Sensor module, sensor module installation device, and mounting method of sensor module

Patent metadata

Field	Value
Publication number	US-12306139-B2
Application number	US-202217897451-A
Country	US
Kind code	B2
Filing date	Aug 29, 2022
Priority date	Mar 22, 2022
Publication date	May 20, 2025
Grant date	May 20, 2025

Abstract

A sensor module according to an embodiment includes a sensor; a sensor holder that holds the sensor and includes a pressing force application portion to apply a pressing force to press the sensor toward a measurement target object side; an adhesion portion that adheres the sensor holder to the measurement target object by an adhesion force; and a change mechanism that changes a relative magnitude relationship between the pressing force and the adhesion force.

First claim

What is claimed is:

1. A sensor module, comprising:
a sensor;
a sensor holder that holds the sensor and includes a pressing force application portion to apply a pressing force to press the sensor toward a measurement target object side;
an adhesion portion that adheres the sensor holder to the measurement target object by an adhesion force; and
a change mechanism that changes a relative magnitude relationship between the pressing force and the adhesion force.

2. The sensor module according to claim 1 ,
wherein the adhesion portion is an electrically peelable adhesive,
the electrically peelable adhesive includes a sheet portion and an electrode, and
the change mechanism is a voltage application portion that applies a voltage to the electrode to cause a current to flow through the sheet portion so as to lower the adhesion force.

3. A sensor module installation device, comprising:
the sensor module according to claim 1 ; and
a sensor module holding portion that holds the sensor module.

4. The sensor module installation device according to claim 3 , wherein the sensor module holding portion further includes a rod-shaped member that applies the pressing force to press the sensor toward the measurement target object side.

5. The sensor module installation device according to claim 3 , wherein the change mechanism further includes a blade that rotates to be inserted into the adhesion portion to decrease the adhesion force.

6. The sensor module installation device according to claim 3 , further comprises an operation portion that operates the change mechanism.

7. The sensor module installation device according to claim 3 , wherein the sensor module holding portion further includes a rod-shaped member that increases the pressing force.

8. A sensor module installation device, comprising:
a sensor module, comprising:
a sensor;
a sensor holder that holds the sensor and includes a pressing force application portion to apply a pressing force to press the sensor toward a measurement target object side; and
an adhesion portion that adheres the sensor holder to the measurement target object by an adhesion force; and

a sensor module holding portion that holds the sensor module and includes a change mechanism that changes a relative magnitude relationship between the pressing force and the adhesion force.

9. The sensor module installation device according to claim 8 ,
wherein the adhesion portion is an electrically peelable adhesive,
the electrically peelable adhesive includes a sheet portion and an electrode, and
the change mechanism is a voltage application portion that applies a voltage to the electrode to cause a current to flow through the sheet portion so as to lower the adhesion force.

10. The sensor module installation device according to claim 8 ,
wherein the pressing force application portion is a plunger, and
the change mechanism is a plunger holding portion that is connected to the plunger to apply a predetermined torque so as to increase the pressing force.

11. The sensor module installation device according to claim 8 ,
wherein the pressing force application portion includes an elastic body within a gas filled therein, and
the change mechanism is a heater that heats the gas to increase the pressing force.

12. A mounting method of a sensor module for mounting a sensor holder holding a sensor to a measurement target object, comprising:
a step of applying a pressing force to press the sensor to the measurement target object;
a step of adhering the sensor holder to the measurement target object by an adhesion force; and
a step of changing a relative magnitude relationship between the pressing force and the adhesion force.

Assignees

• Toshiba Kk

Inventors

• Takamine Hidefumi
• Hirokawa Junko
• Watabe Kazuo
• Kugimiya Tetsuya
• Ueno Keisuke
• Usui Takashi
• Li Yongfang
• Ueda Yuki

Classifications

• G01N29/04

  Analysing solids (using acoustic emission techniques G01N29/14) · CPC title

• G01N29/28

  providing acoustic coupling {, e.g. water (impedance matching G10K11/02)} · CPC title

• G01N29/223 Primary

  Supports, positioning or alignment in fixed situation (mounting transducers per se G10K11/004) · CPC title

• G01N29/14 Primary

  using acoustic emission techniques {(echo of particles G01N29/046; measuring mechanical vibrations or acoustic waves in solids in general G01H1/00)} · CPC title