Orientationless chip layout for a transaction card

US12314792B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12314792-B2
Application numberUS-202117167567-A
CountryUS
Kind codeB2
Filing dateFeb 4, 2021
Priority dateMay 9, 2019
Publication dateMay 27, 2025
Grant dateMay 27, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Various embodiments are generally directed to techniques to provide an orientationless transaction card. Embodiments include a transaction card having a substrate comprising one or more laminated layers and a chip comprising processing circuitry, and memory, the chip embedded within the substrate. The transaction card may also include a first contact pad coupled with the chip, the first contact pad embedded on a first side of the substrate at a first location and a second contact pad embedded on the first side of the substrate at a second location. Further, the transaction card includes an antenna embedded within the substrate, the antenna to couple the chip with the second contact pad.

First claim

Opening claim text (preview).

What is claimed is: 1. A transaction card, comprising: a substrate comprising a front side, and a back side, wherein the front side and the back side are opposite sides of the substrate; a chip comprising processing circuitry, and memory, the chip embedded within the substrate; a first contact pad coupled with the chip, the first contact pad comprising a first set of contacts configured to enable wired communications between the transaction card and a transaction device coupled via the first set of contacts, the first contact pad embedded on the front side of the substrate; a second contact pad coupled with the chip, the second contact pad comprising a second set of contacts configured to enable wired communications between the transaction card and the transaction device coupled via the second set of contacts, the second contact pad embedded on the back side of the substrate; wherein the first contact pad and the second contact pad are each spaced apart laterally from, and do not overlap with, the chip; and the transaction card further comprises: an antenna configured to communicate in accordance with a near-field communication (NFC) protocol, the antenna to physically couple the chip with the second contact pad and to physically couple the first contact pad with the second contact pad, wherein the antenna comprises a first end to physically couple with each contact of the first set of contacts and the chip, and a second end to physically couple with each contact of the second set of, wherein the antenna is a loop antenna comprising a plurality of loops, the plurality of loops including a first loop around the first contact pad, a second loop around the second contact pad, and a third loop around the first contact pad and the second contact pad. 2. The transaction card of claim 1 , wherein the antenna is embedded within at least one of a plurality of layers of the substrate; wherein at least a portion of the first contact pad or the second contact pad is not enclosed within any loop of the antenna; wherein the first end of the antenna extends to the second end of the antenna as one continuous wire; and wherein the first loop and the second loop extend closer towards a center of the transaction card than the third loop. 3. The transaction card of claim 1 , wherein the substrate comprises a plurality of laminated layers, the front side is a first layer of the plurality of the laminated layers, and the back side is a second layer of the plurality of the laminated layers. 4. The transaction card of claim 3 , wherein the chip is embedded in a third layer of the plurality of layers, and the antenna to couple the chip with the second contact pad through at least one layer of the plurality of layers. 5. The transaction card of claim 4 , wherein the first layer, the second layer, and the third layer, are all different layers of the plurality of layers of the substrate. 6. The transaction card of claim 1 , wherein the chip is located within a layer of a plurality of laminated layers of the substrate in a layer lower than the first contact pad. 7. The transaction card of claim 1 , wherein the first set of contacts is located on the front side of the substrate at a first location to couple with corresponding contact pads of a device. 8. The transaction card of claim 1 , wherein the second set of contacts is located on the back side of the substrate at a second location to couple with corresponding contact pads of a device. 9. The transaction card of claim 1 , wherein the processing circuitry is configured to process instructions to communicate with a device via the first contact pad or the second contact pad to perform transactions. 10. The transaction card of claim 9 , wherein the processing circuitry to send one or more signals to the device via the second contact pad via the antenna. 11. The transaction card of claim 9 , wherein the processing circuitry to detect the coupling between the second contact pad and the device via a signal received by the antenna physically coupled with the second contact pad. 12. The transaction card of claim 9 , wherein the substrate comprises a plurality of laminated layers composed of plastic, metal, or a combination thereof. 13. The transaction card of claim 9 , wherein the antenna is located within the substrate, and at least a portion of the antenna is within a specified distance of an edge of the transaction card. 14. A contactless card, comprising: a front side comprising a first contact pad comprising a first set of contacts; a back side comprising a second contact pad comprising a second set of contacts, wherein the front side and the back side are opposing sides, wherein the first contact pad and the second contact pad are configured to enable wired communications between the contactless card and a transaction device, via the first set of contacts and second set of contacts, respectively; a chip configured to process data, the chip coupled with the first contact pad and the second contact pad, wherein the first contact pad and the second contact pad are each spaced apart laterally from, and do not overlap with, the chip; and an antenna configured to communicate in accordance with a near-field communication (NFC) protocol, the antenna to couple the first contact pad with the second contact pad, and with the chip, wherein the antenna comprises a first end to physically couple with each contact of the first set of contacts, and a second end to physically couple with each contact of the second set of contacts, wherein the antenna is a loop antenna comprising a plurality of loops, the plurality of loops including a first loop around the first contact pad, a second loop around the second contact pad, and a third loop around the first contact pad and the second contact pad. 15. The contactless card of claim 14 , comprising a substrate comprising a plurality of laminated layers, wherein the front side is a first layer, and the back side is a second layer. 16. The contactless card of claim 15 , wherein the chip is located within a third layer of the plurality of laminated layers of the substrate. 17. The contactless card of claim 14 , wherein the first contact pad and the second contact pad are configured to enable communications in accordance with an Europay, Mastercard, and Visa (EMV) protocol. 18. The contactless card of claim 14 , wherein the antenna is embedded within at least one of a plurality of layers of a substrate. 19. The contactless card of claim 14 , wherein the antenna is disposed around a perimeter of the contactless card. 20. The contactless card of claim 14 , wherein at least a portion of the first contact pad or the second contact pad is not enclosed within any loop of the antenna; wherein the first end of the antenna extends to the second end of the antenna as one continuous wire; and wherein the first loop and the second loop extend closer towards a center of the transaction card than the third loop.

Assignees

Inventors

Classifications

  • G06K19/07Primary

    with integrated circuit chips · CPC title

  • External electrical contacts · CPC title

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Frequently asked questions

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What does patent US12314792B2 cover?
Various embodiments are generally directed to techniques to provide an orientationless transaction card. Embodiments include a transaction card having a substrate comprising one or more laminated layers and a chip comprising processing circuitry, and memory, the chip embedded within the substrate. The transaction card may also include a first contact pad coupled with the chip, the first contact…
Who is the assignee on this patent?
Capital One Services Llc
What technology area does this patent fall under?
Primary CPC classification G06K19/07. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue May 27 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).