Cooling device for an electronics module
US-2019343019-A1 · Nov 7, 2019 · US
US12300435B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12300435-B2 |
| Application number | US-202217695386-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 15, 2022 |
| Priority date | Jun 1, 2021 |
| Publication date | May 13, 2025 |
| Grant date | May 13, 2025 |
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Official abstract text for this publication.
The present disclosure provides a capacitor module including: a capacitor; a first housing having a hexahedron shape and having an inner space in which the capacitor is disposed, the first housing including a pair of cooling parts recessed inwards from a pair of parallel surfaces among outer side surfaces thereof such that a refrigerant flows, a pair of cooling channels disposed inside opposite side surfaces perpendicular to the surfaces of the pair of cooling parts such that the pair of cooling parts communicate with each other, and a through-hole configured to connect each of the cooling channels to the outside such that the refrigerant is introduced or discharged therethrough; and a cooling plate coupled to the first housing so as to seal the cooling parts.
Opening claim text (preview).
What is claimed is: 1. A capacitor module comprising: a capacitor; a first housing having an inner space in which the capacitor is disposed, the first housing comprising a pair of cooling parts recessed inwards from a pair of parallel surfaces among outer side surfaces thereof such that a refrigerant flows, a pair of cooling channels disposed inside opposite side surfaces perpendicular to the surfaces of the pair of cooling parts such that the pair of cooling parts communicate with each other, and a through-hole configured to connect each of the cooling channels to the outside such that the refrigerant is introduced or discharged therethrough; and a pair of cooling plates coupled to the first housing so as to seal the cooling parts. 2. The capacitor module of claim 1 , wherein the inner space of the first housing has an open upper portion configured to allow the capacitor to be inserted through the upper portion of the first housing to the inner space. 3. The capacitor module of claim 2 , wherein the capacitor comprises electrodes extending upwards and configured to be electrically connectable. 4. The capacitor module of claim 1 , wherein the cooling plates comprise one or more cooling fins extending into the cooling parts to be in contact with the refrigerant. 5. The capacitor module of claim 1 , further comprising a nipple connected to the through-hole and extending to the outside of the first housing such that the refrigerant is introduced from the outside or discharged to the outside. 6. The capacitor module of claim 1 , wherein the first housing has a hexahedron shape.
Cold plates transferring heat from heat source to coolant · CPC title
Liquid coolant without phase change · CPC title
Liquid coolant without phase change · CPC title
Constructional details, e.g. physical layout, assembly, wiring or busbar connections · CPC title
Housing; Encapsulation · CPC title
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