Electronic component assembly with thermally conductive structures for image sensors

Patent metadata

Field	Value
Publication number	US-12316935-B2
Application number	US-202418629257-A
Country	US
Kind code	B2
Filing date	Apr 8, 2024
Priority date	Dec 6, 2019
Publication date	May 27, 2025
Grant date	May 27, 2025

Abstract

An electronic component assembly having thermal pads with thermal vias coupling an image sensor and a camera board fab is provided for heat dissipation. The electronic component assembly can include: a circuit board having at least one thermal pad disposed on a top surface of the circuit board; and an image sensor disposed on the top surface of the circuit board, having at least one conductive pad disposed at at least one corner of the image sensor. The at least one thermal pad is coupled to the at least one conductive pad of the image sensor and the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board for transfer of heat of the image sensor.

First claim

What is claimed is:

1. An electronic component assembly, comprising:
a circuit board comprising at least one thermal pad disposed on a top surface of the circuit board;
an image sensor disposed on the top surface of the circuit board, comprising at least one conductive pad disposed at at least one corner of the image sensor; and
a cooling structure coupled to the circuit board,
wherein the at least one thermal pad is coupled to the at least one conductive pad of the image sensor,
wherein the at least one thermal pad is formed with a plurality of first thermal vias penetrating the thermal pad and the circuit board, and
wherein the cooling structure comprises at least one cold finger structure.

2. The electronic component assembly of claim 1 , further comprising a thermally conductive layer disposed on a bottom surface of the circuit board.

3. The electronic component assembly of claim 2 , wherein the thermally conductive layer is made of metal and formed with a plurality of second thermal vias penetrating the thermally conductive layer to transfer heat.

4. The electronic component assembly of claim 1 , further comprising a thermal compound material applied between corner areas of the image sensor and the corner areas of the thermal pad comprising the thermal vias and extending along lengths of the thermal pad to be in contact with the top surface of the circuit board.

5. The electronic component assembly of claim 1 , wherein at least one of the plurality of first thermal vias has a shape of a cylinder.

6. The electronic component assembly of claim 5 , wherein at least one of the plurality of first thermal vias is filled with a thermally conductive material.

7. The electronic component assembly of claim 1 , wherein at least one of the plurality of first thermal vias is filled with a thermally conductive material.

8. The electronic component assembly of claim 1 , wherein at least one of the plurality of first thermal vias is formed with copper (Cu) or copper alloy.

9. The electronic component assembly of claim 1 , wherein the plurality of first thermal vias is disposed directly under the conductive pad of the image sensor on the top surface of the circuit board.

10. The electronic component assembly of claim 1 , wherein the cooling structure protrudes through a through-hole of the circuit board and contacts a surface of the image sensor.

11. The electronic component assembly of claim 1 , further comprising a lens mount, wherein the lens mount and the image sensor are horizontally disposed on a same surface of the top surface of the circuit board.

12. An image sensor assembly, comprising:
a cooling structure comprising at least one thermoelectric cooling element (TEC);
a circuit board disposed on the cooling structure;
an image sensor;
a lens;
a heat sink structure coupled to the cooling structure;
an image sensor cover disposed on the image sensor;
a lens outer barrel in contact with the image sensor cover; and
a plurality of fasteners coupling the lens outer barrel to the heat sink structure,
wherein the cooling structure further comprises at least one cold finger structure.

13. The image sensor assembly according to claim 12 , further comprising a plurality of gaskets disposed between the lens outer barrel and the circuit board to reduce heat transfer from the lens outer barrel, and a plurality of washers respectively disposed between the plurality of gaskets and the circuit board.

14. The image sensor assembly according to claim 12 , further comprising a lens mount, wherein the image sensor and the lens mount are horizontally disposed on a same plane of a top surface of the circuit board.

15. The image sensor assembly according to claim 12 , further comprising a lens mount, wherein the image sensor and the lens mount are disposed to vertically overlap on a top surface of the circuit board.

Assignees

• Bio Rad Laboratories Inc

Inventors

• Swihart Stephen
• Lu Li
• Jameson Wade
• Thrush Evan
• Griffin Michael
• Perez Evelio

Classifications

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H05K7/20472

  Sheet interfaces · CPC title

• H04N23/52 Primary

  Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements · CPC title

• H10F39/809 Primary

  of hybrid image sensors · CPC title