Coincident phase center, microstrip fed, planar ultrawideband modular antenna

Patent metadata

Field	Value
Publication number	US-12316035-B2
Application number	US-202318458204-A
Country	US
Kind code	B2
Filing date	Aug 30, 2023
Priority date	Aug 30, 2023
Publication date	May 27, 2025
Grant date	May 27, 2025

Abstract

An antenna module comprises: stacked printed circuit boards (PCBs) (stacked PCBs) centered on an axis and including: a first PCB having a ground plane; a second PCB, spaced above the first PCB, having a first radiator pair and a second radiator pair that face the ground plane and orthogonally crisscross each other at the axis, each radiator pair having respective signal and ground connection pads adjacent to the axis to form a coincident phase center at the axis for each radiator pair; a third PCB, spaced above the second PCB, for impedance matching; and signal connectors extending through the first PCB; and support PCBs extending from the ground plane to the second PCB, the support PCBs having microstrip feeds to connect the respective signal and ground connection pads of the first radiator pair and the second radiator pair to the signal connectors and to the ground plane.

First claim

What is claimed is:

1. An antenna module comprising:
stacked printed circuit boards (PCBs) (stacked PCBs) centered on an axis and including:
a first PCB having a ground plane;
a second PCB, spaced above the first PCB, having a first radiator pair and a second radiator pair that face the ground plane and orthogonally crisscross each other at the axis, each radiator pair having respective signal and ground connection pads adjacent to the axis to form a coincident phase center at the axis for each radiator pair;
a third PCB, spaced above the second PCB, for impedance matching; and
signal connectors extending through the first PCB; and

support PCBs extending from the ground plane to the second PCB, the support PCBs having microstrip feeds to connect the respective signal and ground connection pads of the first radiator pair and the second radiator pair to the signal connectors and to the ground plane.

2. The antenna module of claim 1 , wherein:
the stacked PCBs include planar PCBs that are stacked vertically along the axis, which is a vertical axis; and
the support PCBs include planar support PCBs that extend vertically from the ground plane to the second PCB.

3. The antenna module of claim 1 , further comprising:
a foam spacer sandwiched between the second PCB and the third PCB.

4. The antenna module of claim 1 , wherein:
the stacked PCBs are all single-layer PCBs having metallization on only one side.

5. The antenna module of claim 1 , wherein:
the support PCBs are all two-layer PCBs having metallization on opposing sides of each support PCB.

6. The antenna module of claim 1 , wherein:
the stacked PCBs have rectangular shapes that are coextensive.

7. The antenna module of claim 1 , wherein:
the signal connectors include first and second signal connectors; and
each support PCB includes respective signal and ground microstrip feeds to connect respective ones of the respective signal and ground connection pads of each radiator pair to a respective one of the first and second signal connectors and to the ground plane.

8. The antenna module of claim 7 , wherein:
each support PCB includes a two-layer PCB having the respective signal and ground microstrip feeds on opposing sides of the two-layer PCB.

9. The antenna module of claim 8 , wherein:
a ground microstrip feed of the respective signal and ground microstrip feed includes a ground pad soldered to the ground plane and a ground leg that extends from the ground pad to a ground connection pad of the respective signal and ground connection pads.

10. The antenna module of claim 1 , wherein:
the support PCBs crisscross each other along the axis.

11. The antenna module of claim 10 , wherein:
the support PCBs have complementary interlocking slots that extend along the axis where the support PCBs crisscross each other.

12. The antenna module of claim 1 , wherein:
the first radiator pair includes opposing first radiators respectively having first signal and ground connection pads;
the second radiator pair includes opposing second radiators respectively having second signal and ground connection pads;
the signal connectors include a first signal connector and a second signal connector; and
the support PCBs include:
a first support PCB having first signal and ground microstrip feeds to connect the first signal and ground connection pads to the first signal connector and the ground plane; and
a second support PCB having second signal and ground microstrip feeds to connect the second signal and ground connection pads to the second signal connector and the ground plane.

13. The antenna module of claim 12 , wherein:
the first support PCB is a first two-layer PCB having the first signal and ground microstrip feeds on opposing sides of the first two-layer PCB; and
the second support PCB is a second two-layer PCB having the second signal and ground microstrip feeds on opposing sides of the second two-layer PCB.

14. An antenna array comprising:
multiple antenna modules arrange in a matrix having N rows and M columns of the multiple antenna modules, wherein each antenna module includes:
stacked printed circuit boards (PCBs) (stacked PCBs) centered on an axis and including:
a first PCB having a ground plane;
a second PCB, spaced above the first PCB, having a first radiator pair and a second radiator pair that face the ground plane and orthogonally crisscross each other at the axis, each radiator pair having respective signal and ground connection pads adjacent to the axis to form a coincident phase center at the axis for each radiator pair;
a third PCB, spaced above the second PCB, for impedance matching; and
signal connectors extending through the first PCB; and

support PCBs extending from the ground plane to the second PCB, the support PCBs having microstrip feeds to connect the respective signal and ground connection pads of the first radiator pair and the second radiator pair to the signal connectors and to the ground plane.

15. The antenna array of claim 14 , further comprising:
a foam spacer sandwiched between the second PCB and the third PCB.

16. The antenna array of claim 14 , wherein:
the stacked PCBs are all single-layer PCBs having metallization on only one side.

17. The antenna array of claim 14 , wherein:
the support PCBs are all two-layer PCBs having metallization on opposing sides of each support PCB.

18. The antenna array of claim 14 , wherein:
the stacked PCBs have rectangular shapes that are coextensive.

19. The antenna array of claim 14 , wherein:
the signal connectors include first and second signal connectors; and
each support PCB includes respective signal and ground microstrip feeds to connect respective ones of the respective signal and ground connection pads of each radiator pair to a respective one of the first and second signal connectors and to the ground plane.

20. The antenna array of claim 19 , wherein:
each support PCB includes a two-layer PCB having the respective signal and ground microstrip feeds on opposing sides of the two-layer PCB.

Assignees

• L3Harris Technologies Inc

Inventors

• Rodriguez-Garcia Pedro
• Martin Joshua
• George Robert

Classifications

• H01Q21/065

  Patch antenna array · CPC title

• H01Q1/22

  by structural association with other equipment or articles · CPC title

• H01Q15/0053

  Selective devices used as spatial filter or angular sidelobe filter · CPC title

• H01Q21/0025

  Modular arrays · CPC title

• H01Q9/045 Primary

  with particular feeding means (for circular polarisation H01Q9/0428) · CPC title