Communication tag and electronic device

Patent metadata

Field	Value
Publication number	US-12299517-B2
Application number	US-202218695334-A
Country	US
Kind code	B2
Filing date	Aug 25, 2022
Priority date	Sep 28, 2021
Publication date	May 13, 2025
Grant date	May 13, 2025

Abstract

The present disclosure relates to communication tags and electronic devices. One example communication tag includes a circuit board and a chip disposed on the circuit board. Two coils are formed on the circuit board. The two coils are respectively disposed on two different conducting layers of the circuit board. Optionally, the two coils are disposed in an intersecting manner. In addition, lines for feeding the two coils are disposed close to each other.

First claim

What is claimed is:

1. A communication tag, comprising:
a circuit board, wherein the circuit board comprises a first coil and a second coil, the first coil and the second coil are located on different conducting layers on the circuit board, and a current on the first coil and a current on the second coil have a same direction; and
a chip, wherein the chip is disposed on the circuit board, the chip comprises a first port and a second port, and a polarity of the first port is opposite to a polarity of the second port, wherein:
the circuit board comprises a first conducting layer and a second conducting layer, the chip, the first conducting layer, and the second conducting layer form a coil feeding circuit, and the coil feeding circuit comprises a first feeding end, a second feeding end, a third feeding end, and a fourth feeding end;
the first feeding end is located at the first conducting layer, and is electrically connected to the first port;
the second feeding end is located at the first conducting layer, and is electrically connected to the second port;
the third feeding end is located at the second conducting layer, and is disposed opposite to the first feeding end, and the third feeding end is electrically connected to the second port;
the fourth feeding end is located at the second conducting layer, and is disposed opposite to the second feeding end, and the fourth feeding end is electrically connected to the first port; and
the first coil is electrically connected between the first feeding end and the third feeding end, and the second coil is electrically connected between the second feeding end and the fourth feeding end.

2. The communication tag of claim 1 , wherein:
the coil feeding circuit further comprises a first through hole and a second through hole;
the first through hole is electrically connected between the second feeding end on the first conducting layer and the third feeding end on the second conducting layer; and
the second through hole is electrically connected between the first feeding end on the first conducting layer and the fourth feeding end on the second conducting layer.

3. The communication tag of claim 2 , wherein:
the coil feeding circuit comprises a first line, the first line is located at the first conducting layer, and the first line is electrically connected between the first port and the first feeding end;
the coil feeding circuit further comprises a second line, the second line is located at the first conducting layer, and the second line is electrically connected between the second port and the second feeding end;
the coil feeding circuit further comprises a third line, the third line is located at the second conducting layer, the third line is disposed opposite to the first line, the third line is electrically connected between the first through hole and the third feeding end, and the third line and the second port are electrically connected to the second line by using the first through hole; and
the coil feeding circuit further comprises a fourth line, the fourth line is located at the second conducting layer, the fourth line is disposed opposite to the second line, the fourth line is electrically connected between the second through hole and the fourth feeding end, and the fourth line and the first port are electrically connected to the first line by using the second through hole.

4. The communication tag of claim 3 , wherein the third line and the fourth line are located on two sides of the chip, the first through hole is located on a first side of the chip close to the third line, and the second through hole is located on a second side of the chip close to the fourth line;
the first line comprises a first part, the first part of the first line is disposed opposite to the third line, the second line comprises a first part, and the first part of the second line is disposed opposite to the fourth line;
the first line further comprises a second part and a third part, an end of the second part of the first line is connected to the second through hole, and the third part of the first line is around the first through hole and is connected between the first part and the second part of the first line;
the second line further comprises a second part and a third part, an end of the second part of the second line is connected to the first through hole, and the third part of the second line is around the second through hole and is connected between the first part and the second part of the second line; and
a spacing between the second part of the first line and the second part of the second line is less than a preset spacing.

5. The communication tag of claim 4 , wherein the first port of the chip is located between the second part and the third part of the first line, and the second port of the chip is located between the second part and the third part of the second line.

6. The communication tag of claim 3 , wherein:
the first line and the second line are located on two sides of the chip, the first through hole is located on a first side of the chip close to the second line, and the second through hole is located on a second side of the chip close to the first line;
the third line comprises a first part, the first part of the third line is disposed opposite to the first line, the fourth line comprises a first part, and the first part of the fourth line is disposed opposite to the second line;
the third line further comprises a second part and a third part, an end of the second part of the third line is connected to the first through hole, the second part of the third line is disposed opposite to the first line or the second line, and the third part of the third line is around the second through hole and is connected between the first part and the second part of the third line; and
the fourth line further comprises a second part and a third part, an end of the second part of the fourth line is connected to the second through hole, the second part of the fourth line is disposed opposite to the first line or the second line, and the third part of the fourth line is around the first through hole and is connected between the first part and the second part of the fourth line.

7. The communication tag of claim 6 , wherein the first port of the chip is connected to an end of the first line, and the second port of the chip is connected to an end of the second line.

8. The communication tag of claim 1 , wherein the first conducting layer further comprises a fifth line electrically connected between the first feeding end and a first end of the first coil, the second conducting layer further comprises a sixth line electrically connected between the third feeding end and a second end of the first coil, and the fifth line is disposed opposite to the sixth line.

9. The communication tag of claim 1 , wherein the first conducting layer further comprises a seventh line electrically connected between the second feeding end and a first end of the second coil, the second conducting layer further comprises an eighth line electrically connected between the fourth feeding end and a second end of the second coil, and the seventh line is disposed opposite to the eighth line.

10. The communication tag of claim 1 , wherein the first coil and the second coil are disposed in an intersecting manner.

11. The communication tag of claim 10 , wherein the first coil is located on the first conducting layer, the second coil is located on the second conducting layer, and a part of projection of the first coil on the second conducting layer is located in an area enclosed by the second coil.

12. The communication tag of claim 1 , wherein:
the first coil is located

Assignees

• Huawei Tech Co Ltd

Inventors

• Shen Yunpeng
• Chu Jiahui
• Huang Tengfei
• Jiang Bo
• Chen Xuming
• Zhao Jing

Classifications

• G06K19/07779

  the inductive antenna being a coil · CPC title

• G06K19/0772

  Physical layout of the record carrier · CPC title

• G06K19/07784 Primary

  the inductive antenna consisting of a plurality of coils stacked on top of one another · CPC title

• G06K19/077 Primary

  Constructional details, e.g. mounting of circuits in the carrier · CPC title