Temperature sensor and temperature measurement system

Patent metadata

Field	Value
Publication number	US-12313475-B2
Application number	US-202017596432-A
Country	US
Kind code	B2
Filing date	Apr 16, 2020
Priority date	Jun 26, 2019
Publication date	May 27, 2025
Grant date	May 27, 2025

Abstract

Provided are a temperature sensor and a temperature measurement system capable of improving processability and assemblability. The temperature sensor ( 1 ) is a temperature sensor configured to measure a temperature of a resin ( 120 ) filling a die ( 110 ) in a resin molding device ( 100 ). The temperature sensor ( 1 ) includes a metal sheath ( 10 ) having a bottomed tubular shape, a pair of thermocouple element wires ( 20 ) accommodated in the metal sheath ( 10 ), and an insulator ( 30 ) provided around the pair of thermocouple element wires ( 20 ) in the metal sheath ( 10 ), and the temperature sensor ( 1 ) is a grounded sheath thermocouple including a tip as a temperature measuring contact for the resin ( 120 ). Further, the temperature sensor ( 1 ) further includes a housing ( 40 ) covering a periphery of a tip portion of the metal sheath ( 10 ), and a tip of the metal sheath ( 10 ) has a planar shape.

First claim

The invention claimed is:

1. A temperature sensor configured to measure a temperature of a resin filling a die in a resin molding device, the temperature sensor comprising:
a metal sheath having a bottomed cylindrical shape;
a pair of thermocouple element wires accommodated in the metal sheath; and
an insulator provided around the pair of thermocouple element wires in the metal sheath, wherein
the temperature sensor is a grounded sheath thermocouple including a tip as a temperature measuring contact for the resin,
the temperature sensor further includes a housing covering a periphery of a tip portion of the metal sheath, and
a tip as one side surface of the metal sheath has a planar shape, wherein
the metal sheath comprises:
a columnar portion that functions as a temperature sensing portion that has a columnar shape and comprises the one side surface; and
a cylindrical portion that is provided upright from the columnar portion and that has a cylindrical shape, wherein

the columnar portion and the cylindrical portion are integrally formed of a same material, and wherein
each of the pair of the thermocouple element wires has one end side welded to another side surface of the columnar portion of the metal sheath.

2. The temperature sensor according to claim 1 , wherein
a diameter of a tip of the housing is equal to or less than 1 mm.

3. The temperature sensor according to claim 1 , wherein
one end side surface of the columnar portion of the metal sheath and a tip side surface of a tip portion of the housing are flush and wherein
the one end side surface and the tip side surface are welded together.

4. The temperature sensor according to claim 1 , wherein
at least a portion of the metal sheath is crimped to the housing.

5. A temperature measurement system, comprising:
the temperature sensor according to claim 1 , in the resin molding device; and
a temperature measurement unit configured to measure the temperature of the resin filling the die by using the temperature sensor.

Assignees

• Minebea Mitsumi Inc

Inventors

• Okamoto Takuma
• Shimoyama Ryota

Classifications

• G01K1/08 Primary

  Protective devices, e.g. casings · CPC title

• B29C2945/7626

  cavity walls · CPC title

• B29C2945/76257

  cavity · CPC title

• B29C2945/7604

  Temperature · CPC title

• B29C45/78

  of temperature · CPC title