Methods of making metal patterns on flexible substrate

Patent metadata

Field	Value
Publication number	US-12309939-B2
Application number	US-202418591060-A
Country	US
Kind code	B2
Filing date	Feb 29, 2024
Priority date	Jun 28, 2018
Publication date	May 20, 2025
Grant date	May 20, 2025

Abstract

Methods of making metal patterns on flexible substrates are provided. A releasable solid layer is selectively formed on a patterned surface of the flexible substrate by applying a liquid solution thereon. The releasable solid layer is transferred from the patterned surface to a transfer layer where the metal patterns are formed.

First claim

What is claimed is:

1. A method of forming a metal pattern, the method comprising:
providing a patterned surface, the patterned surface including one or more recessed features and one or more plateau features adjacent to the recessed features;
coating the patterned surface with a liquid solution to at least partially fill the recessed features;
solidifying the liquid solution to form a releasable solid layer in the recessed features;
providing a transfer layer to adhere to the patterned surface;
removing the transfer layer from the patterned surface to form a patterned construction on the transfer layer, the releasable solid layer being transferred from the patterned surface to the transfer layer and forming
(a) one or more protrusive features of the patterned construction, wherein the protrusive features of the patterned construction correspond to the recessed features of the patterned surface, and
(b) recesses which correspond to the plateau features of the patterned surface;

providing a metal layer on the patterned construction of the transfer layer; and
removing the releasable solid layer along with the metal layer thereon from the protrusive features of the patterned construction to form a metal pattern corresponding to the recesses of the patterned construction on the transfer layer.

2. The method of claim 1 , further comprising treating the patterned surface to form a release coating thereon.

3. The method of claim 1 , wherein the transfer layer comprises an adhesive layer which is a curing product of a curable liquid that is applied onto the patterned surface.

4. The method of claim 3 , wherein the transfer layer further comprises a flexible backing layer to support the adhesive layer.

5. The method of claim 1 , further comprising etching the patterned surface before providing the transfer layer.

6. The method of claim 1 , further comprising etching the patterned construction before providing the metal layer on the patterned construction.

7. The method of claim 1 , wherein the metal layer is provided by sputtering deposition with a tie layer.

8. The method of claim 1 , wherein the releasable solid layer and the metal layer thereon are removed by water washing.

9. The method of claim 1 , wherein the releasable solid layer and the metal layer thereon are removed by peeling.

10. The method of claim 1 , wherein the metal pattern corresponding to the recesses of the patterned construction on the transfer layer back-filled with a material that is index-matched to the patterned surface.

Assignees

• 3M Innovative Properties Company

Inventors

• Van Lengerich Henrik B
• Stay Matthew S
• Nelson Caleb T
• Tarnowski David J
• Rowe David J
• Kusilek Edwin L

Classifications

• H05K2203/0769

  Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure · CPC title

• H05K2201/09036

  Recesses or grooves in insulating substrate · CPC title

• H05K3/0014

  Shaping of the substrate, e.g. by moulding · CPC title

• H05K1/028

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

• H01B5/14

  comprising conductive layers or films on insulating-supports · CPC title