Multi-step method for machining blind opening in ceramic component

US12304004B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12304004-B2
Application numberUS-202217898692-A
CountryUS
Kind codeB2
Filing dateAug 30, 2022
Priority dateSep 3, 2021
Publication dateMay 20, 2025
Grant dateMay 20, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of machining includes removing material from a target region of a ceramic component to form a blind opening in the ceramic component via removing a bulk of the material by a laser machining operation and then removing a remainder of the material by a mechanical machining operation.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of machining comprising: removing material from a target region of a ceramic component to form a blind opening in the ceramic component by: (i) removing a bulk of the material by a water-guided laser machining operation, and (ii) after (i), removing a remainder of the material by a mechanical machining operation. 2. The method as recited in claim 1 , wherein the blind opening has ratio of depth to width of 3:1 or greater. 3. The method as recited in claim 1 , wherein the mechanical machining operation is grinding. 4. The method as recited in claim 1 , wherein the mechanical machining operation is milling. 5. The method as recited in claim 1 , wherein a first rate of removal of the material in (i) is greater than a second rate of removal of the material in (ii). 6. The method as recited in claim 1 , wherein the blind opening is a blind channel. 7. A method of machining comprising: removing material from a target region of a ceramic component to form a blind opening in the ceramic component by: (i) removing a bulk of the material by a laser machining operation, and (ii) after (i), removing a remainder of the material by a mechanical machining operation, wherein the laser machining operation in (i) removes at least 75% of the material.

Assignees

Inventors

Classifications

  • combined with mechanical machining or metal-working covered by other subclasses than B23K · CPC title

  • Ceramics · CPC title

  • Turbines · CPC title

  • the fluid stream containing a liquid · CPC title

  • for deburring or mechanical trimming (B23K26/351 takes precedence) · CPC title

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Frequently asked questions

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What does patent US12304004B2 cover?
A method of machining includes removing material from a target region of a ceramic component to form a blind opening in the ceramic component via removing a bulk of the material by a laser machining operation and then removing a remainder of the material by a mechanical machining operation.
Who is the assignee on this patent?
Rtx Corp
What technology area does this patent fall under?
Primary CPC classification B23K26/386. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 20 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).