Electronic device comprisng a micro-lens and photodiode array with amorphic n-type and p-type layers

Patent metadata

Field	Value
Publication number	US-12289926-B2
Application number	US-202117410410-A
Country	US
Kind code	B2
Filing date	Aug 24, 2021
Priority date	Sep 29, 2020
Publication date	Apr 29, 2025
Grant date	Apr 29, 2025

Abstract

An electronic device is provided. The electronic device includes an optical sensing module that includes an optical sensor array. The optical sensor array includes at least one optical sensor, at least one transparent layer disposed on the optical sensor array, and a microlens array. The microlens array includes at least one microlens and is disposed on the transparent layer.

First claim

What is claimed is:

1. An electronic device, comprising:
an optical sensing module, comprising:
an optical sensor array comprising a plurality of optical sensors;
at least one transparent layer disposed on the optical sensor array;
a microlens array comprising at least one microlens and disposed on the transparent layer; and
at least one light shielding layer with an opening disposed between the optical sensor array and the microlens array, wherein the light shielding layer and the transparent layer are stacked on each other,
wherein a configuration of the optical sensing module conforms to a formula n2/n1=F/(F−R), in which n1 is a refractive index of air or a material at a periphery of the microlens, n2 is a refractive index of the microlens, F is a distance between a top of the microlens and the optical sensor, and R is a radius of curvature of the microlens,
wherein one of the plurality of the optical sensors corresponds to a plurality of microlenses in one-to-many correspondence,
wherein, in a cross-sectional view, the microlens has a maximum width, and an overlapping range between the microlens and the light shielding layer is greater than or equal to 50% of the maximum width and is less than or equal to 85% of the maximum width in a normal direction of the light shielding layer.

2. The electronic device as claimed in claim 1 , wherein the optical sensor comprises a photodiode, a photo thin-film transistor, or a metal-semiconductor-metal sensing device.

3. The electronic device as claimed in claim 2 , wherein the photodiode comprises:
a thin-film transistor layer disposed on a substrate;
an N-type amorphous layer disposed on the thin-film transistor layer and electrically connected to the thin-film transistor layer;
an intrinsic amorphous silicon disposed on the N-type amorphous layer;
a P-type amorphous layer disposed on the intrinsic amorphous silicon layer; and
a conductive layer electrically connected to the P-type amorphous layer.

4. The electronic device as claimed in claim 2 , wherein the photo thin-film transistor comprises:
a gate metal layer disposed on a substrate;
a gate insulating layer disposed on the gate metal layer;
an intrinsic amorphous layer disposed on the gate insulating layer;
a N-type amorphous layer disposed on the intrinsic amorphous layer; and
a patterned source/drain metal layer disposed on the N-type amorphous layer.

5. The electronic device as claimed in claim 2 , wherein the metal-semiconductor-metal sensor comprises:
a thin-film transistor layer disposed on a substrate;
a photosensitive semiconductor layer disposed on the thin-film transistor; and
a patterned metal layer disposed on the photosensitive semiconductor.

6. The electronic device as claimed in claim 1 , wherein the transparent layer filters an incident light with a wavelength lower than 400 nm or higher than 700 nm.

7. The electronic device as claimed in claim 1 , wherein the transparent layer is a multi-layer transparent layer.

8. The electronic device as claimed in claim 1 , wherein the transparent layer comprises:
a first transparent layer and a second transparent layer disposed on the first transparent layer; and
a thickness of the second transparent layer is greater than a thickness of the first transparent layer.

9. The electronic device as claimed in claim 1 , further comprising at least one filter layer disposed between the optical sensor array and the microlens array, wherein the filter layer comprises multilayer films that have different refractive indices and are stacked on each other.

10. The electronic device as claimed in claim 9 , wherein the filter layer filters an incident light with a wavelength lower than 400 nm or higher than 700 nm.

11. The electronic device as claimed in claim 1 , wherein the light shielding layer comprises a metal layer.

12. The electronic device as claimed in claim 1 , wherein the light shielding layer further comprises at least one photoresist layer, disposed on the metal layer.

13. The electronic device as claimed in claim 1 , wherein the light shielding layer comprises:
a first light shielding layer, a second light shielding layer disposed on the first light shielding layer, and a third light shielding layer disposed on the second light shielding layer;
the first light shielding layer has at least one first opening, the second light shielding layer has at least one second opening, and the third light shielding layer has at least one third opening; and
a width of the third opening of the third light shielding layer is larger than a width of the second opening, and the width of the second opening of the second light shielding layer is larger than a width of the first opening of the first light shielding layer.

14. The electronic device as claimed in claim 1 , wherein a material of the light shielding layer comprises black photoresist.

15. The electronic device as claimed in claim 1 , wherein a distance between the top of top of the microlens and the optical sensor equals to three times of the radius of curvature of the microlens.

16. The electronic device as claimed in claim 1 , wherein a retractive index of each of the microlens and the transparent layer is between 1.3 and 1.9.

17. An electronic device, comprising:
an optical sensing module, comprising:
an optical sensor array comprising a plurality of optical sensors;
at least one transparent layer disposed on the optical sensor array;
a microlens array comprising at least one microlens, disposed on the transparent layer; and
at least one light shielding layer with an opening disposed between the optical sensor array and the microlens array, wherein the light shielding layer and the transparent layer are stacked on each other,
wherein a configuration of the optical sensing module conforms to a formula n2/n1=F/(F−R), in which n1 is a refractive index of air or a material at a periphery of the microlens, n2 is a refractive index of the microlens, F is a distance between a top of the microlens and the optical sensor, and R is a radius of curvature of the microlens,
wherein one of the plurality of the optical sensors corresponds to a plurality of microlenses in one-to-many correspondence,
wherein, in a cross-sectional view, the microlens has a maximum width, and an overlapping range between the microlens and the light shielding layer is greater than or equal to 50% of the maximum width, and is less than or equal to 85% of the maximum width in a normal direction of the light shielding layer; and
a display module disposed on the optical sensing module.

Assignees

• Innolux Corp

Inventors

• Liu Yu-Tsung
• Liao Wei-Ju
• Lin Po-Hsin
• Lin Chao-Yin
• Lee Te-Yu

Classifications

• H10F39/802

  Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes · CPC title

• H10F39/024

  of coatings or optical elements · CPC title

• H10F39/198

  Contact-type image sensors [CIS] · CPC title

• H10F39/8057

  Optical shielding · CPC title

• H10K59/40

  OLEDs integrated with touch screens · CPC title