Power conversion device

Patent metadata

Field	Value
Publication number	US-12309982-B2
Application number	US-202217967586-A
Country	US
Kind code	B2
Filing date	Oct 17, 2022
Priority date	Nov 15, 2021
Publication date	May 20, 2025
Grant date	May 20, 2025

Abstract

In a power conversion device, a semiconductor module, a bus bar assembly, and a smoothing capacitor are superposed on a cooler in the stated order from the cooler side. At least one of a cooling column-equipped member, which is at least one of the smoothing capacitor and the bus bar assembly, and the cooler is provided with a cooling column configured to transfer heat of the cooling column-equipped member to the cooler.

First claim

What is claimed is:

1. A power conversion device, comprising:
a semiconductor module;
a smoothing capacitor configured to smooth an input voltage to the semiconductor module;
a bus bar assembly configured to electrically connect at least two of the semiconductor module, the smoothing capacitor, and a power supply; and
a cooler; and
a cooling plate, which is connected to a cooling plate connection member being at least one of the smoothing capacitor and the bus bar assembly, and is connected to the cooler,
wherein the semiconductor module, the bus bar assembly, and the smoothing capacitor are superposed on the cooler in the stated order from the cooler side,
wherein at least one of a cooling column-equipped member, which is at least one of the smoothing capacitor and the bus bar assembly, and the cooler is provided with a cooling column configured to transfer heat of the cooling column-equipped member to the cooler, and
wherein at least a part of the cooling plate is embedded in the cooling plate connection member.

2. The power conversion device according to claim 1 , further comprising a module heat transfer member provided between the semiconductor module and the cooler.

3. The power conversion device according to claim 1 ,
wherein the cooling column is provided at the cooling column-equipped member, and
wherein a cooling column heat transfer member is provided between the cooling column and the cooler.

4. The power conversion device according to claim 1 ,
wherein the cooler includes a cooler main body,
wherein the cooler main body includes:
a bottom portion having a flat plate-like shape;
a flow passage defining portion, which protrudes from the bottom portion, and has a refrigerant flow passage;
a first receiving portion protruding from the bottom portion in the same direction as a direction in which the flow passage defining portion protrudes; and
a second receiving portion, which protrudes from the bottom portion in the same direction as the direction in which the flow passage defining portion protrudes, and is arranged farther from the flow passage defining portion than the first receiving portion is,

wherein each of the bus bar assembly and the smoothing capacitor is the cooling column-equipped member,
wherein the bus bar assembly is provided with a bus bar cooling column as the cooling column,
wherein the smoothing capacitor is provided with a capacitor cooling column as the cooling column,
wherein the bus bar cooling column is connected to the first receiving portion, and
wherein the capacitor cooling column is connected to the second receiving portion.

5. The power conversion device according to claim 1 , further comprising a first cooling plate heat transfer member provided between the cooling plate and the cooler.

6. The power conversion device according to claim 1 , further comprising a second cooling plate heat transfer member provided between the cooling plate and the cooling plate connection member.

7. The power conversion device according to claim 1 , wherein the cooling plate is made of a metal.

Assignees

• Mitsubishi Electric Corp

Inventors

• Kitagawa Shingo
• Sasaki Daisuke
• Ando Kohei
• Mizuno Yoshifumi
• Hirayama Yoshitsugu
• Inoue Hirofumi
• Uyama Koji

Classifications

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H02M7/003

  Constructional details, e.g. physical layout, assembly, wiring or busbar connections · CPC title

• H05K7/20254

  Cold plates transferring heat from heat source to coolant · CPC title

• H02M1/327

  against abnormal temperatures · CPC title

• H01G2/08

  Cooling arrangements; Heating arrangements; Ventilating arrangements · CPC title