Stretchable display panel and method for manufacturing same, and display device

Patent metadata

Field	Value
Publication number	US-12310225-B2
Application number	US-202117764440-A
Country	US
Kind code	B2
Filing date	Jun 8, 2021
Priority date	Jul 24, 2020
Publication date	May 20, 2025
Grant date	May 20, 2025

Abstract

Provided is a method for manufacturing a stretchable display panel. The method includes: forming an organic protection structure and an inorganic protection structure which are laminated on a rigid substrate; forming a flexible substrate on the inorganic protection structure; forming a plurality of pixel islands and inter-island connections for connecting adjacent pixel islands on the flexible substrate; forming an encapsulation layer on the pixel islands and the inter-island connections; and stripping off the rigid substrate.

First claim

What is claimed is:

1. A method for manufacturing a stretchable display panel, comprising:
forming an organic protective structure and an inorganic protective structure which are laminated on a rigid substrate;
forming a flexible substrate on the inorganic protective structure;
forming a plurality of pixel islands and inter-island connectors for connecting adjacent pixel islands on the flexible substrate, wherein the plurality of pixel islands and the inter-island connectors define hollow structures, and an orthographic projection of the hollow structure on the rigid substrate is within an orthographic projection of the organic protective structure on the rigid substrate and within an orthographic projection of the inorganic protective structure on the rigid substrate;
forming an encapsulation layer on the plurality of pixel islands and the inter-island connectors; and
stripping off the rigid substrate; and
wherein the hollow structure extends to the inorganic protective structure and is not in contact with the organic protective structure.

2. The method according to claim 1 , wherein the hollow structure comprises:
a first opening, and a second opening communicated with the first opening, wherein the first opening is closer to the rigid substrate than the second opening is, and an orthographic projection of the first opening on the rigid substrate is within an orthographic projection of the second opening on the rigid substrate.

3. The method according to claim 2 , wherein the first opening is sleeved in the second opening.

4. The method according to claim 2 , wherein a slope angle of a sidewall of the first opening is greater than a slope angle of a sidewall of the second opening.

5. The method according to claim 1 , wherein forming the organic protective structure and the inorganic protective structure which are laminated on the rigid substrate comprises:
forming an organic protective film and an inorganic protective film in sequence on the rigid substrate; and
performing a single patterning process on the inorganic protective film to form the organic protective structure and the inorganic protective structure on the rigid substrate.

6. The method according to claim 5 , wherein performing the single patterning process on the inorganic protective film to form the organic protective structure and the inorganic protective structure on the rigid substrate comprises:
forming a photoresist film on the inorganic protective film;
performing exposure and development on the photoresist film to form a photoresist pattern;
performing first etching on the inorganic protective film to form the inorganic protective structure with the photoresist pattern;
performing second etching on the organic protective film to form the organic protective structure with the photoresist pattern and the inorganic protective structure; and
removing the photoresist pattern to form the organic protective structure and the inorganic protective structure.

7. The method according to claim 1 , wherein stripping off the rigid substrate comprises:
stripping off the rigid substrate after carbonizing the organic protective structure and the flexible substrate.

8. The method according to claim 7 , wherein when the rigid substrate is stripped off, the organic protective structure, or the organic protective structure and the inorganic protective structure are also stripped off.

9. The method according to claim 1 , wherein forming the plurality of pixel islands and the inter-island connectors for connecting adjacent pixel islands on the flexible substrate comprises:
forming a plurality of functional layers on the flexible substrate; and
forming openings in the plurality of functional layers to form the plurality of pixel islands and the inter-island connectors, wherein the hollow structures penetrate the plurality of functional layers and the flexible substrate.

10. The method according to claim 9 , wherein the flexible substrate comprises a pixel region, and the pixel island is disposed in the pixel region; and
forming the plurality of functional layers on the flexible substrate comprises:
forming a plurality of display functional layers in the pixel region of the flexible substrate, the plurality of display functional layers being configured to form light-emitting devices in the plurality of pixel islands and drive circuits connected to the light-emitting devices; and
forming a plurality of connection functional layers in a region, other than the pixel region, of the flexible substrate, the plurality of connection functional layers being configured to form connection traces and trace protective structures in the inter-island connectors.

11. The method according to claim 10 , wherein the flexible substrate further comprises a connection region, and an inter-island connector is disposed in the connection region; and
forming the openings in the plurality of functional layers to form the plurality of pixel islands and the inter-island connectors comprises:
removing portions, other than the connection region, of the plurality of connection functional layers, and removing portions, other than the connection region and the pixel region, of the flexible substrate, to form the plurality of pixel islands and the island inter-connectors.

12. The method according to claim 1 , wherein after stripping off the rigid substrate, the method further comprises:
forming a protective film on a side, away from the encapsulation layer, of the flexible substrate.

13. The method according to claim 1 , wherein the inorganic protective structure is made of a metal material.

Assignees

• Boe Technology Group Co Ltd

Inventors

• Zhu Xiaoyan
• Xue Jinxiang

Classifications

• H10K59/873

  Encapsulations · CPC title

• H10K71/00

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• H10K50/844

  Encapsulations · CPC title

• H10K77/111 Primary

  Flexible substrates · CPC title

• H10K59/1201

  Manufacture or treatment · CPC title