Radiation detectors for scanning systems, and related scanning systems

Patent metadata

Field	Value
Publication number	US-12298451-B2
Application number	US-202318458033-A
Country	US
Kind code	B2
Filing date	Aug 29, 2023
Priority date	Jan 7, 2022
Publication date	May 13, 2025
Grant date	May 13, 2025

Abstract

A radiation scanning system comprises a radiation detection sub-assembly, and a routing sub-assembly coupled to the radiation detection sub-assembly. The radiation detection sub-assembly comprises a first substrate electrically connected to the radiation detection sub-assembly, and a second substrate electrically connected to the first substrate. The radiation scanning system further comprises one or more radiation shields between the first substrate and the second substrate, and one or more semiconductor dice electrically connected to the second substrate on a side of the second substrate opposite the first substrate. Related radiation detector arrays radiation scanning systems are also disclosed.

First claim

What is claimed is:

1. A radiation scanning system, comprising:
a radiation detection sub-assembly;
a routing sub-assembly, the routing sub-assembly comprising:
a first substrate in electrical communication with the radiation detection sub-assembly, wherein a portion of the first substrate at least partially defines a cavity; and
a second substrate in electrical communication with the first substrate;

at least one radiation shield disposed within the cavity defined by the portion of the first substrate; and
one or more semiconductor dice electrically connected to the second substrate on a side of the second substrate opposite the first substrate.

2. The radiation scanning system of claim 1 , wherein the portion of the first substrate at least partially defining the cavity includes a first protrusion and a second protrusion, respective sidewalls of the first protrusion and the second protrusion at least partially defining the cavity.

3. The radiation scanning system of claim 2 , wherein respective heights of the first protrusion and second protrusion are greater than a thickness of the at least one radiation shield.

4. The radiation scanning system of claim 2 , wherein the first protrusion and the second protrusion are around a periphery of the first substrate.

5. The radiation scanning system of claim 1 , wherein a surface of the second substrate facing the first substrate is spaced from a surface of the at least one radiation shield.

6. The radiation scanning system of claim 1 , wherein the one or more semiconductor dice are located within lateral boundaries defined by the at least one radiation shield.

7. The radiation scanning system of claim 1 , wherein the radiation detection sub-assembly comprises a photodiode diode coupled to a scintillator array.

8. The radiation scanning system of claim 1 , wherein the one or more semiconductor dice are disposed within one or more ASIC packages.

9. The radiation scanning system of claim 1 , wherein the one or more semiconductor dice each individually comprises a flip chip semiconductor die.

10. The radiation scanning system of claim 1 , wherein a totality of the one or more semiconductor dice are located within lateral boundaries defined by the at least one radiation shield.

11. The radiation scanning system of claim 1 , wherein a totality of the one or more semiconductor dice are located within lateral boundaries defined by respective side walls of a first protrusion and a second protrusion of the portion of the first substrate, wherein the respective side walls of the first protrusion and the second protrusion at least partially defining the cavity.

12. The radiation scanning system of claim 1 , wherein the at least one shield is located between the first substrate and the second substrate.

13. The radiation scanning system of claim 1 , wherein the at least one shield contacting the first substrate and separated from the second substrate.

14. The radiation scanning system of claim 13 , wherein the at least one shield contacting is separated from the second substrate by an air gap.

15. The radiation scanning system of claim 1 , wherein the at least one shield secured to the first substrate by an adhesive.

16. The radiation scanning system of claim 1 , comprising an electrical interconnect between the first substrate and the second substrate.

17. The radiation scanning system of claim 16 , wherein the electrical interconnect comprises first conductive structures in electrical communication with first substrate, second conductive structures in electrical communication with the second substrate, and bond pads, respective ones of the bonds pads in electrical communication with respective ones of the first conductive structures and in electrical communication with respective ones of the second conductive structures.

18. The radiation scanning system of claim 16 , wherein a material of the radiation shield comprises tungsten.

19. The radiation scanning system of claim 1 , wherein respective bond pads of the routing sub-assembly are secured to respective bond pads of radiation detection sub-assembly by electrically conductive adhesive.

20. The radiation scanning system of claim 1 , further comprising conductive structures routed around at least a portion of the perimeter of the cavity.

21. A radiation scanning system, comprising:
a radiation detection sub-assembly comprising:
a scintillator array; and
a photodiode array coupled to the scintillator array;

a routing sub-assembly comprising:
a first substrate electrically connected to the radiation detection sub-assembly, wherein a portion of the first substrate at least partially defines a cavity; and
a second substrate electrically connected to the first substrate;

at least one radiation shield disposed within the cavity defined by the portion of the first substrate; and
an electronics sub-assembly comprising:
one or more semiconductor dice coupled to the second substrate with conductive structures; and

a connector configured to electrically couple to a detector module.

Assignees

• Analogic Corp

Inventors

• Marsden Lane
• Luhta Randy

Classifications

• H10F39/8057

  Optical shielding · CPC title

• H10F39/1898

  Indirect radiation image sensors, e.g. using luminescent members · CPC title

• H10F39/1895

  of the hybrid type · CPC title

• H10F39/024

  of coatings or optical elements · CPC title

• H10F39/018 Primary

  of hybrid image sensors · CPC title