Thin film structure including method of manufacturing

US12308365B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12308365-B2
Application numberUS-202217844896-A
CountryUS
Kind codeB2
Filing dateJun 21, 2022
Priority dateJun 21, 2021
Publication dateMay 20, 2025
Grant dateMay 20, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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Provided are a thin film structure, a capacitor including the thin film structure, a semiconductor device including the thin film structure, and a method of manufacturing the thin film structure, in which the thin film structure may include: a first electrode thin film disposed on a substrate and including a first perovskite-based oxide; and a protective film disposed on the first electrode thin film and including a second perovskite-based oxide that is oxygen-deficient and includes a doping element. The thin film structure may prevent the deterioration of conductivity and a crystalline structure of a perovskite-based oxide electrode, which is a lower electrode, even in a high-temperature oxidizing atmosphere for subsequent dielectric film deposition.

First claim

Opening claim text (preview).

What is claimed is: 1. A thin film structure comprising: a first electrode thin film on a substrate and including a first perovskite-based oxide; and a protective film on the first electrode thin film and including a second perovskite-based oxide that is oxygen-deficient and comprises a doping element. 2. The thin film structure of claim 1 , wherein the second perovskite-based oxide is represented by Formula 1: X 1-a Z a YO 3-δ   Formula 1 wherein, in Formula 1, X is a divalent element, Y is a quadvalent element, Z is a doping element that, through doping, causes a biaxial strain ratio of the second perovskite-based oxide to be less than or equal to −1% and greater than or equal to −3%, and 0<a<1 and 0<δ<0.5. 3. The thin film structure of claim 2 , wherein X in Formula 1 is at least one element selected from Sr, Ca, and Ba. 4. The thin film structure of claim 2 , wherein Y in Formula 1 is at least one element selected from Ti, Zr, and Hf. 5. The thin film structure of claim 2 , wherein Z in Formula 1 is at least one of Ce, La, Pr, Sn, Ge, N, V. 6. The thin film structure of claim 2 , wherein a and δ in Formula 1 are respectively in a range of 0.01≥a≥0.5 and 0.05≥δ≥0.3. 7. The thin film structure of claim 1 , wherein the second perovskite-based oxide is represented by Formula 2: Sr 1-a Z′ a TiO 3-δ   Formula 2 wherein, in Formula 2, Z′ is at least one of Ce, La, Pr, Sn, Ge, N, V, and 0.01≥a≥0.5 and 0.05≥δ≥0.3. 8. The thin film structure of claim 1 , wherein the second perovskite-based oxide includes at least one of Sr 1-a Ce a TiO 3-δ , Sr 1-a La a TiO 3-δ , Sr 1-a Pr a TiO 3-δ , Sr 1-a Sn a TiO 3-δ , Sr 1-a Ge a TiO 3-δ , Sr 1-a N a TiO 3-δ , Sr 1-a V a TiO 3-δ , Sr 1-a Ce a ZrO 3-δ , Sr 1-a La a ZrO 3-δ , Sr 1-a Pr a ZrO 3-δ , Sr 1-a Sn a ZrO 3-δ , Sr 1-a Ge a ZrO 3-δ , Sr 1-a N a ZrO 3-δ , Sr 1-a V a ZrO 3-δ , Sr 1-a Ce a HfO 3-δ , Sr 1-a La a HfO 3-δ , Sr 1-a Pr a HfO 3-δ , Sr 1-a Sn a HfO 3-δ , Sr 1-a Ge a HfO 3-δ , Sr 1-a N a HfO 3-δ , Sr 1-a V a HfO 3-δ , Ca 1-a Ce a TiO 3-δ , Ca 1-a La a TiO 3-δ , Ca 1-a Pr a TiO 3-δ , Ca 1-a Sn a TiO 3-δ , Ca 1-a Ge a TiO 3-δ , Ca 1-a N a TiO 3-δ , Ca 1-a V a TiO 3-δ , Ca 1-a Ce a ZrO 3-δ , Ca 1-a La a ZrO 3-δ , Ca 1-a Pr a ZrO 3-δ , Ca 1-a Sn a ZrO 3-δ , Ca 1-a Ge a ZrO 3-δ , Ca 1-a N a ZrO 3-δ , Ca 1-a V a ZrO 3-δ , Ca 1-a Ce a HfO 3-δ , Ca 1-a La a HfO 3-δ , Ca 1-a Pr a HfO 3-δ , Ca 1-a Sn a HfO 3-δ , Ca 1-a Ge a HfO 3-δ , Ca 1-a N a HfO 3-δ , Ca 1-a V a HfO 3-δ , Ba 1-a