Modular air cooling device and cooling system

Patent metadata

Field	Value
Publication number	US-12302535-B2
Application number	US-202418772829-A
Country	US
Kind code	B2
Filing date	Jul 15, 2024
Priority date	Jan 14, 2022
Publication date	May 13, 2025
Grant date	May 13, 2025

Abstract

The embodiments of the present disclosure provide a modular cooling device and a cooling system. The device includes: an air cooling box adapted to sealingly receive a predetermined number of electronic devices to be cooled; and a heat exchange unit coupled to the air cooling box and comprising: a housing sealingly enclosing a heat exchange chamber, the heat exchange chamber sealingly connecting with an interior of the air cooling box to allow air to circulate between the interior of the air cooling box and the heat exchange chamber as an effect of fans of the electronic devices; and a heat exchanger arranged in the heat exchange chamber and comprising paths for enabling circulating air to circulate; and a cooling interface at least partly arranged on the housing and adapted to allow a cooling medium to circulate between an external cold source and an interior of the heat exchanger.

First claim

We claim:

1. A modular air cooling device, comprising:
an air cooling box adapted to sealingly receive a predetermined number of electronic devices to be cooled; and
a heat exchange unit coupled to the air cooling box and comprising:
a housing sealingly enclosing a heat exchange chamber, the heat exchange chamber sealingly connecting with an interior of the air cooling box to allow air to circulate between the interior of the air cooling box and the heat exchange chamber as an effect of fans of the electronic devices;
a heat exchanger arranged in the heat exchange chamber and comprising a path for enabling circulating air to circulate;
a cooling interface at least partly arranged on the housing and adapted to allow a cooling medium to circulate between an external cold source and an interior of the heat exchanger to cool air flowing through the heat exchange; and
a chiller arranged in the heat exchange chamber and connected between the cooling interface and the heat exchanger to adjust a temperature of the cooling medium entering the heat exchanger from the external cold source below a predetermined temperature.

2. The modular air cooling device of claim 1 , further comprising:
a mount rack for adopting the air cooling box and the heat exchange unit such that the heat exchange unit is arranged to a side of the air cooling box adjacently to the air cooling box.

3. The modular air cooling device of claim 1 , wherein the heat exchange unit is detachably adopted in the mount rack.

4. The modular air cooling device of claim 1 , wherein the predetermined number of electronic devices is arranged in the air cooling box along an arrangement direction, and
the air cooling box and the heat exchange unit are arranged along the arrangement direction, and a width of the modular air cooling device in the arrangement direction is not greater than 1.5 times a height (H) of the modular air cooling device.

5. The modular air cooling device of claim 4 , wherein the width (W) of the modular air cooling device in the arrangement direction is less than the height (H) of the modular air cooling device.

6. The modular air cooling device of claim 4 , wherein the width (W) of the modular air cooling device is less than half of the height (H) of the modular air cooling device in the arrangement direction.

7. The modular air cooling device of claim 1 , further comprising:
a circulation through hole arranged between the air cooling box and the heat exchange chamber to allow the air to circulate between the air cooling box the heat exchange chamber.

8. The modular air cooling device of claim 7 , wherein the circulation through hole comprises:
an upper opening arranged on a top of the electronic devices or extending to a part above the top of the electronic devices in a vertical direction; and
a lower opening arranged on a top of the electronic devices or extending to a part below the top of the electronic devices in the vertical direction.

9. The modular air cooling device of claim 1 , wherein the cooling interface comprises at least two sets of cooling interfaces.

10. The modular air cooling device of claim 1 , wherein the air cooling box comprises:
an air cooling groove configured to adopt the predetermined number of the electronic devices and comprising a top opening for operating the electronic devices; and
a cover body coupled to the air cooling groove to seal a top opening of the air cooling groove.

11. The modular air cooling device of claim 10 , wherein the air cooling groove further comprises a bottom opening and a baffle sealingly covering the bottom opening, and
the cover body and the baffle are capable to be opened automatically or manually to achieve emergency heat dissipation via the top opening and the bottom opening.

12. The modular air cooling device of claim 10 , wherein the cover body is rotatably coupled to the air cooling groove via a hinge.

13. A cooling system for an electronic device, comprising:
at least one of the modular air cooling device; and
a cooling medium circulation device coupled to a cooling interface of the at least one modular air cooling device and adapted to allow the cooling medium to circulate between an external cold source and the heat exchanger,
wherein the modular air cooling device comprises:
an air cooling box adapted to sealingly receive a predetermined number of electronic devices to be cooled; and
a heat exchange unit coupled to the air cooling box and comprising:
a housing sealingly enclosing a heat exchange chamber, the heat exchange chamber sealingly connecting with an interior of the air cooling box to allow air to circulate between the interior of the air cooling box and the heat exchange chamber as an effect of fans of the electronic devices;
a heat exchanger arranged in the heat exchange chamber and comprising a path for enabling circulating air to circulate;
a cooling interface at least partly arranged on the housing and adapted to allow a cooling medium to circulate between an external cold source and an interior of the heat exchanger to cool air flowing through the heat exchange; and
a chiller arranged in the heat exchange chamber and connected between the cooling interface and the heat exchanger to adjust a temperature of the cooling medium entering the heat exchanger from the external cold source below a predetermined temperature.

14. The cooling system of claim 13 , wherein the at least one modular air cooling device comprises a plurality of modular air cooling devices, and
the cooling system further comprises a plurality of reserved interfaces, the plurality of reserved interfaces being adapted to be coupled to the cooling interface.

15. The cooling system of claim 14 , further comprising:
a base comprising a plurality of adaption portions arranged at predetermined positions, the base being for arrangements of the plurality of modular air cooling devices, the plurality of adaption portions being corresponded to the plurality of reserved interfaces.

16. The cooling system of claim 13 , further comprising:
a plurality of immersion liquid cooling devices, each immersion liquid cooling device being adapted to cool the electronic device immersed therein, and having a size identical to a size of the modular air cooling device, and each immersion liquid cooling device being adapted to be arranged in the cooling system interchangeably with the modular air cooling device.

17. The cooling system of claim 13 , wherein the cooling medium comprises deionized water.

18. A cooling system with a large-scale cluster deployment, comprising:
a base comprising a plurality of adaption portions arranged at predetermined positions;
a plurality of reserved interfaces corresponding to the positions of the plurality of adaption portions;
an auxiliary cooling device configured between the plurality of reserved interfaces and an external cold source;
a plurality of the modular air cooling devices arranged in a part of the plurality of adaption portions, cooling interfaces of the modular air cooling devices being coupled to the plurality of reserved interfaces; and
a plurality of immersion liquid cooling devices arranged in another part of the plurality of adaption portions and each comprising a cold source interface coupled to the reserved interface,
wherein the modular air cooling device comprises:
an air cooling box adapted to sealingly receive a predetermined number of electronic devices to be cooled; and
a heat exchange unit coupled to the air cooling box and comprising:
a housing sealingly enclos

Assignees

• Beijing Bytedance Network Tech Co Ltd

Inventors

• Wang Jian
• Lin Bin
• Lv Zhichao
• Wang Shifeng
• Wang Yulong
• Wang Ruidong

Classifications

• H05K7/20781

  within cabinets for removing heat from server blades · CPC title

• H05K7/20236

  by immersion · CPC title

• H05K7/20154

  Heat dissipaters coupled to components · CPC title

• H05K7/20172

  Fan mounting or fan specifications · CPC title

• H05K7/20754

  Air circulating in closed loop within cabinets · CPC title