Coil component using magnetic body and circuit board carrying same

Patent metadata

Field	Value
Publication number	US-12308149-B2
Application number	US-202318395027-A
Country	US
Kind code	B2
Filing date	Dec 22, 2023
Priority date	Feb 28, 2019
Publication date	May 20, 2025
Grant date	May 20, 2025

Abstract

A magnetic body is constituted by grains of a soft magnetic alloy bonded together via an oxide layer, wherein: the soft magnetic alloy is an alloy containing Si by 1 to 5.5 percent by mass, and Cr and/or Al by 0.2 to 4 percent by mass in total, as constituent elements, with Fe and unavoidable impurities accounting for the remainder, wherein a content of Si is more than a content of Cr and Al in total; and the oxide layer contains Si, as well as at least one of Fe, Cr, and Al, where, among Fe, Si, Cr, and Al, Si is contained in the largest quantity based on mass. The magnetic body can have high magnetic permeability.

First claim

What is claimed:

1. A coil component constituted by a conductor wound around a magnetic body constituted by grains of a soft magnetic alloy bonded together via an oxide layer, wherein:
the soft magnetic alloy is an alloy containing Si by 1 to 5.5 percent by mass, and Cr and/or Al by 0.2 to 4 percent by mass in total, as constituent elements, with Fe and unavoidable impurities accounting for a remainder, wherein a content of Si is more than a content of Cr and Al in total;
the oxide layer contains Si, as well as at least one of Fe, Cr, and Al, where, among Fe, Si, Cr, and Al, Si is contained in a largest quantity based on mass; and
the oxide layer has:
a first Si-rich area, which contains Si by at least three times as much as an element—among Fe, Cr, and Al—whose content is a second-highest to Si based on mass, and
a second Si-rich area which contains less Si than does the first Si-rich area, but contains more Si than each of Cr and Al,
wherein the first Si-rich area and the second Si-rich area are layered and provided between a first grain and a second grain which are immediately adjacent to each other where an area from the first grain to the second grain consists of the first Si-rich area and the second Si-rich area, wherein a first layer of the first Si-rich area contacts the first grain of the soft magnetic alloy, and a second layer of the first Si-rich area contacts the second grain of the soft magnetic alloy so that the second Si-rich area is sandwiched by the first layer of the first Si-rich area and the second layer of the first Si-rich area between the first grain and the second grain, and
more Si than each of Cr and Al, is contained over an entire thickness of the oxide layer where the oxide layer consists of the first layer of the first Si-rich area, the second layer of the first Si-rich area, and the second Si-rich area between the first grain and the second grain.

2. A circuit board carrying the coil component according to claim 1 .

3. The coil component according to claim 1 , wherein the content of Si based on mass in the first Si-rich area is ten times and more that of the element whose content is the second highest to Si.

4. The coil component according to claim 1 , wherein the oxide layer contains Si, Fe, and at least one of Cr and Al.

5. The coil component according to claim 4 , wherein the oxide layer contains Si, Fe, and Cr.

6. The coil component according to claim 4 , wherein the oxide layer contains Si, Fe, and Al.

7. The coil component according to claim 4 , wherein the oxide layer contains Si, Fe, Cr, and Al.

8. The coil component according to claim 1 , wherein the soft magnetic alloy contains Si by 1 to 5.5 percent by mass, and Cr by 0.5 to 4 percent by mass, as constituent elements, with Fe and unavoidable impurities accounting for a remainder.

9. The coil component according to claim 1 , wherein the soft magnetic alloy contains Si by 1 to 5.5 percent by mass, and Al by 0.2 to 1 percent by mass, as constituent elements, with Fe and unavoidable impurities accounting for a remainder.

10. The coil component according to claim 1 , wherein the soft magnetic alloy contains Si by 1 to 5.5 percent by mass, Cr by at least 0.5 percent by mass, and Al by at least 0.2 percent by mass, wherein a content of Cr and Al in total is no more than 4 percent by mass, as constituent elements, with Fe and unavoidable impurities accounting for a remainder.

Assignees

• Taiyo Yuden Kk

Inventors

• Orimo Yoko
• Takeoka Shinsuke

Classifications

• H01F41/0246

  Manufacturing of magnetic circuits by moulding or by pressing powder (magnetic cores made by moulding or by pressing powder H01F27/255; soft magnetic particles H01F1/20, H01F1/36) · CPC title

• H01F1/33

  mixtures of metallic and non-metallic particles; metallic particles having oxide skin · CPC title

• H01F1/28

  dispersed or suspended in a bonding agent · CPC title

• C22C33/0257

  characterised by the range of the alloying elements · CPC title

• C22C38/06

  containing aluminium · CPC title