B1+ mapping near metallic hardware

US12313710B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12313710-B2
Application numberUS-202318115610-A
CountryUS
Kind codeB2
Filing dateFeb 28, 2023
Priority dateMar 1, 2022
Publication dateMay 27, 2025
Grant dateMay 27, 2025

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  1. Title

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  2. Abstract

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  5. First independent claim

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  6. CPC / IPC classifications

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Abstract

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A method can include obtaining a scaling factor for a location proximate a metallic object by optimizing a function of an acquired dataset and a simulated dataset. The simulated dataset can include a first signal from a first pulse having a first excitation flip angle and a first refocusing flip angle. The simulated dataset can include a second signal from a second pulse having a second excitation flip angle and a second refocusing flip angle.

First claim

Opening claim text (preview).

What is claimed is: 1. A method, comprising: obtaining a scaling factor corresponding to a ratio of actual B 1 + to nominal B 1 + for a location proximate a metallic object by minimizing a function of an acquired dataset and a simulated dataset; and obtaining a B 1 + map for a region proximate the metallic object based on the scaling factor; wherein the simulated dataset comprises: a first signal from a first pulse having a first excitation flip angle and a first refocusing flip angle; and a second signal from a second pulse having a second excitation flip angle and a second refocusing flip angle. 2. The method of claim 1 , wherein the acquired dataset is generated according to a slice encoding for metal artifact correction (SEMAC) method. 3. The method of claim 1 , further comprising: sampling a first center of k y -k z space for the first pulse; and sampling a second center of k y -k z space for the second pulse. 4. The method of claim 1 , wherein the scaling factor is a first scaling factor and the location is a first location, the method further comprising: obtaining a second scaling factor for a second location proximate the metallic object by minimizing the function of the acquired dataset and the simulated dataset. 5. The method of claim 1 , wherein the simulated dataset comprises a third signal from a third pulse having a third excitation flip angle and a third refocusing flip angle. 6. The method of claim 1 , wherein: the simulated dataset comprises a third signal from a third pulse having a third excitation flip angle and a third refocusing flip angle; and the first excitation flip angle is 30° and the first refocusing flip angle is 90°, the second excitation flip angle is 60° and the second refocusing flip angle is 120°, and the third excitation flip angle is 90° and the third refocusing flip angle is 150°. 7. The method of claim 1 , wherein: the simulated dataset comprises: a third signal from a third pulse having a third excitation flip angle and a third refocusing flip angle; and a fourth signal from a fourth pulse having a fourth excitation flip angle and a fourth refocusing flip angle. 8. The method of claim 1 , wherein the first pulse is different from the second pulse. 9. The method of claim 1 , wherein the metallic object is an implant. 10. The method of claim 1 , wherein the acquired dataset is generated according to turbo-spin echo imaging. 11. The method of claim 1 , further comprising: estimating a spatial distribution of a B 1 + field for the region proximate the metallic object. 12. A magnetic resonance imaging system, comprising: at least one processor; and a memory, with computer code instructions stored thereon, the computer code instructions, when executed by the at least one processor, cause the at least one processor to: obtain a scaling factor corresponding to a ratio of actual B 1 + to nominal B 1 + for a location proximate a metallic object by minimizing a function of an acquired dataset and a simulated dataset; and obtain a B 1 + map for a region proximate the metallic object based on the scaling factor; wherein the simulated dataset comprises: a first signal from a first pulse having a first excitation flip angle and a first refocusing flip angle; and a second signal from a second pulse having a second excitation flip angle and a second refocusing flip angle. 13. The magnetic resonance imaging system of claim 12 , wherein the acquired dataset is generated according to a slice encoding for metal artifact correction (SEMAC) method. 14. The magnetic resonance imaging system of claim 12 , wherein the computer code instructions, when executed by the at least one processor, cause the at least one processor to: sample a first center of k y -k z space for the first pulse; and sample a second center of k y -k z space for the second pulse. 15. The magnetic resonance imaging system of claim 12 , wherein the scaling factor is a first scaling factor and the location is a first location, and wherein the computer code instructions, when executed by the at least one processor, cause the at least one processor to: obtain a second scaling factor for a second location proximate the metallic object by minimizing the function of the acquired dataset and the simulated dataset. 16. The magnetic resonance imaging system of claim 12 , wherein the simulated dataset comprises a third signal from a third pulse having a third excitation flip angle and a third refocusing flip angle. 17. The magnetic resonance imaging system of claim 12 , wherein the metallic object is an implant. 18. The magnetic resonance imaging system of claim 12 , wherein the acquired dataset is generated according to turbo-spin echo imaging.

Assignees

Inventors

Classifications

  • due to magnetic susceptibility variations · CPC title

  • using RF refocusing, e.g. RARE · CPC title

  • caused by a distortion of the RF magnetic field, e.g. spatial inhomogeneities of the RF magnetic field (G01R33/56509, G01R33/56518, G01R33/56536 take precedence) · CPC title

  • for optimal flip angle of RF pulses · CPC title

  • caused by acquiring plural, differently encoded echo signals after one RF excitation, e.g. correction for readout gradients of alternating polarity in EPI · CPC title

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What does patent US12313710B2 cover?
A method can include obtaining a scaling factor for a location proximate a metallic object by optimizing a function of an acquired dataset and a simulated dataset. The simulated dataset can include a first signal from a first pulse having a first excitation flip angle and a first refocusing flip angle. The simulated dataset can include a second signal from a second pulse having a second excitat…
Who is the assignee on this patent?
Siemens Healthineers Ag, Univ New York
What technology area does this patent fall under?
Primary CPC classification G01R33/246. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue May 27 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).