MEMS switch and manufacture method

Patent metadata

Field	Value
Publication number	US-12312237-B2
Application number	US-202117777427-A
Country	US
Kind code	B2
Filing date	Jun 3, 2021
Priority date	Jun 3, 2021
Publication date	May 27, 2025
Grant date	May 27, 2025

Abstract

The present disclosure provides a flexible MEMS switch, including an MEMS body and a packaging body outside the MEMS body, the packaging body includes a first flexible cover plate and a second flexible cover plate arranged at two opposite sides of the MEMS body respectively, a first cavity is formed between the first flexible cover plate and the MEMS body, and a second cavity is formed between the second flexible cover plate and the MEMS body. The present disclosure further provides a method for manufacturing the flexible MEMS switch.

First claim

What is claimed is:

1. A flexible Micro-Electro-Mechanical System (MEMS) switch, comprising an MEMS body and a packaging body outside the MEMS body, wherein the packaging body comprises a first flexible cover plate and a second flexible cover plate, the first flexible cover plate and the second flexible cover plate are arranged at opposite sides of the MEMS body respectively, a first cavity is formed between the first flexible cover plate and the MEMS body, and a second cavity is formed between the second flexible cover plate and the MEMS body;
wherein the MEMS body comprises a flexible base substrate and a functional element on the flexible base substrate, the flexible base substrate comprises a first portion where the functional element is arranged and a second portion surrounding the first portion, the second portion is of an annular shape and coupled to the packaging body, the first portion comprises a plurality of side walls facing the second portion, the plurality of side walls comprises at least a first side wall, and a part of the first side wall in an extension direction of the first side wall is depressed in a direction away from the second portion to form a gap between the first side wall and the second portion.

2. The MEMS switch according to claim 1 , wherein the MEMS body is located at a neutral layer of the packaging body.

3. The MEMS switch according to claim 1 , wherein the plurality of side walls comprises the first side wall and a second side wall arranged symmetrically opposite to the first side wall.

4. The MEMS switch according to claim 1 , the plurality of side walls comprises a second side wall arranged opposite to the first side wall, a gap is formed between the second side wall and the second portion.

5. The MEMS switch according to claim 4 , wherein the plurality of side walls comprises a third side wall and a fourth side wall arranged symmetrically opposite to the third side wall.

6. The MEMS switch according to claim 1 , wherein the functional element comprises a first electrode, a second electrode and a third electrode arranged side-by-side and spaced apart from each other on the first portion, the second electrode is a signal transmission line, both the first electrode and the third electrode are grounded lines, the MEMS body further comprises a fourth electrode arranged at a side of the second electrode away from the flexible base substrate, and two ends of the fourth electrode are coupled to the first electrode and the third electrode respectively.

7. The MEMS switch according to claim 6 , wherein an insulation layer is arranged at a side of the second electrode away from the flexible base substrate.

8. A method for manufacturing the MEMS switch according to claim 1 , comprising forming an MEMS body, a first flexible cover plate and a second flexible cover plate, and enabling the first flexible cover plate and the second flexible cover plate to be coupled to the MEMS body at two opposite sides respectively.

9. The method according to claim 8 , wherein the forming the MEMS body comprises:
forming a flexible substrate on a rigid substrate;
depositing metal on the flexible substrate to form a first electrode, a second electrode and a third electrode arranged side-by-side and spaced apart from each other;
forming an insulation layer on the second electrode; forming a sacrificial layer on the insulation layer;
forming a fourth electrode on the sacrificial layer, two ends of the fourth electrode being coupled to the first electrode and the third electrode respectively; and
removing the sacrificial layer.

10. The method according to claim 9 , wherein the first flexible cover plate is formed through a same process as the second flexible cover plate, and the forming the first flexible cover plate comprises coating a flexible material on the rigid substrate and forming the first flexible cover plate through a photolithography process.

11. The method according to claim 10 , wherein the MEMS body comprises a flexible base substrate and a functional element on the flexible base substrate, and the flexible base substrate comprises a first portion where the functional element is arranged and a second portion surrounding the first portion,
wherein the enabling the first flexible cover plate and the second flexible cover plate to be coupled to the MEMS body at two opposite sides respectively comprises:
fastening the rigid substrate with the first flexible cover plate onto a first side of the MEMS body, and enabling an end surface of a side wall of the first flexible cover plate to be coupled to the second portion of the flexible base substrate;
removing the rigid substrate coupled to the MEMS body through a laser lift-off process;
fastening the rigid substrate with the second flexible cover plate onto a second side of the MEMS body opposite to the first side, and enabling an end surface of a side wall of the second flexible cover plate to be coupled to the second portion of the flexible base substrate; and
removing the rigid substrate coupled to the first flexible cover plate and the rigid substrate coupled to the second flexible cover plate through a laser lift-off process.

12. The MEMS switch according to claim 4 , wherein the functional element comprises a first electrode, a second electrode and a third electrode arranged side-by-side and spaced apart from each other on the first portion, the second electrode is a signal transmission line, both the first electrode and the third electrode are grounded lines, the MEMS body further comprises a fourth electrode arranged at a side of the second electrode away from the flexible base substrate, and two ends of the fourth electrode are coupled to the first electrode and the third electrode respectively.

Assignees

• Beijing Boe Technology Dev Co Ltd
• Boe Technology Group Co Ltd

Inventors

• Shi Yingli

Classifications

• H01H59/0009

  making use of micromechanics · CPC title

• B81B2203/0109

  Bridges · CPC title

• B81B2201/018

  Switches not provided for in B81B2201/014 - B81B2201/016 · CPC title

• B81B2201/016

  having a bridge fixed on two ends and connected to one or more dimples · CPC title

• H01P1/15

  by semiconductor devices · CPC title