Methods to reduce flashes on electrodes

Patent metadata

Field	Value
Publication number	US-12296162-B2
Application number	US-202017595169-A
Country	US
Kind code	B2
Filing date	May 7, 2020
Priority date	May 10, 2019
Publication date	May 13, 2025
Grant date	May 13, 2025

Abstract

A method for use in making an electrode assembly ( 20 ) comprises the steps of applying an electrode ( 24 ) on a first layer of material ( 22 ); laser welding a lead ( 23 ) to the electrode; applying an adhesive backfill ( 26 ) over the electrode and the lead; and applying a second layer of material ( 28 ) over the adhesive backfill and a portion of the first layer to prevent a leakage path between the electrode and the second layer.

First claim

What is claimed:

1. A method for use in making an implantable electrode assembly for neuromodulation, comprising:
forming a first layer of material including a hole formed therein;
positioning an electrode in the hole in the first layer of material;
connecting an electrical lead to the electrode;
applying a backfill material over the electrode, the electrical lead connection, and a portion of the first layer sufficient to seal any gap between the electrode and the hole; and
applying a second layer of material over the backfill material.

2. The method of claim 1 , wherein one or more of the first layer of material and the second layer of material is formed by a first-shot and a second-shot of a heated and pressurized polymer material.

3. The method of claim 1 , wherein the backfill material comprises adhesive silicone.

4. The method of claim 1 , further comprising, prior to connecting, applying a second backfill material between an edge of the electrode and the hole to hold the electrode in place for connecting.

5. The method of claim 4 , further comprising, prior to applying the backfill material, curing the second backfill material.

6. The method of claim 1 , further comprising, prior to applying the second layer of material, curing the backfill material.

7. The method of claim 1 , wherein the backfill material blocks any leakage path between the electrode and the second layer of material.

8. The method of claim 1 , wherein the first layer of material has a first hardness and the second layer of material has a second hardness, and wherein the first hardness and the second hardness are different.

9. The method of claim 1 , wherein the backfill is softer than the first layer and the second layer.

10. An electrode assembly for neuromodulation, comprising:
a first layer of material comprising an opening;
an electrode connectable to a lead provided at least partly in the opening;
a backfill provided over the electrode, the backfill covering an edge of the electrode; and
a second layer of material provided over the backfill and a portion of the first layer, wherein the backfill blocks any gap between the electrode and the first layer for reducing leakage path between a target contact surface of the electrode and the second layer.

11. The electrode assembly according to claim 10 , further wherein the backfill covers at least a part of an electrical connection between the electrode and the lead.

12. The electrode assembly of claim 10 , wherein the backfill comprises adhesive silicone.

13. The electrode assembly of claim 10 , wherein the backfill covers a peripheral edge of the electrode.

14. The electrode assembly of claim 10 , wherein the first layer of material, the backfill, and the second layer of material are formed from one or more of silicone, a polymer, and a biocompatible thermoplastic elastomer.

15. The electrode assembly of claim 10 , wherein the first layer of material and the second layer of material are the same.

16. The electrode assembly of claim 10 , wherein the first layer of material has a first hardness and the second layer of material has a second hardness, and wherein the first hardness and the second hardness are different.

17. The electrode assembly of claim 10 , further comprising a second adhesive backfill material applied to a second edge of the electrode and the opening.

18. The electrode assembly of claim 10 , further comprising multiple electrodes, wherein the electrodes are connected by a flexible interconnection lead.

19. The electrode assembly of claim 18 , wherein the backfill covers the flexible interconnection lead.

20. The electrode assembly of claim 19 , wherein the backfill is softer than the first layer and the second layer.

Assignees

• Galvani Bioelectronics Ltd
• Au Cindy

Inventors

• Au Cindy

Classifications

• B29L2031/753

  Medical equipment; Accessories therefor (bloodbags, medical bags B29L2031/7148; artificial eyes B29L2011/0008) · CPC title

• B29K2083/00

  Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material · CPC title

• B29C45/1671

  with an insert · CPC title

• B29C45/14344

  Moulding in or through a hole in the article, e.g. outsert moulding · CPC title

• B29C45/14639

  for obtaining an insulating effect, e.g. for electrical components · CPC title