Quasi global cathode contact method for advanced patterning

Patent metadata

Field	Value
Publication number	US-12289945-B2
Application number	US-202217653329-A
Country	US
Kind code	B2
Filing date	Mar 3, 2022
Priority date	Dec 3, 2021
Publication date	Apr 29, 2025
Grant date	Apr 29, 2025

Abstract

Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The sub-pixel circuit includes a plurality of contact overhangs. The plurality of contact overhangs are disposed between adjacent sub-pixels of a sub-pixel circuit to be formed. The contact overhangs are formed over a metal grid exposed through a PDL structure. A cathode is deposited via evaporation deposition to be in contact with the contact overhang. The metal grid is perpendicular to a plurality of metal layers disposed on the substrate.

First claim

What is claimed is:

1. A method of forming a sub-circuit, comprising:
depositing an organic light-emitting diode (OLED) material over a substrate, the substrate comprising:
a metal grid disposed on an anode defining layer (ADL), the ADL exposing anodes disposed over the substrate, wherein adjacent ADLs define a plurality of sub-pixels of the sub-circuit;
pixel-defining layer (PDL) structures disposed over the ADL, wherein adjacent PDL structures further define the plurality of sub-pixels of the sub-circuit;
inorganic overhang structures disposed over the metal grid; and
at least one contact overhang disposed on a respective assistant cathode line of the metal grid, the at least one contact overhang disposed between two sub-pixels of the plurality of sub-pixels,
wherein depositing the OLED material comprises evaporation deposition of the OLED material over the substrate such that the OLED material is disposed over and in contact with the anodes; and

depositing a cathode using evaporation deposition after the OLED material is deposited, wherein the cathode contacts the at least one contact overhang, wherein the at least one contact overhang is disposed in exposed portions of the PDL structures to expose the metal grid.

2. The method of claim 1 , wherein the at least one contact overhang defines an angle of evaporation deposition of the cathode such that the cathode extends under an overhang of the at least one contact overhang to contact at least a stem portion of the at least one contact overhang.

3. The method of claim 1 , wherein the cathode in the sub-pixels only contacts the OLED material and the PDL structures.

4. The method of claim 1 , further comprising depositing an encapsulation layer over the cathode, the at least one contact overhang, and the inorganic overhang structures, wherein the encapsulation layer further defines the plurality of sub-pixels of the sub-circuit.

5. The method of claim 4 , wherein the encapsulation layer contacts a structure stem portion and a structure bottom surface of the inorganic overhang structures.

6. The method of claim 5 , further comprising:
forming an intermediate layer over the at least one contact overhang and the encapsulation layer; and
forming a global passivation layer over the intermediate layer via an inkjet process, wherein the global passivation layer comprises an acrylic material.

7. The method of claim 1 , further comprising:
activating the sub-circuit by providing a current to the metal grid, the current flowing to the at least one contact overhang disposed on the respective assistant cathode line of the metal grid and to the cathode contacting the at least one contact overhang, the current flowing from the cathode to the OLED material.

8. A method of forming a sub-circuit, comprising:
depositing an organic light-emitting diode (OLED) material over a substrate, the substrate comprising:
a metal grid disposed on an anode defining layer (ADL), the ADL exposing anodes disposed over the substrate;
pixel-defining layer (PDL) structures disposed over the ADL, wherein adjacent PDL structures define a plurality of sub-pixels of the sub-circuit; and
at least one contact overhang disposed on a respective assistant cathode line of the metal grid, the at least one contact overhang disposed between two sub-pixels of the plurality of sub-pixels,
wherein depositing the OLED material comprises evaporation deposition of the OLED material over the substrate such that the OLED material is disposed over and in contact with the anodes; and

depositing a cathode using evaporation deposition after the OLED material is deposited, wherein the cathode contacts the at least one contact overhang and the cathode in the sub-pixels only contacts the OLED material and the PDL structures.

9. The method of claim 8 , wherein the at least one contact overhang defines an angle of evaporation deposition of the cathode such that the cathode extends under an overhang of the at least one contact overhang to contact at least a stem portion of the at least one contact overhang.

10. The method of claim 8 , further comprising forming the at least one contact overhang in an exposed portion of the PDL structures.

11. The method of claim 8 , further comprising:
activating the sub-circuit by providing a current to the metal grid, the current flowing to the at least one contact overhang disposed on the respective assistant cathode line of the metal grid and to the cathode contacting the at least one contact overhang, the current flowing from the cathode to the OLED material.

12. A method of forming a device, comprising:
depositing an organic light emitting diode (OLED) material over a substrate, the substrate comprising:
a plurality of metal layers disposed over the substrate and an anode-defining layer (ADL) disposed over the plurality of metal layers and the substrate, the ADL defining anodes of the device;
pixel-defining layer (PDL) structures, disposed over the ADL and a metal grid disposed over the ADL, adjacent PDL structures defining sub-pixels of the device;
at least one contact overhang disposed on a respective cathode line of the metal grid, the at least one contact overhang disposed between two sub-pixels of the sub-pixels of the device; and
a plurality of sub-circuits, each sub-circuit, comprising:
the metal grid disposed on the ADL;
inorganic overhang structures disposed on the metal grid;
a first plurality of sub-pixels, each sub-pixel of the first plurality of sub-pixels comprising:
an anode defined by the ADL,

wherein depositing the OLED material comprises evaporation deposition of the OLED material over the substrate such that the OLED material is disposed over and in contact with the anodes; and

depositing a cathode using evaporation deposition after the OLED material is deposited, wherein the cathode contacts the at least one contact overhang and the cathode in the sub-pixels only contacts the OLED material and the PDL structures.

13. The method of claim 12 , wherein the at least one contact overhang defines an angle of evaporation deposition of the cathode such that the cathode extends under an overhang of the at least one contact overhang to contact at least a stem portion of the at least one contact overhang.

14. The method of claim 12 , further comprising depositing an encapsulation layer over the cathode, the at least one contact overhang, and the inorganic overhang structures, wherein the encapsulation layer further defines the first plurality of sub-pixels of the sub-circuit.

15. The method of claim 14 , wherein the encapsulation layer contacts a structure stem portion and a structure bottom surface of the inorganic overhang structures.

16. The method of claim 12 , wherein the cathode contacts at least a stem portion of the at least one contact overhang.

17. The method of claim 12 , wherein the at least one contact overhang has a contact overhang ratio defined as a ratio of an overhang height to an overhang depth, wherein the contact overhang ratio is about 1.0:1.0 to about 1.0:1.5.

18. The method of claim 12 , wherein the plurality of metal layers are perpendicular to the metal grid.

19. A method of forming a sub-circuit, comprising:
depositing an organic light-emitting diode (OLED) material over a substrate, the substrate comprising:
a metal grid disposed on an anode defining layer (ADL), the ADL exposing anodes disposed over the substrate;
inorganic overhang structures disposed over the metal grid, wherein adjacent ADLs define a plurality of sub-pixels of the su

Assignees

• Applied Materials Inc

Inventors

• Lee Jungmin
• Lin Yu Hsin
• Chen Chung-Chia
• Choung Ji-Young
• Haas Dieter
• Kim Si Kyoung

Classifications

• H10K59/873

  Encapsulations · CPC title

• H10K71/00

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• H10K50/822 Primary

  characterised by their shape · CPC title

• H10K59/122 Primary

  Pixel-defining structures or layers, e.g. banks · CPC title

• H10K71/164

  using vacuum deposition · CPC title