Curable and hygroscopic resin composition for sealing electronic devices, resin cured material, and electronic device
US-2018208805-A1 · Jul 26, 2018 · US
US12305089B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12305089-B2 |
| Application number | US-202218063483-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 8, 2022 |
| Priority date | Jun 12, 2020 |
| Publication date | May 20, 2025 |
| Grant date | May 20, 2025 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
An object of the present invention is to provide a sealing method using a cover film where a problem of odor is not likely to occur and quick drying properties and sealability are high. The sealing method according to the present invention is a sealing method that is performed using at least a cover film and a sealing solvent, the cover film including a polymer layer provided on a transparent support, in which the sealing solvent is a solvent including at least one kind selected from the group consisting of an ester, an alcohol, a ketone, an ether, and an aromatic hydrocarbon, in a case where the sealing solvent is an ester, an alcohol, a ketone, or an ether, a boiling point of the sealing solvent is 80° C. to 170° C., and in a case where the sealing solvent is an aromatic hydrocarbon, a boiling point of the sealing solvent is 150° C. to 170° C.
Opening claim text (preview).
What is claimed is: 1. A sealing method for sealing a subject between a substrate and a cover film including a polymer layer provided on a transparent support comprising: disposing a sealing solvent between the substrate and the cover film, and laminating the cover film on a surface of the substrate on which the subject is placed such that a surface of the cover film on the polymer layer side faces the substrate, to bond the substrate and the cover film to each other, wherein the sealing solvent is a solvent including at least one kind selected from the group consisting of an ester having a boiling point of 80° C. to 170° C., an alcohol having a boiling point of 80°° C. to 170° C., a ketone having a boiling point of 80° C. to 170° C., an ether having a boiling point of 80° C. to 170° C., and an aromatic hydrocarbon having a boiling point of 150° C. to 170° C., a hydrogen bond element dH 1 in a Hansen solubility parameter of the sealing solvent is 2.5 to 15.0, and a polarity element dP 1 in the Hansen solubility parameter of the sealing solvent is 0.5 to 8.0. 2. The sealing method according to claim 1 , wherein a polymer in the polymer layer includes a repeating unit derived from at least one monomer selected from the group consisting of ethyl acrylate, n-butyl acrylate, methyl acrylate, cyclohexyl acrylate, benzyl acrylate, ethyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, t-butyl methacrylate, methyl methacrylate, cyclohexyl methacrylate, benzyl methacrylate, acetoacetoxy alkyl methacrylate, styrene, and dimethylacrylamide. 3. The sealing method according to claim 2 , wherein the polymer in the polymer layer consists of a repeating unit derived from at least one monomer selected from the group consisting of ethyl acrylate, n-butyl acrylate, methyl acrylate, cyclohexyl acrylate, benzyl acrylate, ethyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, t-butyl methacrylate, methyl methacrylate, cyclohexyl methacrylate, benzyl methacrylate, acetoacetoxy alkyl methacrylate, styrene, and dimethylacrylamide. 4. The sealing method according to claim 1 , wherein the polymer layer includes a silane coupling agent. 5. The sealing method according to claim 4 , wherein the silane coupling agent is selected from γ-glycidoxypropyltrimethoxysilane or N-β-(aminoethyl)-γ-aminopropyl methyldimethoxysilane. 6. The sealing method according to claim 1 , wherein the sealing solvent includes at least one selected from the group consisting of ethyl propionate, amyl acetate, propyl acetate, isopropyl acetate, butyl acetate, methyl lactate, dimethyl carbonate, 1-butanol, 1-propanol, 2-butanol, 1-pentanol, 2-pentanol, isoamyl alcohol, t- amyl alcohol, neopentyl alcohol, cyclopentanol, 2-hexanol, 4-methyl-2-pentanol, methyl isobutyl ketone, acetylacetone, cyclopentanone, n-butyl ether, 1,2-dimethoxyethane, dioxane, cyclopentyl methyl ether, 1-methoxy-2-propanol, 2-methoxy-1-methylethyl acetate, and 1,3,5- trimethylbenzene. 7. The sealing method according to claim 1 , wherein a hydrogen bond element dH 2 in a Hansen solubility parameter of a polymer in the polymer layer is 2.5 to 7.0, and a polarity element dP 2 in the Hansen solubility parameter of the polymer in the polymer layer is 2.5 to 7.0. 8. The sealing method according to claim 1 , wherein a refractive index of the transparent support is 1.460 to 1.560. 9. The sealing method according to claim 1 , wherein a material for forming the transparent support is triacetate cellulose. 10. The sealing method according to claim 1 , wherein a thickness of the transparent support is 50 to 150 um. 11. The sealing method according to claim 1 , wherein a total film thickness of the polymer layer and the transparent support is 150 μm or less. 12. The sealing method according to claim 1 , wherein a distance D in Hansen space is 8.0 or less, the distance D being calculated using Expression (1) from a hydrogen bond element dH 1 and a polarity element dP 1 in a Hansen solubility parameter of the sealing solvent and a hydrogen bond element dH 2 and a polarity element dP 2 in a Hansen solubility parameter of a polymer in the polymer layer, D={( d H 1 −d H 2 ) 2 +( d P 1 −d P 2 ) 2 } 1/2 (1).
Presence of (meth)acrylic polymer · CPC title
in the substrate · CPC title
in the pretreated surface to be joined · CPC title
organic · CPC title
Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.