Additive manufacturing method, additive manufacturing system, and non-transitory computer-readable recording medium
US-2024408689-A1 · Dec 12, 2024 · US
US12303976B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12303976-B2 |
| Application number | US-202017633503-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 25, 2020 |
| Priority date | Aug 29, 2019 |
| Publication date | May 20, 2025 |
| Grant date | May 20, 2025 |
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A body and a table that is located on the body and allows powders to be laid thereon by a laying apparatus is disclosed. At least one layer is created by sintering or fusing the powders laid on the table, a part is produced by depositing the layers using an additive manufacturing method, at least one heat source assembly that is located on the body and applies heat treatment to the powders laid on the table, at least one sensor for measuring position and operating status of the heat source assembly, and at least one control unit controlling the heat source assembly based on data received from the sensor.
Opening claim text (preview).
The invention claimed is: 1. An additive manufacturing device comprising: a body; a table which is located on the body and allows powders to be laid thereon by a laying apparatus; at least one layer which is created by sintering or fusing the powders laid on the table; a part which is produced by depositing the layers using additive manufacturing; a heat source assembly which is located on the body and applies heat treatment to the powders laid on the table; a first sensor for measuring a position and an operating status of the heat source assembly; a control unit controlling the heat source assembly based on data received from the first sensor; a coating applied on the at least one layer by magnetic sputtering; a target material which allows atoms of the coating to be removed from a surface thereof when a process gas is collided onto the target material; a magnetic sputtering assembly which is located on the body and is triggered by the control unit so that the coating is applied on the at least one layer by magnetic sputtering; a positioner configured to position the magnetic sputtering assembly at different angles; a magnetic sputtering body housing the target material and the positioner; at least one adapter which is located on the body so that the magnetic sputtering assembly moves on the body; wherein a first end of the positioner is attached to the adapter and a second end thereof is attached to the magnetic sputtering body, wherein the positioner is configured to locate the magnetic sputtering assembly at a desired position and/or angle with respect to the table by moving along a south pole of a magnet in the magnetic supporting body; and wherein the magnetic sputtering assembly is configured so that the coating is applied by colliding the process gas onto the target material, removing atoms of the coating from the surface of the target material and depositing them on at least one layer, wherein the process gas becomes a high-energy positive ion by losing its electron as a result of colliding with free electrons moving in the magnetic field between the north pole and the south pole of the magnet. 2. The additive manufacturing device according to claim 1 , comprising a second sensor for measuring a position and an operating status of the magnetic sputtering assembly. 3. The additive manufacturing device according to claim 2 , wherein the control unit controls application of the coating on at least one layer by magnetic sputtering assembly using data received from the second sensor. 4. The additive manufacturing device according to claim 1 , comprising: a reflecting assembly which enables the body to be vacuumed by a pressure regulator, and enables a laser or an electron beam reflected onto the reflecting assembly from the heat source assembly to be directed to the powders on the table by triggering, by the control unit, the magnetic sputtering assembly and the heat source assembly which were stopped by the control unit. 5. The additive manufacturing device according to claim 1 , wherein the magnetic sputtering assembly is configured to perform a magnetic sputtering process with serial sputtering or co-sputtering. 6. The additive manufacturing device according to claim 1 , wherein the magnetic sputtering assembly is configured to apply a hybrid coating by using at least two different types of the target material. 7. The additive manufacturing device according to claim 1 , wherein the magnetic sputtering assembly is configured to apply a hybrid coating that is created by depositing at least one nano-sized layer and at least one other nano-sized layer coatings on top of each other in an order predetermined by a user. 8. The additive manufacturing device according to claim 1 , comprising at least two target materials, one of the at least two target materials being sputtered before another of the at least two target materials by magnetic sputtering. 9. The additive manufacturing device according to claim 1 , wherein the target material contains at least two different types of materials with miscible properties; and a plane on which the table is located, wherein the movement assembly allows the heat source assembly to move thereon after the heat source assembly is triggered by the control unit, and allows the magnetic sputtering assembly to move thereon after the magnetic sputtering assembly is triggered by the control unit. 10. The additive manufacturing device according to claim 1 , comprising at least one power supplier which energizes the heat source assembly and/or triggers free electrons in the magnetic field. 11. The additive manufacturing device according to claim 1 , comprising: a first protective cover located on the body and having an opened position that allows the heat source assembly to apply the heat treatment to the powders, and a closed position, wherein the first protective cover is brought from the opened position to the closed position after being triggered by the control unit, and wherein the first protective cover prevents transmission of heat from the heat source assembly to the powders and is located on the body facing the heat source assembly when in the closed position (II); and at least one connecting element which is located on the body and allows the first protective cover to be located on the body in a movable manner. 12. The additive manufacturing device according to claim 1 , comprising: a second protective cover located on the body and having an opened position that allows the magnetic sputtering assembly to apply the coating on the layer, and a closed position, wherein the second protective cover is brought from the opened position to the closed position after being triggered by the control unit, and wherein the second protective cover prevents applying the coating on the layer by the magnetic sputtering assembly and is located on the body facing the magnetic sputtering assembly when in the closed position; and a connecting element which is located on the body and allows the second protective cover to be located on the body in a movable manner. 13. The additive manufacturing device according to claim 1 , comprising at least one movement assembly which is provided on the body of the heat source assembly such that it is almost parallel to a plane on which the table is located, wherein the movement assembly allows the heat source assembly to move thereon after the heat source assembly is triggered by the control unit, and allows the magnetic sputtering assembly to move thereon after the magnetic sputtering assembly is triggered by the control unit. 14. The additive manufacturing device according to claim 13 , comprising at least one channel which is provided on the body and allows the movement assembly to move therein when the movement assembly is triggered by the control unit.
Treatment of workpieces or articles during build-up, e.g. treatments applied to fused layers during build-up · CPC title
of energy beam parameters · CPC title
Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title
Processes of additive manufacturing · CPC title
Use of magnetic field · CPC title
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