Sensor having shield film covering main substrate for immunizing noise

Patent metadata

Field	Value
Publication number	US-12308188-B2
Application number	US-202117920808-A
Country	US
Kind code	B2
Filing date	Mar 2, 2021
Priority date	May 14, 2020
Publication date	May 20, 2025
Grant date	May 20, 2025

Abstract

A sensor includes: a receptacle connectable to an external plug; a second housing accommodating at least part of the receptacle; a main substrate on which an electronic component used for sensing is mounted; a shield film covering at least part of the main substrate and shielding an electromagnetic wave emitted from the main substrate and/or an electromagnetic wave to penetrate the main substrate from the outside; a first housing accommodating at least part of the main substrate and at least part of the shield film; a flexible substrate connecting the main substrate and the receptacle; and a protection member abutting on an end of the shield film from the side opposite to the main substrate, the end of the shield film facing the flexible substrate.

First claim

What is claimed is:

1. A sensor comprising:
a receptacle capable of being connected to an external plug;
a second housing in which at least a part of the receptacle is accommodated;
a main substrate on which an electronic component used for sensing is mounted;
a shield film covering at least a part of the main substrate and shielding at least one of an electromagnetic wave emitted from the main substrate and an electromagnetic wave to penetrate the main substrate from an outside;
a first housing in which at least a part of the main substrate and at least a part of the shield film are accommodated;
a flexible connection member connecting the main substrate and the receptacle; and
a protection member abutting on an end of the shield film from a side opposite to the main substrate, the end of the shield film facing the connection member.

2. The sensor according to claim 1 , further comprising a sealing resin that seals the electronic component used for sensing,
wherein the protection member has a cantilever structure in which one end of the protection member abuts on the end of the shield film, and another end is buried and fixed in the sealing resin.

3. The sensor according to claim 2 , further comprising a cylindrical insulating member fitted inside the second housing,
wherein the shield film comprises:
a winding part that is wound around the main substrate in a lateral direction intersecting a longitudinal direction of the main substrate, covers a part of a front surface and a part of a back surface of the main substrate, and covers a part of an end surface of the main substrate; and
a tongue part that protrudes from the winding part and covers only a part of the front surface and/or a part of the back surface of the main substrate,

wherein at least a part of the tongue part configures the end of the shield film facing the connection member, and overlaps the insulating member in a thickness direction of the main substrate.

4. The sensor according to claim 3 , wherein the protection member is made of a material having higher rigidity than the connection member.

5. The sensor according to claim 4 , wherein the protection member is made of an FR-4 grade laminate that conforms to ANSI standards.

6. The sensor according to claim 2 , wherein the protection member is made of a material having higher rigidity than the connection member.

7. The sensor according to claim 6 , wherein the protection member is made of an FR-4 grade laminate that conforms to ANSI standards.

8. The sensor according to claim 1 , further comprising a cylindrical insulating member fitted inside the second housing,
wherein the shield film comprises:
a winding part that is wound around the main substrate in a lateral direction intersecting a longitudinal direction of the main substrate, covers a part of a front surface and a part of a back surface of the main substrate, and covers a part of an end surface of the main substrate; and
a tongue part that protrudes from the winding part and covers only a part of the front surface and/or a part of the back surface of the main substrate,

wherein at least a part of the tongue part configures the end of the shield film facing the connection member, and overlaps the insulating member in a thickness direction of the main substrate.

9. The sensor according to claim 8 , wherein the protection member is made of a material having higher rigidity than the connection member.

10. The sensor according to claim 9 , wherein the protection member is made of an FR-4 grade laminate that conforms to ANSI standards.

11. The sensor according to claim 1 , wherein the protection member is made of a material having higher rigidity than the connection member.

12. The sensor according to claim 11 , wherein the protection member is made of an FR-4 grade laminate that conforms to ANSI standards.

13. A sensor comprising:
a main substrate on which an electronic component used for sensing is mounted;
a shield film covering at least a part of the main substrate and shielding at least one of an electromagnetic wave emitted from the main substrate and an electromagnetic wave to penetrate the main substrate from an outside;
a protection member abutting on an end of the shield film from a side opposite to the main substrate; and
a sealing resin that seals the electronic component used for sensing,
wherein the protection member has a cantilever structure in which one end of the protection member abuts on the end of the shield film, and another end is buried and fixed in the sealing resin.

Assignees

• Omron Tateisi Electronics Co

Inventors

• Kishimoto Yukitaka
• Nakayama Yusuke
• Ushiro Yuki
• Muramatsu Takashi
• Nishimori Naoki

Classifications

• G01S7/4813

  Housing arrangements · CPC title

• H05K9/0009

  with provisions to reduce EMI leakage through the joining parts · CPC title

• G01R33/02

  Measuring direction or magnitude of magnetic fields or magnetic flux (G01R33/20 takes precedence) · CPC title

• H05K9/00

  Screening of apparatus or components against electric or magnetic fields (devices for absorbing radiation from an antenna H01Q17/00) · CPC title

• G01R33/0047

  Housings or packaging of magnetic sensors (packaging of semiconductor devices H10W99/00); Holders · CPC title