Ce a TiO 3-δ , Ba 1-a La a TiO 3-δ , Ba 1-a Pr a TiO 3-δ , Ba 1-a Sn a TiO 3-δ , Ba 1-a Ge a TiO 3-δ , Ba 1-a N a TiO 3-δ , Ba 1-a V a TiO 3-δ , Ba 1-a Ce a ZrO 3-δ , Ba 1-a La a ZrO 3-δ , Ba 1-a Pr a ZrO 3-δ , Ba 1-a Sn a ZrO 3-δ , Ba 1-a Ge a ZrO 3-δ , Ba 1-a N a ZrO 3-δ , Ba 1-a V a ZrO 3-δ , Ba 1-a Ce a HfO 3-δ , Ba 1-a La a HfO 3-δ , Ba 1-a Pr a HfO 3-δ , Ba 1-a Sn a HfO 3-δ , Ba 1-a Ge a HfO 3-δ , Ba 1-a N a HfO 3-δ , or Ba 1-a V a HfO 3-δ , wherein, in the above formulae, a is greater than or equal to 0.01 to and less than or equal to 0.5, and δ is greater than or equal to 0.05 and less than or equal to 0.3. 9. The thin film structure of claim 1 , wherein a thickness of the protective film is 4.5 nanometers (nm) or greater and 1,000 nm or less. 10. The thin film structure of claim 1 , wherein the first perovskite-based oxide is at least one selected from compounds represented by Formulae 3 and 4: ABO 3   Formula 3 wherein, in Formula 3, A is at least one element selected from Sr, Ca, and Ba, and B is at least one element selected from Ru, Nb, V, Ti, Fe, and Co, La 1-a A a MO 3   Formula 4 in Formula 4, A is at least one element selected from Sr, Ca, and Ba, and M is at least one element selected from Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Al, and Ru. 11. The thin film structure of claim 1 , wherein the first perovskite-based oxide comprises at least one of SrRuO 3 , SrNbO 3 , SrVO 3 , CaRuO 3 , CaNbO 3 , CaVO 3 . 12. The thin film structure of claim 1 , wherein the substrate comprises a third perovskite-based oxide. 13. The thin film structure of claim 1 , wherein the substrate is a single crystalline substrate comprising at least one of SrTiO 3 , La-doped SrTiO 3 , Nb-doped SrTiO 3 , LaAlO 3 , KTaO 3 , LaSrAlO 4 , (LaAlO 3 ) 0.3 (Sr 2 TaAlO 6 ) 0.7 , YAlO 3 , DyScO 3 , TbScO 3 , GdScO 3 , EuScO 3 , SmScO 3 , NdScO 3 , PrScO 3 , CeScO 3 , LaScO 3 . 14. The thin film structure of claim 1 , wherein the first electrode thin film is a film having a property wherein a perovskite crystalline structure of the first electrode thin film is maintained after exposure to a high-temperature oxidizing environment of 300° C. or greater. 15. The thin film structure of claim 1 , further comprising: a dielectric material thin film on the protective film and comprising a fourth perovskite-based oxide. 16. The thin film structure of claim 15 , further comprising: a second electrode thin film comprising a fifth perovskite-based oxide, the second electrode thin film on the dielectric material thin film.

Assignees

Inventors

Classifications

  • the capacitor extending under or around the transistor · CPC title

  • having a storage electrode extension located over the transistor · CPC title

  • H10D1/684Primary

    the dielectrics comprising multiple layers, e.g. comprising buffer layers, seed layers or gradient layers · CPC title

  • H01L28/56Primary

    Electricity · mapped topic

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What does patent US12308365B2 cover?
Provided are a thin film structure, a capacitor including the thin film structure, a semiconductor device including the thin film structure, and a method of manufacturing the thin film structure, in which the thin film structure may include: a first electrode thin film disposed on a substrate and including a first perovskite-based oxide; and a protective film disposed on the first electrode thi…
Who is the assignee on this patent?
Samsung Electronics Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10D1/684. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 20 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).