Thin film-based microfluidic electronic device, method of forming thereof, and skin and tissue adhesive applications

Patent metadata

Field	Value
Publication number	US-12302505-B2
Application number	US-202017784135-A
Country	US
Kind code	B2
Filing date	Dec 10, 2020
Priority date	Dec 10, 2019
Publication date	May 13, 2025
Grant date	May 13, 2025

Abstract

There is provided a method of forming a thin film-based microfluidic electronic device. The method includes: providing a first elastomeric thin film layer on a substrate; depositing a first elastomer on the first elastomeric thin film by direct ink writing to form an elastomeric structure configured to define a microfluidic channel on the first elastomeric thin film layer; providing a second elastomeric thin film layer over the elastomeric structure to cover the microfluidic channel; providing a sacrificial layer on the second elastomeric thin film; depositing liquid metal into the microfluidic channel to form a conductor in the microfluidic channel; and electrically connecting the conductor to an electronic component. The thin film-based microfluidic electronic device is a tissue or skin adhesive sensor including a skin adhesive acoustic device.

First claim

What is claimed is:

1. A method of forming a thin film-based microfluidic electronic device, the method comprising:
providing a first elastomeric thin film layer on a substrate;
depositing a first elastomer on the first elastomeric thin film layer by direct ink writing to form an elastomeric structure configured to define a microfluidic channel on the first elastomeric thin film layer;
providing a second elastomeric thin film layer over the elastomeric structure to cover the microfluidic channel;
providing a sacrificial layer on the second elastomeric thin film layer;
depositing liquid metal into the microfluidic channel to form a conductor in the microfluidic channel covered by the second elastomeric thin film layer which is supported by the sacrificial layer; and
electrically connecting the conductor to an electronic component and removing the sacrificial layer to form the thin film-based microfluidic electronic device.

2. The method according to claim 1 , wherein the first elastomer comprises an elastomeric adhesive material.

3. The method according to claim 2 , wherein the elastomeric adhesive material comprises a silicone sealant.

4. The method according to claim 3 , wherein the first elastomeric thin film layer and the second thin film layer of the elastomer comprises silicone elastomers.

5. The method according to claim 1 , wherein the sacrificial layer comprises a liquid soluble layer.

6. The method according to claim 5 , wherein the sacrificial layer is removed after depositing the liquid metal into the microfluidic channel by dissolving the sacrificial layer in a liquid.

7. The method according to claim 1 , further comprising embedding a portion of the electronic component in a portion of the elastomeric structure during formation of the elastomeric structure.

8. The method according to claim 7 :
wherein said embedding the portion of the electronic component in the portion of the elastomeric structure comprises disposing the electronic component on a portion of the first elastomer; and
further comprising depositing a second elastomer over the first elastomer and the electronic component by direct ink writing to form the elastomeric structure having the electronic component embedded in a portion of elastomeric structure.

9. The method according to claim 1 , further comprising embedding a portion of a conductive element in the microfluidic channel during formation of the elastomeric structure, the conductive element configured to electrically connect the conductor and the electronic component.

10. The method according to claim 1 , wherein the electronic component comprises an integrated circuit chip.

11. The method according to claim 1 , wherein the electronic component comprises light emitting diode (LED) chips.

12. The method according to claim 1 , wherein the elastomeric structure is configured to define the microfluidic channel having a shape of a coil; and said depositing liquid metal into the microchannel forms an antenna coil in the microfluidic channel.

13. The method according to claim 1 , wherein the liquid metal comprises a Gallium-based liquid metal alloy.

14. The method according to claim 13 , wherein the Gallium-based liquid metal alloy comprises Galinstan.

15. The method according to claim 1 ,
wherein said providing the first elastomeric thin film layer further comprises:
forming a supporting layer on a base;
depositing uncured elastomer on the base;
performing thermal treatment on the uncured elastomer to form the first elastomeric thin film layer;
forming a support frame on the first elastomeric thin film layer; and
removing the supporting layer from the first elastomeric thin film layer, the first elastomeric thin film layer being free standing.

16. The method according to claim 1 , wherein said providing the first elastomeric thin film layer on a substrate comprises spin coating uncured elastomer on the substrate and performing thermal treatment to the uncured elastomer to form the first elastomeric thin film layer.

17. The method according to claim 1 , further comprising removing the substrate from the first elastomeric thin film layer to form a free-standing thin film-based microfluidic electronic device.

18. The method according to claim 17 , further comprising coating the free-standing thin film-based microfluidic electronic device with a bio-adhesive material for attaching the free-standing thin film-based microfluidic electronic device to a tissue.

19. The method according to claim 1 , further comprising:
providing a skin-adhesive patch on the substrate;
said providing the first elastomeric thin film layer on the substrate comprises providing the first elastomeric thin film layer on the skin-adhesive patch; and
removing the substrate from the skin-adhesive patch and the first elastomeric thin film layer from to form a free-standing skin-adhesive thin film-based microfluidic electronic device.

Assignees

• Univ Singapore Technology & Design

Inventors

• Yamagishi Kento
• Ching Tsz Him
• Hashimoto Michinao
• Koshika Hiroto

Classifications

• H05K3/30

  Assembling printed circuits with electric components, e.g. with resistors · CPC title

• H05K1/182

  associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] · CPC title

• H05K1/092

  Dispersed materials, e.g. conductive pastes or inks · CPC title

• H05K1/0283

  Stretchable printed circuits · CPC title

• H04R2460/13

  Hearing devices using bone conduction transducers · CPC title