Hybrid glass plastic flow cell and fabrication methods

US12296333B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12296333-B2
Application numberUS-202218003284-A
CountryUS
Kind codeB2
Filing dateFeb 18, 2022
Priority dateFeb 22, 2021
Publication dateMay 13, 2025
Grant dateMay 13, 2025

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Provided herein include various examples of a method for manufacturing aspects of flow cell. The method may include performing chemical processes on a surface of the patterned wafer to prepare the surface of the patterned, singulating the wafer into individual dies, orienting each die on a temporary substrate, where the orienting creates spaces between each individual die, and molding a material over the spaces to create a hybrid wafer comprised of glass and molded material. The method may also include bonding two of the hybrid wafers together, forming a bonded wafer stack.

First claim

Opening claim text (preview).

What is claimed is: 1. A method comprising: for each patterned wafer of at least two patterned wafers: performing chemical processes on a surface of the patterned wafer to prepare the surface of the patterned wafer to add specific chemical functionality to the surface; singulating the wafer into individual dies, wherein each individual die comprises an active area of a given flow cell; orienting each die on a temporary substrate, wherein the orienting creates spaces between each individual die; and molding a material over the spaces such that a top surface of the molded material is contiguous with a portion of the top surface of each active area to create a hybrid wafer comprised of glass and molded material; and bonding a first hybrid wafer formed from a first patterned wafer of the at least two patterned wafers to a second hybrid wafer formed from a second patterned wafer of the at least two patterned wafers, wherein the bonding couples the top surface of the molded material of the first hybrid wafer to the top surface of the molded material of the second hybrid wafer, forming a bonded wafer stack. 2. The method of claim 1 , wherein the two or more patterned wafers are selected from the group consisting of: circular wafers and non-circular panels. 3. The method of claim 1 , wherein the two or more patterned wafers comprise glass. 4. The method of any of claim 1 , wherein the singulating comprises perforating the patterned wafer utilizing a technique selected from the group consisting of: laser dicing the patterned wafer, saw dicing the patterned wafer, and scribe and break processing the patterned wafer. 5. The method of claim 1 , wherein the orienting is accomplished by utilizing a pick and place process. 6. The method of claim 1 , wherein the bonding comprises utilizing a double-sided adhesive, wherein a thickness of the double sided adhesive creates a space between the top surface of the molded material of the first hybrid wafer and the top surface of the molded material of the second hybrid wafer, for a fluidic channel. 7. The method of claim 1 , further comprising: dicing the bonded wafer stack to form at least one flow cell. 8. The method of claim 1 , wherein molding the material over the spaces comprises overmolding the material on the temporary substrate and curing the material. 9. The method of claim 1 , wherein each flow cell of the at least one flow cell comprises between 1 to 6 active areas. 10. The method of claim 1 , wherein performing the chemical processes comprises: treating the surface of the patterned wafer; coating the surface of the patterned wafer with a hydrogel; and polishing the surface of the patterned wafer. 11. The method of claim 1 , wherein singulating the wafer into the individual dies comprises: singulating the wafer into an initial set of singulated dies; and singulating each die of the initial set of singulated dies into one or more pieces, wherein the one or more pieces of each die of the initial set of singulated dies comprise the individual dies.

Assignees

Inventors

Classifications

  • injection moulding of small-sized articles, e.g. microarticles, ultra thin articles · CPC title

  • the article consisting of a material with particular properties, e.g. porous, brittle · CPC title

  • Nanoscaled · CPC title

  • Measuring fluorescence of fluorescent products of reactions or of fluorochrome labelled reactive substances, e.g. measuring quenching effects, using measuring "optrodes" (in vivo A61B5/00; immunoassay G01N33/53) · CPC title

  • Specially adapted constructive features of fluorimeters · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US12296333B2 cover?
Provided herein include various examples of a method for manufacturing aspects of flow cell. The method may include performing chemical processes on a surface of the patterned wafer to prepare the surface of the patterned, singulating the wafer into individual dies, orienting each die on a temporary substrate, where the orienting creates spaces between each individual die, and molding a materia…
Who is the assignee on this patent?
Illumina Inc
What technology area does this patent fall under?
Primary CPC classification B01L3/502707. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 13 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).