industries
What technology area does this patent fall under?
Primary CPC classification B21C3/02. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 03 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).