In-cell touch display panel
US-10606387-B2 · Mar 31, 2020 · US
US12309930B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12309930-B2 |
| Application number | US-202418621775-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 29, 2024 |
| Priority date | Feb 24, 2020 |
| Publication date | May 20, 2025 |
| Grant date | May 20, 2025 |
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A display apparatus includes a display panel, a touch layer, and a flexible printed circuit (FPC) including a main FPC and a bridge FPC. A third soldering region and a fourth soldering region of the bridge FPC are respectively soldered to a first soldering region and a second soldering region of the main FPC. Ends of each first touch connection line are electrically connected to a touch chip and a first touch lead. Ends of each second touch connection line are electrically connected to a pad on the second soldering region and a second touch lead. Ends of each third touch connection line are electrically connected to a pad on the first soldering region and the touch chip. Ends of each touch transfer line are electrically connected to a pad on the third soldering region and a pad on the fourth soldering region.
Opening claim text (preview).
What is claimed is: 1. A display apparatus, comprising: a display panel; a touch layer disposed on a light-exiting surface of the display panel, the touch layer including a plurality of first touch leads and a plurality of second touch leads; and a flexible printed circuit (FPC) bonded to the display panel, the FPC including a main FPC and a bridge FPC, wherein the main FPC includes: a first substrate having a first soldering region, a second soldering region and a bonding region, the bonding region being a region of the first substrate that is bonded to the display panel; the bonding region being provided therein with a bonding pin electrically connected to a first touch lead and another bonding pin electrically connected to a second touch lead, and the bonding pin and the another bonding pin being disposed at edges of both sides of the bonding region in a first direction; a plurality of pads disposed on the first soldering region and the second soldering region; a touch chip disposed on the first substrate; a plurality of first touch connection lines disposed on the first substrate, one end of each first touch connection line being electrically connected to the touch chip, and another end of each first touch connection line being electrically connected to a corresponding one of the plurality of first touch leads in the touch layer; a plurality of second touch connection lines disposed on the first substrate, one end of each second touch connection line being electrically connected to a corresponding pad on the second soldering region, and another end of each second touch connection line being electrically connected to a corresponding one of the plurality of second touch leads in the touch layer; and a plurality of third touch connection lines disposed on the first substrate, one end of each third touch connection line being electrically connected to a corresponding pad on the first soldering region, and another end of each third touch connection line being electrically connected to the touch chip; and the bridge FPC includes: a second substrate having a third soldering region and a fourth soldering region; another plurality of pads disposed on the third soldering region and the fourth soldering region, a pad on the third soldering region being soldered to another corresponding pad on the first soldering region, and a pad on the fourth soldering region being soldered to a corresponding pad on the second soldering region; and a plurality of touch transfer lines disposed on the second substrate, one end of each touch transfer line being electrically connected to a corresponding pad on the third soldering region, and another end of each touch transfer line being electrically connected to a corresponding pad on the fourth soldering region. 2. The display apparatus according to claim 1 , wherein the bridge FPC further includes: at least one shielding transfer line disposed on the second substrate, one end of each shielding transfer line being electrically connected to a corresponding pad on the third soldering region, and another end of each shielding transfer line being electrically connected to a corresponding pad on the fourth soldering region. 3. The display apparatus according to claim 2 , wherein the bridge FPC includes a plurality of shielding transfer lines; the plurality of shielding transfer lines at least includes two edge shielding transfer lines that are located on outermost sides; of the two edge shielding transfer lines, two ends of one edge shielding transfer line and two ends of another edge shielding transfer line are connected in sequence to form a loop; and the plurality of touch transfer lines are all located within the loop. 4. The display apparatus according to claim 3 , wherein the third soldering region and the fourth soldering region are both provided with M rows of pads thereon, M being greater than or equal to two (M≥2); of the two edge shielding transfer lines, the two ends of the one edge shielding transfer line are located on a side of a first row of pads away from a last row of pads on the third soldering region and a side of a first row of pads away from a last row of pads on the fourth soldering region, and are electrically connected to two pads that are farthest away from each other and located in the first row of pads on the third soldering region and in the first row of pads on the fourth soldering region, and the two ends of the another edge shielding transfer line are located on a side of the last row of pads away from the first row of pads on the third soldering region and a side of the last row of pads away from the first row of pads on the fourth soldering region, and are electrically connected to two pads that are farthest away from each other and located in the last row of pads on the third soldering region and in the last row of pads on the fourth soldering region; a pad, electrically connected to the one edge shielding transfer line, in the first row of pads on the third soldering region is electrically connected to a pad, electrically connected to the another edge shielding transfer line, in the last row of pads on the third soldering region; and a pad, electrically connected to the one edge shielding transfer line, in the first row of pads on the fourth soldering region is electrically connected to a pad, electrically connected to the another edge shielding transfer line, in the last row of pads on the fourth soldering region. 5. The display apparatus according to claim 2 , wherein the third soldering region and the fourth soldering region are both provided with M rows of pads thereon, M being greater than or equal to two (M≥2); and of a plurality of transfer lines on the second substrate, at least 2M pads are distributed between two transfer lines that are located on outermost sides; the plurality of transfer lines includes the plurality of touch transfer lines and the at least one shielding transfer line. 6. The display apparatus according to claim 2 , wherein the first soldering region and the second soldering region are arranged side by side in the first direction, the first direction being substantially parallel to an extending direction of a side edge of the main FPC proximate to the display panel. 7. The display apparatus according to claim 6 , wherein pads on the third soldering region and pads on the fourth soldering region are all arranged in a plurality of rows; at least one of the plurality of rows of pads on the third soldering region includes a plurality of pads arranged in the first direction, and at least one of the plurality of rows of pads on the fourth soldering region includes another plurality of pads arranged in the first direction; at least one of a plurality of transfer lines on the second substrate passes through a region other than both a region between a first row of pads and a last row of pads on the third soldering region and a region between a first row of pads and a last row of pads on the forth soldering region to be electrically connected to corresponding pads; the plurality of transfer lines include the plurality of touch transfer lines and the at least one shielding transfer line; or pads on the third soldering region and pads on the fourth soldering region are all arranged in a plurality of rows; at least one of the plurality of rows of pads on the third soldering region includes a plurality of pads arranged in the first direction, and at least one of the plurality of rows of pads on the fourth soldering region includes another plurality of pads arranged in the first direction; at least one of a plurality of transfer lines on the second substrate passes through a region other than both a region between a first row of pads and a last row of pads on the third soldering region and a region betw
Package configurations · CPC title
Interconnections, e.g. wiring lines or terminals · CPC title
Liquid Crystal display [LCD] · CPC title
Display · CPC title
Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components · CPC title
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