Connection apparatus, manufacturing method for connection device, and thermal management component

Patent metadata

Field	Value
Publication number	US-12291079-B2
Application number	US-202118268231-A
Country	US
Kind code	B2
Filing date	Dec 22, 2021
Priority date	Dec 23, 2020
Publication date	May 6, 2025
Grant date	May 6, 2025

Abstract

A connection apparatus, a manufacturing method of the connection apparatus, and a thermal management component are provided. The connection apparatus includes two or more plate bodies; the adjacent plate bodies are fixed and connected in a sealed manner; the connection apparatus is provided with a channel; at least one channel part is arranged in at least one of the adjacent plate bodies; the adjacent plate bodies define a channel at the channel part. One of the side walls of at least one plate body is provided with a mounting portion and/or a connecting portion along the axial direction or radial direction of the connection apparatus; the mounting portion is internally provided with a mounting hole for communication with the channel; the connecting portion is provided with a connecting hole.

First claim

The invention claimed is:

1. A communication device, applicable to a thermal management assembly, wherein
the communication device comprises two or more plate bodies, adjacent plate bodies of the plate bodies are secured to each other and connected in a sealed manner, the communication device is provided with a channel, at least one channel portion is provided inside at least one of the adjacent plate bodies of the plate bodies, and at least part of the channel is formed at the channel portion by the adjacent plate bodies; wherein
in an axial direction or a radial direction of the communication device, one of side walls of at least one of the plate bodies is provided with at least one mounting portion and/or at least one communication portion, the mounting portion is provided with a mounting hole, the thermal management assembly comprises a valve device for controlling a flow rate or blocking/unblocking of the channel, the mounting hole is configured to accommodate at least part of the valve device, the channel is in communication with the mounting hole of the at least one mounting portion; and wherein
the communication portion is provided with a communication hole, the thermal management assembly further comprises at least one thermal management unit, the communication hole is configured to be in communication with one of an inlet or an outlet of the at least one thermal management unit, and the channel is in communication with the at least one communication hole.

2. The communication device according to claim 1 , wherein the communication device comprises two plate bodies, one of the two plate bodies is defined as a first plate body and a plate body adjacent to the first plate body is defined as a second plate body, the first plate body and the second plate body are arranged adjacent to each other, the first plate body and the second plate body are each provided with the channel portion embodied as a sunken groove, the first plate body and the second plate body are secured to each other and connected in a sealed manner; the two sunken grooves are in communication with each other to form the channel, or the two sunken grooves together with walls respectively facing the two sunken grooves form the channel; the adjacent plate bodies are secured by welding, before the welding, a joint surface of one of the adjacent plate bodies is coated with a composite welding layer, or a solder layer is arranged between the adjacent plate bodies.

3. The communication device according to claim 2 , wherein the mounting portion comprises a first mounting portion, the communication portion comprises a first communication portion, the first mounting portion and the first communication portion each is arranged in the axial direction of the communication device, the first mounting portion and the first communication portion each protrudes from the plate bodies located at two ends of the communication device; and
the mounting hole comprises a first mounting hole, the first communication portion comprises a first communication hole, the first mounting hole and the first communication hole each is formed in the plate bodies in the axial direction and in communication with the channel; at least part of the valve device is inserted in the first mounting hole, and the inlet or the outlet of the at least one of the thermal management unit is in communication with the first communication hole; the valve device comprises at least one of a throttling element, an electromagnetic valve and a switching valve, and the thermal management unit comprises at least one of a heat exchange portion and a reservoir.

4. The communication device according to claim 2 , wherein the mounting portion further comprises a second mounting portion, the communication portion comprises a second communication portion, the second mounting portion and the second communication portion each is arranged in an extension direction of the communication device, the extension direction of the communication device is perpendicular to the axial direction of the communication device, the second mounting portion and the second communication portion each protrudes from the plate bodies located at two ends of the communication device; and
the mounting hole comprises a second mounting hole, the second communication portion is provided with a second communication hole, the second mounting hole and the second communication hole each extends in a direction parallel to the extension direction of the connection device, the second mounting hole and the second communication hole each is formed in side walls of the adjacent plate bodies and each is in communication with the channel; at least part of the valve device is inserted into the second mounting hole, and the inlet or outlet of the at least one of the thermal management unit is in communication with the second communication hole; the valve device comprises at least one of a throttling element, an electromagnetic valve and a switching valve, and the thermal management unit comprises at least one of a heat exchange portion and a reservoir.

5. A method for manufacturing the communication device according to claim 2 , comprising:
S1, providing two or more blank plates, wherein in the axial direction or the radial direction of the communication device, one of side walls of at least one of the blank plates is provided with the mounting portion and/or the communication portion; and processing a channel portion in at least one of adjacent blank plates to obtain the plate body having the channel portion;
S2, stacking the adjacent plate bodies in sequence, and securing the adjacent plate bodies to each other and connecting the adjacent plate bodies in a sealed manner, wherein the channel is formed at the channel portion by the adjacent plate bodies; and
S3, after connection in the sealed manner, processing the mounting hole in the mounting portion of the plate bodies and/or processing the communication hole in the communication portion.

6. The communication device according to claim 1 , wherein the communication device comprises three plate bodies, one of the three plate bodies is defined as a first plate body, another one of the plate bodies adjacent to the first plate body is defined as a second plate body, and yet another one of the plate bodies adjacent to the second plate body is defined as a third plate body; at least part of the second plate body is located between the first plate body and the third plate body, one side of the second plate body is secured to and connected in a sealed manner to the first plate body, another side of the second plate body is secured to and connected in a sealed manner to the third plate body, the channel portion of the second plate body is a through groove, the channel portion of the first plate body and the channel portion of the third plate body each is a sunken groove, the adjacent plate bodies are secured by welding, and before the welding, a joint surface of the second plate body with the first plate body and another joint surface of the second plate body with the third plate body each is coated with a composite welding layer.

7. The communication device according to claim 6 , wherein the mounting portion comprises a first mounting portion, the communication portion comprises a first communication portion, the first mounting portion and the first communication portion each is arranged in the axial direction of the communication device, the first mounting portion and the first communication portion each protrudes from the plate bodies located at two ends of the communication device; and
the mounting hole comprises a first mounting hole, the first communication portion comprises a first communication hole, the first mounting hole and the first communication hole each is formed in the p

Assignees

• Zhejiang Sanhua Automotive Components Co Ltd

Inventors

• Ye Keli
• Wu Linzhong

Classifications

• B60H1/00342 Primary

  of the liquid-liquid type · CPC title

• B60H1/00485 Primary

  Valves for air-conditioning devices, e.g. thermostatic valves · CPC title

• F28F9/18

  by welding · CPC title

• B60H1/3229

  characterised by constructional features, e.g. housings, mountings, conversion systems (B60H1/3227, B60H1/3233 take precedence) · CPC title

• F25B2500/18

  Optimization, e.g. high integration of refrigeration components · CPC title