Transaction card assembly

Patent metadata

Field	Value
Publication number	US-12307316-B2
Application number	US-202418435493-A
Country	US
Kind code	B2
Filing date	Feb 7, 2024
Priority date	Dec 1, 2021
Publication date	May 20, 2025
Grant date	May 20, 2025

Abstract

A modular transaction card assembly includes a card frame having the traditional dimensions of a credit card, and a transaction card that is smaller than a traditional card and that fits into a receptacle of the card frame. Each of the card frame and the transaction card may be capable of performing contactless data transactions individually. The combined assembly of the card frame with the transaction card secured in the receptacle is also capable of performing contact data transactions. The transaction card and/or the card frame may include one or more visual or tactile regions that allow the transaction card and card frame to be distinguished from other cards and/or to be properly oriented and aligned with one another when combined to form the card assembly.

First claim

What is claimed is:

1. A card assembly, comprising:
a transaction card comprising an integrated circuit and a first alignment region that comprises one or more of:
a first portion of a logo, or
a first textured portion; and

a card frame comprising a receptacle and a second alignment region that comprises one or more of:
a second portion of the logo, or
a second textured portion,

wherein the receptacle is configured to secure, enable removal of, and resecure the transaction card in the card frame; and
wherein, when the transaction card is secured in the receptacle, the first alignment region is aligned with the second alignment region to form a combined alignment region to indicate a correct orientation of the transaction card with the card frame.

2. The card assembly of claim 1 , wherein the integrated circuit is configured to perform a contactless financial transaction.

3. The card assembly of claim 1 , wherein the first portion of the logo comprises a first portion of a shape and the second portion of the logo forms a second portion of the shape.

4. The card assembly of claim 1 , wherein the logo is a textual logo.

5. The card assembly of claim 1 , wherein the logo is a graphical logo.

6. The card assembly of claim 1 , wherein the first textured portion comprises a first raised region relative to a thickness of the transaction card, and wherein the second textured portion comprises a second raised region relative to a thickness of the card frame.

7. The card assembly of claim 1 , wherein the first textured portion comprises a first recessed region relative to a thickness of the transaction card, and wherein the second textured portion comprises a second recessed region relative to a thickness of the card frame.

8. The card assembly of claim 1 , wherein:
the first textured portion comprises a first embossed region; and
the second textured portion comprises a second embossed region.

9. The card assembly of claim 1 , wherein the first textured portion and the second textured portion are substantially the same.

10. The card assembly of claim 1 , wherein the first alignment region comprises a first transparent region and the second alignment region comprises a second transparent region.

11. The card assembly of claim 1 , wherein the first textured portion and the second textured portion comprise different textures.

12. The card assembly of claim 1 , wherein:
the first textured portion comprises a first debossed region; and
the second textured portion comprises a second debossed region.

13. The card assembly of claim 1 , wherein the first alignment region is positioned on a surface of the surface of the transaction card and the second alignment region is positioned on a surface of the surface of the card frame.

14. The card assembly of claim 1 , wherein the correct orientation comprises the integrated circuit positioned to be engaged by a chip reader when the card assembly is inserted into a chip reader terminal.

15. The card assembly of claim 1 , wherein the combined alignment region comprises the logo.

16. A method comprising:
locating a first alignment region on a transaction card, the transaction card comprising an integrated circuit, and the first alignment region comprising one or more of:
a first portion of a logo, or
a first textured portion;

locating a second alignment region on a card frame, the card frame comprising a receptacle configured to secure, enable removal of, and resecure the transaction card in the card frame, and the second alignment region comprising one or more of:
a second portion of the logo, or
a second textured portion;

positioning, based on locating the first alignment region and the second alignment region, the transaction card within the receptacle of the card frame to form a card assembly;
aligning the first alignment region with the second alignment region; and
determining, based on aligning the first alignment region with the second alignment region, that an orientation of the transaction card with the card frame is correct.

17. The method of claim 16 , further comprising:
conducting a contactless financial transaction via the integrated circuit of the transaction card.

18. The method of claim 16 , wherein the first portion of the logo comprises a first portion of a shape and the second portion of the logo forms a second portion of the shape.

19. The method of claim 16 , wherein the first textured portion comprises a first raised region relative to a thickness of the transaction card, and wherein the second textured portion comprises a second raised region relative to a thickness of the card frame.

20. The method of claim 16 , wherein the first textured portion comprises a first recessed region relative to a thickness of the transaction card, and wherein the second textured portion comprises a second recessed region relative to a thickness of the card frame.

Assignees

• Capital One Services Llc

Inventors

• Vadrevu Vyjayanthi
• Atkins Phoebe
• Saia Michael

Classifications

• G06K19/07722

  the record carrier being multilayered, e.g. laminated sheets (flat articles in general, see B32B37/00) · CPC title

• G06K19/07747 Primary

  at least one of the integrated circuit chips being mounted as a module · CPC title