Three dimensional circuit module and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-12289833-B2
Application number	US-202218078238-A
Country	US
Kind code	B2
Filing date	Dec 9, 2022
Priority date	Dec 21, 2021
Publication date	Apr 29, 2025
Grant date	Apr 29, 2025

Abstract

A three dimensional circuit module can include: a plurality of PCBs located on different faces, where surfaces of the PCBs include circuit modules; a plurality of circuit assemblies connected through components; where the plurality of circuit assemblies comprises at least one first circuit assembly having a first main board and at least one first side board that are located on different faces, where the first main board and at least one first side board of the first circuit assembly are obtained by integrated curing molding process; and where the first main board of the first circuit assembly is located on one PCB board, and the first side board is located on an adjacent PCB board, in order to realize connection of adjacent PCBs.

First claim

What is claimed is:

1. A three dimensional circuit module, comprising:
a) a plurality of printed-circuit boards (PCBs) located on different faces, wherein surfaces of the plurality of PCBs comprises circuit modules;
b) a plurality of circuit assemblies connected through components;
c) wherein the plurality of circuit assemblies comprises at least one first circuit assembly having a first main board and at least one first side board that are located on different faces, wherein the first main board and at least one first side board of the first circuit assembly are obtained by integrated curing molding process; and
d) wherein the first main board of the first circuit assembly is located on one PCB board, and the first side board is located on an adjacent PCB board, in order to realize connection of adjacent PCBs.

2. The three dimensional circuit module of claim 1 , wherein when the PCB board is a multilayer board, the first circuit assembly is connected to one layer of the adjacent multilayer board, and at least one remaining layer of the multilayer board is electrically connected to the first circuit assembly through conductive holes.

3. The three dimensional circuit module of claim 1 , wherein the plurality of circuit assemblies further comprises at least one second circuit assembly having a second main board.

4. The three dimensional circuit module of claim 1 , wherein a bending area between the first main board and the at least one first side board of the first circuit assembly comprises at least one of an arc structure and a corner structure.

5. The three dimensional circuit module of claim 1 , wherein at least one of the plurality of circuit assemblies is configured to be a single layer board or a multilayer board.

6. The three dimensional circuit module of claim 1 , wherein the plurality of circuit assemblies further comprises at least one third circuit assembly having at least two third main boards located at different layers and intermediate connectors connecting the at least two third main boards, and wherein at least two third main boards and intermediate connectors of the third circuit assembly are obtained by integrated curing molding process.

7. The three dimensional circuit module of claim 6 , wherein a bending area between at least two third main boards and the intermediate connector of the third circuit assembly comprises at least one of an arc structure and a corner structure.

8. The three dimensional circuit module of claim 1 , further comprising a dielectric structure filled between at least two adjacent circuit assemblies.

9. The three dimensional circuit module of claim 8 , wherein the dielectric structure comprises at least one of a magnetic core and an insulating layer.

10. The three dimensional circuit module of claim 1 , wherein the material of the plurality of circuit assemblies comprises at least one of metal material, magnetic material, and insulating material.

Assignees

• Silergy Semiconductor Technology Hangzhou Ltd

Inventors

• Fan Gao
• Zhao Chen

Classifications

• H05K2201/08

  Magnetic details · CPC title

• H05K2201/047

  Box-like arrangements of PCBs · CPC title

• H05K3/0014

  Shaping of the substrate, e.g. by moulding · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title