Package comprising discrete antenna device

Patent metadata

Field	Value
Publication number	US-12293980-B2
Application number	US-202016870642-A
Country	US
Kind code	B2
Filing date	May 8, 2020
Priority date	Sep 20, 2019
Publication date	May 6, 2025
Grant date	May 6, 2025

Abstract

A package comprising a substrate, a first antenna device, and an integrated device. The substrate comprising a first surface and a second surface, where the substrate comprises a plurality of interconnects. The first antenna device is coupled to the first surface of the substrate, through a first plurality of solder interconnects. The integrated device is coupled to the second surface of the substrate. The package may include an encapsulation layer located over the second surface of the substrate, where the encapsulation layer encapsulates the integrated device. The package may include a shield formed over a surface of the encapsulation layer, where the shield includes an electromagnetic interference (EMI) shield.

First claim

What is claimed is:

1. An apparatus comprising:
a substrate comprising a first surface and a second surface, wherein the substrate comprises a plurality of interconnects;
first means for transmitting and receiving a first signal, coupled to the first surface of the substrate, through a first plurality of solder interconnects, wherein a portion of the first means for transmitting and receiving the first signal, overhangs over the substrate such that a portion of the first means for transmitting and receiving the first signal does not vertically overlap with any portion of the substrate;
second means for transmitting and receiving a second signal, coupled to the first surface of the substrate, through a second plurality of solder interconnects;
an integrated device coupled to the second surface of the substrate;
means for encapsulation coupled to the second surface of the substrate,
wherein a vertical surface of the means for encapsulation is coplanar with a vertical surface of the substrate, and
wherein the means for encapsulation encapsulates the integrated device; and

means for shielding coupled to a surface of the means for encapsulation, wherein the means for shielding is configured to provide electromagnetic interference (EMI) shielding.

2. The apparatus of claim 1 , wherein the means for encapsulation is coupled to the second surface of the substrate such that a second vertical surface of the means for encapsulation is coplanar with a second vertical surface of the substrate.

3. The apparatus of claim 1 ,
wherein the first means for transmitting and receiving the first signal, is configured to transmit and/or receive the first signal having a first frequency, and
wherein the second means for transmitting and receiving the second signal, is configured to transmit and/or receive the second signal having a second frequency.

4. The apparatus of claim 1 ,
wherein the first means for transmitting and receiving the first signal comprises:
a first plurality of pads configured to provide at least one electrical path for ground; and
a second plurality of pads configured to provide at least one electrical path for signals,
wherein the first plurality of pads laterally surround the second plurality of pads, and

wherein the first means for transmitting and receiving the first signal is coupled to the first surface of the substrate, through the first plurality of solder interconnects such that (i) a first group of solder interconnects from the first plurality of solder interconnects are coupled to the first plurality of pads and (ii) a second group of solder interconnects from the first plurality of solder interconnects are coupled to the second plurality of pads.

5. The apparatus of claim 1 , wherein the second means for transmitting and receiving the second signal is configured to operate as a dipole antenna.

6. The apparatus of claim 1 , wherein the second means for transmitting and receiving the second signal comprises:
at least one dielectric layer; and
at least one antenna device interconnect configured as an antenna.

7. The apparatus of claim 1 , wherein a portion of the second means for transmitting and receiving the second signal overhangs over the substrate such that the portion of the second means for transmitting and receiving the second signal does not vertically overlap with any portion of the substrate.

8. The apparatus of claim 1 ,
wherein the second means for transmitting and receiving the first signal comprises:
a first plurality of pads configured to provide at least one electrical path for ground; and
a second plurality of pads configured to provide at least one electrical path for signals,
wherein the first plurality of pads laterally surround the second plurality of pads, and

wherein the second means for transmitting and receiving the second signal is coupled to the first surface of the substrate, through the second plurality of solder interconnects such that (i) a first group of solder interconnects from the second plurality of solder interconnects are coupled to the first plurality of pads and (ii) a second group of solder interconnects from the second plurality of solder interconnects are coupled to the second plurality of pads.

9. The apparatus of claim 1 , further comprising a connector coupled to the second surface of the substrate.

10. The apparatus of claim 1 , wherein the integrated device is coupled to the second surface of the substrate through at least a third plurality of solder interconnects.

11. The apparatus of claim 1 , wherein the apparatus includes a device selected from a group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, and a device in an automotive vehicle.

12. The apparatus of claim 1 , wherein the means for shielding is formed over a surface of the means for encapsulation.

13. The apparatus of claim 12 ,
wherein the means for shielding is further formed over a side surface of the substrate, and
wherein a side portion of the first means for transmitting and receiving the first signal, is free of the means for shielding.

14. The apparatus of claim 1 , wherein the first means for transmitting and receiving the first signal, is coupled to the first surface of the substrate such that (i) a first portion of the first means for transmitting and receiving the first signal, overhangs over a first side the substrate, and (ii) a second portion of the first means for transmitting and receiving the first signal, overhangs over a second side the substrate.

15. The apparatus of claim 14 , wherein the first means for transmitting and receiving the first signal is configured to operate as a dipole antenna.

16. The apparatus of claim 1 , wherein the first means for transmitting and receiving the first signal comprises:
at least one dielectric layer; and
at least one antenna device interconnect configured as an antenna.

17. The apparatus of claim 16 , wherein the at least one dielectric layer comprises a low temperature co-fired ceramic (LTCC) or a high temperature co-fired ceramic (HTCC).

Assignees

• Qualcomm Inc

Inventors

• Yeon Jaehyun
• Hwang Suhyung
• Kim Chin-Kwan
• Kumar Rajneesh
• Jessie Darryl Sheldon

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W44/248

  for antennas · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W74/016

  using moulds · CPC title

• H10W70/685

  comprising multiple insulating layers · CPC title