Ceramic electronic component

Patent metadata

Field	Value
Publication number	US-12293875-B2
Application number	US-202318342046-A
Country	US
Kind code	B2
Filing date	Jun 27, 2023
Priority date	Jan 29, 2021
Publication date	May 6, 2025
Grant date	May 6, 2025

Abstract

A ceramic electronic component includes: a ceramic body having a first surface; an external electrode disposed at least on the first surface; an internal electrode disposed inside the ceramic body; and a connection conductor connected to the external electrode and extending through a surface or an interior of the ceramic body to electrically connect to the internal electrode. The external electrode includes an overhanging portion extending laterally from its portion connected to the connection conductor. At least a portion of the overhanging portion is a peeled portion peeled off from the ceramic body.

First claim

The invention claimed is:

1. A ceramic electronic component comprising:
a ceramic body having a first surface;
an external electrode disposed at least on the first surface;
an internal electrode disposed inside the ceramic body; and
a connection conductor connected to the external electrode and extending through a surface or an interior of the ceramic body to electrically connect to the internal electrode, wherein
the external electrode includes an overhanging portion extending laterally from a connecting portion of the external electrode connected to the connection conductor, and
at least a portion of the overhanging portion is a peeled portion peeled off from the ceramic body.

2. The ceramic electronic component according to claim 1 , wherein
the ceramic electronic component is mounted on another member through the external electrode.

3. The ceramic electronic component according to claim 2 , wherein
in the peeled portion, a plating film is sandwiched between the ceramic body and the overhanging portion.

4. The ceramic electronic component according to claim 2 , wherein
at least a portion of the external electrode is embedded in the first surface.

5. The ceramic electronic component according to claim 2 , wherein
a portion of the external electrode is covered with a protective film, and the peeled portion is not covered with the protective film.

6. The ceramic electronic component according to claim 1 , wherein
in the peeled portion, a plating film is sandwiched between the ceramic body and the overhanging portion.

7. The ceramic electronic component according to claim 6 , wherein
at least a portion of the external electrode is embedded in the first surface.

8. The ceramic electronic component according to claim 6 , wherein
a portion of the external electrode is covered with a protective film, and the peeled portion is not covered with the protective film.

9. The ceramic electronic component according to claim 1 , wherein
at least a portion of the external electrode is embedded in the first surface.

10. The ceramic electronic component according to claim 9 , wherein
a portion of the external electrode is covered with a protective film, and the peeled portion is not covered with the protective film.

11. The ceramic electronic component according to claim 1 , wherein
a portion of the external electrode is covered with a protective film, and the peeled portion is not covered with the protective film.

12. The ceramic electronic component according to claim 11 , wherein
the protective film comprises a ceramic material.

13. The ceramic electronic component according to claim 11 , wherein
an interface between the protective film and the ceramic body is coplanar with an interface between the external electrode and the ceramic body.

14. A ceramic electronic component comprising:
a ceramic body having a first surface;
a plurality of external electrodes disposed at least on the first surface;
an internal electrode disposed inside the ceramic body; and
a connection conductor connected to each of the plurality of external electrodes and extending through a surface or an interior of the ceramic body to electrically connect to the internal electrode, wherein
each of the plurality of external electrodes includes an overhanging portion extending laterally from a connecting portion of each of the plurality of external electrodes connected to the connection conductor,
the plurality of external electrodes include a first-type external electrode and a second-type external electrode,
in the first-type external electrode, at least a portion of the overhanging portion is a peeled portion peeled off from the ceramic body, and
in the second-type external electrode, an entire portion of the overhanging portion adheres to the ceramic body.

15. The ceramic electronic component according to claim 14 , wherein
the first-type external electrode is disposed at a position closer to a corner of the first surface than the second-type external electrode.

16. The ceramic electronic component according to claim 15 , wherein
the peeled portion of the first-type external electrode is provided at least on a side of the first-type external electrode closer to a corner of the first surface.

17. The ceramic electronic component according to claim 14 , wherein
the peeled portion of the first-type external electrode is provided at least on a side of the first-type external electrode closer to a corner of the first surface.

18. The ceramic electronic component according to claim 14 , wherein
a portion of the external electrode is covered with a protective film, and the peeled portion is not covered with the protective film.

19. The ceramic electronic component according to claim 18 , wherein
an interface between the protective film and the ceramic body is coplanar with an interface between the external electrode and the ceramic body.

Assignees

• Murata Manufacturing Co

Inventors

• Oie Hirofumi
• Sasaki Ai

Classifications

• H01G4/1209

  characterised by the ceramic dielectric material (H01G4/1272, H01G4/1281 take precedence) · CPC title

• H01G4/008

  Selection of materials · CPC title

• H01G2/12

  Protection against corrosion (H01G2/10 takes precedence) · CPC title

• H01G4/224

  Housing; Encapsulation · CPC title

• H01G4/012 Primary

  Form of non-self-supporting electrodes · CPC title